Abstract: The present invention provides a stackable semiconductor having an interconnect board for providing electrical interconnections, the package includes a plurality of solders disposing onto the interconnect board; and a conducting metal pin passing through each solder and the interconnect board, the metal pins having at least one end disposes on the semiconductor package, wherein when a plurality of the stackable semiconductor packages are stacked together, the exposed end of the corresponding conducting pins are bonded together. A method of manufacturing the same is also provided.

Abstract: In a first aspect, an apparatus for chemical delivery to a scrubber is provided. The apparatus comprises: a liquid delivery module comprising: a first input adapted to receive a first input flow of a dilutant; a second input adapted to receive a second input flow of a chemistry; one or more flow couplers coupled to the first input and the second input, and adapted to combine the first input flow and the second input flow into a combined flow; a mixing element coupled to the one or more flow couplers, and adapted to mix the combined flow such that a homogeneity of the combined flow is increased; a flow splitter coupled to the mixing element and adapted to generate at least a first output flow and a second output flow from the combined flow; a first output coupled to the flow splitter and adapted to direct the first output flow toward a first scrubber dispensing element; and a second output coupled to the flow splitter and adapted to direct the second output flow toward a second scrubber dispensing element.