Patents by Inventor Chin Goh
Chin Goh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9826724Abstract: A present handle assembly is mounted to a handle shaft of a fishing reel. The handle assembly includes a handle arm and a handle knob. The handle arm is mounted to the handle shaft. The handle knob is mounted to the handle arm. The handle arm herein includes an arm body made of metal and a resin portion. The metallic arm body has a mount part and an arm part. The mount part is mounted to the handle shaft. The arm part is integrally formed with the mount part. The resin portion covers the mount part and at least a part of the arm part.Type: GrantFiled: August 26, 2015Date of Patent: November 28, 2017Assignee: SHIMANO COMPONENTS (MALAYSIA) SDN.Inventors: Miang Chin Goh, Wen Yin Lee, Hwee Yun Loh
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Patent number: 9450175Abstract: The present invention discloses a method of preparing a lead-free piezoelectric thin film comprising the steps of: providing a precursor solution comprising at least one alkali metal ion, a polyamino carboxylic acid, and an amine; depositing the precursor solution on a substrate to form a film; and annealing the film. The present invention also provides a lead-free piezoelectric thin film prepared according to the method, a precursor solution for use in the method and a method of preparing the precursor solution.Type: GrantFiled: January 22, 2015Date of Patent: September 20, 2016Assignee: Agency for Science, Technology and ResearchInventors: Phoi Chin Goh, Kui Yao
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Publication number: 20160088823Abstract: A present handle assembly is mounted to a handle shaft of a fishing reel. The handle assembly includes a handle arm and a handle knob. The handle arm is mounted to the handle shaft. The handle knob is mounted to the handle arm. The handle arm herein includes an arm body made of metal and a resin portion. The metallic arm body has a mount part and an arm part. The mount part is mounted to the handle shaft. The arm part is integrally formed with the mount part. The resin portion covers the mount part and at least a part of the arm part.Type: ApplicationFiled: August 26, 2015Publication date: March 31, 2016Inventors: Miang Chin GOH, Wen Yin LEE, Hwee Yun LOH
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Publication number: 20150132475Abstract: The present invention discloses a method of preparing a lead-free piezoelectric thin film comprising the steps of: providing a precursor solution comprising at least one alkali metal ion, a polyamino carboxylic acid, and an amine; depositing the precursor solution on a substrate to form a film; and annealing the film. The present invention also provides a lead-free piezoelectric thin film prepared according to the method, a precursor solution for use in the method and a method of preparing the precursor solution.Type: ApplicationFiled: January 22, 2015Publication date: May 14, 2015Applicant: Agency for Science, Technology and ResearchInventors: Phoi Chin GOH, Kui Yao
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Patent number: 8961679Abstract: The present invention discloses a method of preparing a lead-free piezoelectric thin film comprising the steps of: providing a precursor solution comprising at least one alkali metal ion, a polyamine carboxylic acid, and an amine; depositing the precursor solution on a substrate to form a film; and annealing the film. The present invention also provides a lead-free piezoelectric thin film prepared according to the method, a precursor solution for use in the method and a method of preparing the precursor solution.Type: GrantFiled: May 20, 2011Date of Patent: February 24, 2015Assignee: Agency for Science, Technology and ResearchInventors: Phoi Chin Goh, Kui Yao
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Patent number: 8637977Abstract: A method and apparatus of packaging a semiconductor device with a clip is disclosed. The clip defines a first contact region and a second contact region on a same face of the at least one clip. The chip defines a first face, and a second face opposite to the first face, the first contact region being attached to the first face of the chip and the second contact region being located within a same plane with the second face of the clip.Type: GrantFiled: June 27, 2013Date of Patent: January 28, 2014Assignee: Infineon Technologies AGInventors: Boon Huat Lim, Chee Chian Lim, Yoke Chin Goh
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Publication number: 20130285249Abstract: A method and apparatus of packaging a semiconductor device with a clip is disclosed. The clip defines a first contact region and a second contact region on a same face of the at least one clip. The chip defines a first face, and a second face opposite to the first face, the first contact region being attached to the first face of the chip and the second contact region being located within a same plane with the second face of the clip.Type: ApplicationFiled: June 27, 2013Publication date: October 31, 2013Inventors: Boon Huat Lim, Chee Chian Lim, Yoke Chin Goh
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Patent number: 8486757Abstract: A method and apparatus of packaging a semiconductor device with a clip is disclosed. The clip defines a first contact region and a second contact region on a same face of the at least one clip. The chip defines a first face, and a second face opposite to the first face, the first contact region being attached to the first face of the chip and the second contact region being located within a same plane with the second face of the clip.Type: GrantFiled: November 25, 2009Date of Patent: July 16, 2013Assignee: Infineon Technologies AGInventors: Boon Huat Lim, Chee Chian Lim, Yoke Chin Goh
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Publication number: 20130064970Abstract: The present invention discloses a method of preparing a lead-free piezoelectric thin film comprising the steps of: providing a precursor solution comprising at least one alkali metal ion, a polyamine carboxylic acid, and an amine; depositing the precursor solution on a substrate to form a film; and annealing the film. The present invention also provides a lead-free piezoelectric thin film prepared according to the method, a precursor solution for use in the method and a method of preparing the precursor solution.Type: ApplicationFiled: May 20, 2011Publication date: March 14, 2013Inventors: Phoi Chin Goh, Kui Yao
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Patent number: 8049311Abstract: An electronic component includes a number of leads and at least one cooling element. The bottom surface of the cooling element is exposed and the material of the cooling element is different from the material of the leads. At least one semiconductor chip is provided on the cooling element. An encapsulation compound covers at least part of the leads, at least part of the semiconductor chip(s), and at least part of the cooling element(s).Type: GrantFiled: May 4, 2009Date of Patent: November 1, 2011Assignee: Infineon Technologies AGInventors: Chee Chian Lim, Yoke Chin Goh, Koh Hoo Goh, May Ting Hng
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Publication number: 20110121461Abstract: A method and apparatus of packaging a semiconductor device with a clip is disclosed. The clip defines a first contact region and a second contact region on a same face of the at least one clip. The chip defines a first face, and a second face opposite to the first face, the first contact region being attached to the first face of the chip and the second contact region being located within a same plane with the second face of the clip.Type: ApplicationFiled: November 25, 2009Publication date: May 26, 2011Applicant: INFINEON TECHNOLOGIES AGInventors: Boon Huat Lim, Chee Chian Lim, Yoke Chin Goh
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Publication number: 20090250807Abstract: An electronic component includes a number of leads and at least one cooling element. The bottom surface of the cooling element is exposed and the material of the cooling element is different from the material of the leads. At least one semiconductor chip is provided on the cooling element. An encapsulation compound covers at least part of the leads, at least part of the semiconductor chip(s), and at least part of the cooling element(s).Type: ApplicationFiled: May 4, 2009Publication date: October 8, 2009Applicant: INFINEON TECHNOLOGIES AGInventors: Chee Chian Lim, Yoke Chin Goh, Koh Hoo Goh, May Tin Hng
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Patent number: 7419113Abstract: A drag mechanism includes a first drag unit, a second drag unit and a switching mechanism. The first drag unit brakes a spool shaft of a spool. The first drag unit includes a first drag knob that is immovable in a back and forth direction and rotatably mounted on an outer peripheral surface of a cylindrical portion. The second drag unit brakes the spool shaft in a position frontward of the first drag unit. The second drag unit includes a second drag knob that is immovable in a back and forth direction and rotatably mounted on an outer peripheral surface of the cylindrical portion. The switching mechanism switches the first drag unit between a drag enabling state and a drag disabling state.Type: GrantFiled: May 18, 2007Date of Patent: September 2, 2008Assignee: Shimano Inc.Inventors: Noor Azri Bin Abd Razak, Miang Chin Goh
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Publication number: 20070284466Abstract: A drag mechanism includes a first drag unit, a second drag unit and a switching mechanism. The first drag unit brakes a spool shaft of a spool. The first drag unit includes a first drag knob that is immovable in a back and forth direction and rotatably mounted on an outer peripheral surface of a cylindrical portion. The second drag unit brakes the spool shaft in a position frontward of the first drag unit. The second drag unit includes a second drag knob that is immovable in a back and forth direction and rotatably mounted on an outer peripheral surface of the cylindrical portion. The switching mechanism switches the first drag unit between a drag enabling state and a drag disabling state.Type: ApplicationFiled: May 18, 2007Publication date: December 13, 2007Applicant: Shimano Components (Malaysia) SDN. BHD.Inventors: Noor Azri Bin Abd Razak, Miang Chin Goh
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Publication number: 20060142441Abstract: The present invention relates to the stabilization of segmented polyurethanes by the addition of a combination of antioxidants, benzofuranones and or sterically hindered amines and a hydrazine or hydrazide.Type: ApplicationFiled: December 12, 2005Publication date: June 29, 2006Inventors: Soke Chan, Chin Goh, Muhamadzen Junaidi