Patents by Inventor Chin Guan Khaw

Chin Guan Khaw has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System for encapsulation of semiconductor dies
    Patent number: 9082775
    Abstract: The present invention describes two systems (100, 300) for encapsulation of semiconductor dies. Both systems (100, 300) involve attaching an encapsulation spacer (102, 302, 302a, 302b) having one or more apertures (104, 304) on an associated substrate (150) so that a group of chips is located within the aperture (104, 304). The first system (100) involves dispensing encapsulant (103) directly into an aperture. The second system (300) involves attaching an encapsulant delivery layer (350, 351) onto the encapsulation spacer and discharging encapsulant into an aperture via a recessed gate (308).
    Type: Grant
    Filed: November 17, 2009
    Date of Patent: July 14, 2015
    Assignee: Advanpack Solutions Pte Ltd
    Inventors: Amlan Sen, Chin Guan Khaw
  • Method For Encapsulating Semiconductor Dies
    Publication number: 20110281403
    Abstract: The present invention describes two methods (200, 400) for encapsulating semiconductor dies. Both methods (200, 400) involve attaching an encapsulation spacer (102, 302, 302a, 302b) having one or more apertures (104, 304) on an associated substrate (150) so that a group of chips (160) is located within the aperture (104, 304). The first method (200) involves dispensing encapsulant (103) directly into an aperture. The second method (400) involves attaching an encapsulant delivery layer (350, 351) onto the encapsulation spacer and discharging encapsulant into an aperture via a recessed gate (308).
    Type: Application
    Filed: November 17, 2009
    Publication date: November 17, 2011
    Applicant: PYXIS SYSTEMS INTEGRATION PTE LTD
    Inventors: Amlan Sen, Chin Guan Khaw
  • System For Encapsulation Of Semiconductor Dies
    Publication number: 20110271902
    Abstract: The present invention describes two systems (100, 300) for encapsulation of semiconductor dies. Both systems (100, 300) involve attaching an encapsulation spacer (102, 302, 302a, 302b) having one or more apertures (104, 304) on an associated substrate (150) so that a group of chips is located within the aperture (104, 304). The first system (100) involves dispensing encapsulant (103) directly into an aperture. The second system (300) involves attaching an encapsulant delivery layer (350, 351) onto the encapsulation spacer and discharging encapsulant into an aperture via a recessed gate (308).
    Type: Application
    Filed: November 17, 2009
    Publication date: November 10, 2011
    Applicant: Advanpack Solutions Pte Ltd.
    Inventors: Amlan Sen, Chin Guan Khaw