Abstract: A present handle assembly is mounted to a handle shaft of a fishing reel. The handle assembly includes a handle arm and a handle knob. The handle arm is mounted to the handle shaft. The handle knob is mounted to the handle arm. The handle arm herein includes an arm body made of metal and a resin portion. The metallic arm body has a mount part and an arm part. The mount part is mounted to the handle shaft. The arm part is integrally formed with the mount part. The resin portion covers the mount part and at least a part of the arm part.

Abstract: The present invention discloses a method of preparing a lead-free piezoelectric thin film comprising the steps of: providing a precursor solution comprising at least one alkali metal ion, a polyamino carboxylic acid, and an amine; depositing the precursor solution on a substrate to form a film; and annealing the film. The present invention also provides a lead-free piezoelectric thin film prepared according to the method, a precursor solution for use in the method and a method of preparing the precursor solution.

Abstract: A present handle assembly is mounted to a handle shaft of a fishing reel. The handle assembly includes a handle arm and a handle knob. The handle arm is mounted to the handle shaft. The handle knob is mounted to the handle arm. The handle arm herein includes an arm body made of metal and a resin portion. The metallic arm body has a mount part and an arm part. The mount part is mounted to the handle shaft. The arm part is integrally formed with the mount part. The resin portion covers the mount part and at least a part of the arm part.

Abstract: The present invention discloses a method of preparing a lead-free piezoelectric thin film comprising the steps of: providing a precursor solution comprising at least one alkali metal ion, a polyamino carboxylic acid, and an amine; depositing the precursor solution on a substrate to form a film; and annealing the film. The present invention also provides a lead-free piezoelectric thin film prepared according to the method, a precursor solution for use in the method and a method of preparing the precursor solution.

Abstract: The present invention discloses a method of preparing a lead-free piezoelectric thin film comprising the steps of: providing a precursor solution comprising at least one alkali metal ion, a polyamine carboxylic acid, and an amine; depositing the precursor solution on a substrate to form a film; and annealing the film. The present invention also provides a lead-free piezoelectric thin film prepared according to the method, a precursor solution for use in the method and a method of preparing the precursor solution.

Abstract: A method and apparatus of packaging a semiconductor device with a clip is disclosed. The clip defines a first contact region and a second contact region on a same face of the at least one clip. The chip defines a first face, and a second face opposite to the first face, the first contact region being attached to the first face of the chip and the second contact region being located within a same plane with the second face of the clip.

Abstract: A method and apparatus of packaging a semiconductor device with a clip is disclosed. The clip defines a first contact region and a second contact region on a same face of the at least one clip. The chip defines a first face, and a second face opposite to the first face, the first contact region being attached to the first face of the chip and the second contact region being located within a same plane with the second face of the clip.

Abstract: A method and apparatus of packaging a semiconductor device with a clip is disclosed. The clip defines a first contact region and a second contact region on a same face of the at least one clip. The chip defines a first face, and a second face opposite to the first face, the first contact region being attached to the first face of the chip and the second contact region being located within a same plane with the second face of the clip.

Abstract: The present invention discloses a method of preparing a lead-free piezoelectric thin film comprising the steps of: providing a precursor solution comprising at least one alkali metal ion, a polyamine carboxylic acid, and an amine; depositing the precursor solution on a substrate to form a film; and annealing the film. The present invention also provides a lead-free piezoelectric thin film prepared according to the method, a precursor solution for use in the method and a method of preparing the precursor solution.

Abstract: An electronic component includes a number of leads and at least one cooling element. The bottom surface of the cooling element is exposed and the material of the cooling element is different from the material of the leads. At least one semiconductor chip is provided on the cooling element. An encapsulation compound covers at least part of the leads, at least part of the semiconductor chip(s), and at least part of the cooling element(s).

Abstract: A method and apparatus of packaging a semiconductor device with a clip is disclosed. The clip defines a first contact region and a second contact region on a same face of the at least one clip. The chip defines a first face, and a second face opposite to the first face, the first contact region being attached to the first face of the chip and the second contact region being located within a same plane with the second face of the clip.

Abstract: An electronic component includes a number of leads and at least one cooling element. The bottom surface of the cooling element is exposed and the material of the cooling element is different from the material of the leads. At least one semiconductor chip is provided on the cooling element. An encapsulation compound covers at least part of the leads, at least part of the semiconductor chip(s), and at least part of the cooling element(s).

Abstract: A drag mechanism includes a first drag unit, a second drag unit and a switching mechanism. The first drag unit brakes a spool shaft of a spool. The first drag unit includes a first drag knob that is immovable in a back and forth direction and rotatably mounted on an outer peripheral surface of a cylindrical portion. The second drag unit brakes the spool shaft in a position frontward of the first drag unit. The second drag unit includes a second drag knob that is immovable in a back and forth direction and rotatably mounted on an outer peripheral surface of the cylindrical portion. The switching mechanism switches the first drag unit between a drag enabling state and a drag disabling state.

Abstract: A drag mechanism includes a first drag unit, a second drag unit and a switching mechanism. The first drag unit brakes a spool shaft of a spool. The first drag unit includes a first drag knob that is immovable in a back and forth direction and rotatably mounted on an outer peripheral surface of a cylindrical portion. The second drag unit brakes the spool shaft in a position frontward of the first drag unit. The second drag unit includes a second drag knob that is immovable in a back and forth direction and rotatably mounted on an outer peripheral surface of the cylindrical portion. The switching mechanism switches the first drag unit between a drag enabling state and a drag disabling state.

Abstract: The present invention relates to the stabilization of segmented polyurethanes by the addition of a combination of antioxidants, benzofuranones and or sterically hindered amines and a hydrazine or hydrazide.