Patents by Inventor Chin Hock Kua

Chin Hock Kua has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140346378
    Abstract: An improved microfluidic system with an improved microfluidic valve module is disclosed. The microfluidic system includes a microfluidic chip and one or more valve modules. The microfluidic chip has microfluidic channels and one or more cavities formed in the chip, each of the one or more cavities designed to receive one of the one or more valve modules. Each of the one or more valve modules includes a first layer, a control layer and one or more second layers. The first layer includes a deformable material. The control layer has a microfluidic control chamber formed in a portion of it. The control layer is also located adjoining the first layer and the deformable material of the first layer forms a deformable surface of the control chamber. The one or more second layers include an input microfluidic channel and an output microfluidic channel.
    Type: Application
    Filed: December 21, 2011
    Publication date: November 27, 2014
    Applicant: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH
    Inventors: Chin Hock Kua, Zhenfeng Wang, Wei Fan, Cong Zhi Leon Chan, Zhiping Wang