Patents by Inventor Chin Goh

Chin Goh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9826724
    Abstract: A present handle assembly is mounted to a handle shaft of a fishing reel. The handle assembly includes a handle arm and a handle knob. The handle arm is mounted to the handle shaft. The handle knob is mounted to the handle arm. The handle arm herein includes an arm body made of metal and a resin portion. The metallic arm body has a mount part and an arm part. The mount part is mounted to the handle shaft. The arm part is integrally formed with the mount part. The resin portion covers the mount part and at least a part of the arm part.
    Type: Grant
    Filed: August 26, 2015
    Date of Patent: November 28, 2017
    Assignee: SHIMANO COMPONENTS (MALAYSIA) SDN.
    Inventors: Miang Chin Goh, Wen Yin Lee, Hwee Yun Loh
  • Patent number: 9450175
    Abstract: The present invention discloses a method of preparing a lead-free piezoelectric thin film comprising the steps of: providing a precursor solution comprising at least one alkali metal ion, a polyamino carboxylic acid, and an amine; depositing the precursor solution on a substrate to form a film; and annealing the film. The present invention also provides a lead-free piezoelectric thin film prepared according to the method, a precursor solution for use in the method and a method of preparing the precursor solution.
    Type: Grant
    Filed: January 22, 2015
    Date of Patent: September 20, 2016
    Assignee: Agency for Science, Technology and Research
    Inventors: Phoi Chin Goh, Kui Yao
  • Publication number: 20160088823
    Abstract: A present handle assembly is mounted to a handle shaft of a fishing reel. The handle assembly includes a handle arm and a handle knob. The handle arm is mounted to the handle shaft. The handle knob is mounted to the handle arm. The handle arm herein includes an arm body made of metal and a resin portion. The metallic arm body has a mount part and an arm part. The mount part is mounted to the handle shaft. The arm part is integrally formed with the mount part. The resin portion covers the mount part and at least a part of the arm part.
    Type: Application
    Filed: August 26, 2015
    Publication date: March 31, 2016
    Inventors: Miang Chin GOH, Wen Yin LEE, Hwee Yun LOH
  • Publication number: 20150132475
    Abstract: The present invention discloses a method of preparing a lead-free piezoelectric thin film comprising the steps of: providing a precursor solution comprising at least one alkali metal ion, a polyamino carboxylic acid, and an amine; depositing the precursor solution on a substrate to form a film; and annealing the film. The present invention also provides a lead-free piezoelectric thin film prepared according to the method, a precursor solution for use in the method and a method of preparing the precursor solution.
    Type: Application
    Filed: January 22, 2015
    Publication date: May 14, 2015
    Applicant: Agency for Science, Technology and Research
    Inventors: Phoi Chin GOH, Kui Yao
  • Patent number: 8961679
    Abstract: The present invention discloses a method of preparing a lead-free piezoelectric thin film comprising the steps of: providing a precursor solution comprising at least one alkali metal ion, a polyamine carboxylic acid, and an amine; depositing the precursor solution on a substrate to form a film; and annealing the film. The present invention also provides a lead-free piezoelectric thin film prepared according to the method, a precursor solution for use in the method and a method of preparing the precursor solution.
    Type: Grant
    Filed: May 20, 2011
    Date of Patent: February 24, 2015
    Assignee: Agency for Science, Technology and Research
    Inventors: Phoi Chin Goh, Kui Yao
  • Patent number: 8637977
    Abstract: A method and apparatus of packaging a semiconductor device with a clip is disclosed. The clip defines a first contact region and a second contact region on a same face of the at least one clip. The chip defines a first face, and a second face opposite to the first face, the first contact region being attached to the first face of the chip and the second contact region being located within a same plane with the second face of the clip.
    Type: Grant
    Filed: June 27, 2013
    Date of Patent: January 28, 2014
    Assignee: Infineon Technologies AG
    Inventors: Boon Huat Lim, Chee Chian Lim, Yoke Chin Goh
  • Publication number: 20130285249
    Abstract: A method and apparatus of packaging a semiconductor device with a clip is disclosed. The clip defines a first contact region and a second contact region on a same face of the at least one clip. The chip defines a first face, and a second face opposite to the first face, the first contact region being attached to the first face of the chip and the second contact region being located within a same plane with the second face of the clip.
    Type: Application
    Filed: June 27, 2013
    Publication date: October 31, 2013
    Inventors: Boon Huat Lim, Chee Chian Lim, Yoke Chin Goh
  • Patent number: 8486757
    Abstract: A method and apparatus of packaging a semiconductor device with a clip is disclosed. The clip defines a first contact region and a second contact region on a same face of the at least one clip. The chip defines a first face, and a second face opposite to the first face, the first contact region being attached to the first face of the chip and the second contact region being located within a same plane with the second face of the clip.
    Type: Grant
    Filed: November 25, 2009
    Date of Patent: July 16, 2013
    Assignee: Infineon Technologies AG
    Inventors: Boon Huat Lim, Chee Chian Lim, Yoke Chin Goh
  • Publication number: 20130064970
    Abstract: The present invention discloses a method of preparing a lead-free piezoelectric thin film comprising the steps of: providing a precursor solution comprising at least one alkali metal ion, a polyamine carboxylic acid, and an amine; depositing the precursor solution on a substrate to form a film; and annealing the film. The present invention also provides a lead-free piezoelectric thin film prepared according to the method, a precursor solution for use in the method and a method of preparing the precursor solution.
    Type: Application
    Filed: May 20, 2011
    Publication date: March 14, 2013
    Inventors: Phoi Chin Goh, Kui Yao
  • Patent number: 8049311
    Abstract: An electronic component includes a number of leads and at least one cooling element. The bottom surface of the cooling element is exposed and the material of the cooling element is different from the material of the leads. At least one semiconductor chip is provided on the cooling element. An encapsulation compound covers at least part of the leads, at least part of the semiconductor chip(s), and at least part of the cooling element(s).
    Type: Grant
    Filed: May 4, 2009
    Date of Patent: November 1, 2011
    Assignee: Infineon Technologies AG
    Inventors: Chee Chian Lim, Yoke Chin Goh, Koh Hoo Goh, May Ting Hng
  • Publication number: 20110121461
    Abstract: A method and apparatus of packaging a semiconductor device with a clip is disclosed. The clip defines a first contact region and a second contact region on a same face of the at least one clip. The chip defines a first face, and a second face opposite to the first face, the first contact region being attached to the first face of the chip and the second contact region being located within a same plane with the second face of the clip.
    Type: Application
    Filed: November 25, 2009
    Publication date: May 26, 2011
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Boon Huat Lim, Chee Chian Lim, Yoke Chin Goh
  • Publication number: 20090250807
    Abstract: An electronic component includes a number of leads and at least one cooling element. The bottom surface of the cooling element is exposed and the material of the cooling element is different from the material of the leads. At least one semiconductor chip is provided on the cooling element. An encapsulation compound covers at least part of the leads, at least part of the semiconductor chip(s), and at least part of the cooling element(s).
    Type: Application
    Filed: May 4, 2009
    Publication date: October 8, 2009
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Chee Chian Lim, Yoke Chin Goh, Koh Hoo Goh, May Tin Hng
  • Patent number: 7419113
    Abstract: A drag mechanism includes a first drag unit, a second drag unit and a switching mechanism. The first drag unit brakes a spool shaft of a spool. The first drag unit includes a first drag knob that is immovable in a back and forth direction and rotatably mounted on an outer peripheral surface of a cylindrical portion. The second drag unit brakes the spool shaft in a position frontward of the first drag unit. The second drag unit includes a second drag knob that is immovable in a back and forth direction and rotatably mounted on an outer peripheral surface of the cylindrical portion. The switching mechanism switches the first drag unit between a drag enabling state and a drag disabling state.
    Type: Grant
    Filed: May 18, 2007
    Date of Patent: September 2, 2008
    Assignee: Shimano Inc.
    Inventors: Noor Azri Bin Abd Razak, Miang Chin Goh
  • Publication number: 20070284466
    Abstract: A drag mechanism includes a first drag unit, a second drag unit and a switching mechanism. The first drag unit brakes a spool shaft of a spool. The first drag unit includes a first drag knob that is immovable in a back and forth direction and rotatably mounted on an outer peripheral surface of a cylindrical portion. The second drag unit brakes the spool shaft in a position frontward of the first drag unit. The second drag unit includes a second drag knob that is immovable in a back and forth direction and rotatably mounted on an outer peripheral surface of the cylindrical portion. The switching mechanism switches the first drag unit between a drag enabling state and a drag disabling state.
    Type: Application
    Filed: May 18, 2007
    Publication date: December 13, 2007
    Applicant: Shimano Components (Malaysia) SDN. BHD.
    Inventors: Noor Azri Bin Abd Razak, Miang Chin Goh
  • Publication number: 20060142441
    Abstract: The present invention relates to the stabilization of segmented polyurethanes by the addition of a combination of antioxidants, benzofuranones and or sterically hindered amines and a hydrazine or hydrazide.
    Type: Application
    Filed: December 12, 2005
    Publication date: June 29, 2006
    Inventors: Soke Chan, Chin Goh, Muhamadzen Junaidi