Patents by Inventor Chin-Hon Fan

Chin-Hon Fan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7411563
    Abstract: An antenna device has a dielectric body with a convex surface and a concave surface. The antenna device further has a flexible printed circuit board disposed on the convex surface.
    Type: Grant
    Filed: July 18, 2007
    Date of Patent: August 12, 2008
    Assignee: High Tech Computer, Corp.
    Inventors: Kuo-Cheng Liu, Chin-Hon Fan, Kun-Ting Lin, Ren-Peng Chen
  • Publication number: 20070262915
    Abstract: An antenna device has a dielectric body with a convex surface and a concave surface. The antenna device further has a flexible printed circuit board disposed on the convex surface.
    Type: Application
    Filed: July 18, 2007
    Publication date: November 15, 2007
    Inventors: Kuo-Cheng Liu, Chin-Hon Fan, Kun-Ting Lin, Ren-Peng Chen
  • Patent number: 7253787
    Abstract: A method for manufacturing a helix antenna. A ceramic cylinder including a central through hole, a first annular surface, and a second annular surface is provided. The first annular surface is opposite the second annular surface. The central through hole is between the first and second annular surfaces. A flexible printed circuit board with a metal feeding strip extending outside the flexible printed circuit board is provided. The flexible printed circuit board is swirled and attached to the circumferential surface of the ceramic cylinder.
    Type: Grant
    Filed: April 6, 2005
    Date of Patent: August 7, 2007
    Assignee: High Tech Computer, Corp.
    Inventors: Kuo-Cheng Liu, Chin-Hon Fan, Kun-Ting Lin, Ren-Peng Chen
  • Publication number: 20060109196
    Abstract: A method for manufacturing a helix antenna. A ceramic cylinder including a central through hole, a first annular surface, and a second annular surface is provided. The first annular surface is opposite the second annular surface. The central through hole is between the first and second annular surfaces. A flexible printed circuit board with a metal feeding strip extending outside the flexible printed circuit board is provided. The flexible printed circuit board is swirled and attached to the circumferential surface of the ceramic cylinder.
    Type: Application
    Filed: April 6, 2005
    Publication date: May 25, 2006
    Inventors: Kuo-Cheng Liu, Chin-Hon Fan, Kun-Ting Lin, Ren-Peng Chen
  • Patent number: 6972049
    Abstract: A process for making a diamond film with low surface roughness. A substrate is provided. A diamond layer is deposited on the substrate. A binder layer is coated over the diamond layer. A carrier plate is provided to join with the binder layer, thereby forming a laminate structure. The substrate is then removed, thereby obtaining a diamond film with a low surface roughness with respect to the surface roughness of the removed substrate.
    Type: Grant
    Filed: August 7, 2003
    Date of Patent: December 6, 2005
    Assignee: Industrial Technology Research Institute
    Inventors: Ping-Yin Liu, Chun-Hao Hsieh, Chin-Hon Fan, Hung-Yin Tsai, Chien-Chang Su
  • Publication number: 20050126490
    Abstract: A substrate temperature control apparatus adopted for use in plasma diamond coating of a substrate to reduce warping caused by excessive temperature variations includes a holding dock with a temperature sensor, a cooler and a heater installed therein. During the plasma process, if the detected temperature variation is excessive, the cooler or heater is activated to control the temperature of the upper surface and the lower surface of the substrate so that the temperature on two sides are controlled within a selected range to reduce warping.
    Type: Application
    Filed: July 1, 2004
    Publication date: June 16, 2005
    Inventors: Chun-Hao Hsieh, Chin-Hon Fan, Ping-Yin Liu, Hung-Yin Tsai
  • Publication number: 20050028728
    Abstract: A process for making a diamond film with low surface roughness. A substrate is provided. A diamond layer is deposited on the substrate. A binder layer is coated over the diamond layer. A carrier plate is provided to join with the binder layer, thereby forming a laminate structure. The substrate is then removed, thereby obtaining a diamond film with a low surface roughness with respect to the surface roughness of the removed substrate.
    Type: Application
    Filed: August 7, 2003
    Publication date: February 10, 2005
    Inventors: Ping-Yin Liu, Chun-Hao Hsieh, Chin-Hon Fan, Hung-Yin Tsai, Chien-Chang Su
  • Patent number: 6421224
    Abstract: The invention discloses a micro-structure capacitor formed by joining the metal layer of a multi-porous micro-structure. A substrate is used as an etching stop layer when producing the capacitor. Therefore, pores with low aspect ratio and uniform size are formed on the surface of the substrate. The efficiency of the subsequent thin film coating process is increased. The porous three-dimensional structure increases the capacitance. Micro-structures are stacked up so the capacitor produced features small size and high capacitance.
    Type: Grant
    Filed: October 23, 2001
    Date of Patent: July 16, 2002
    Assignee: Industrial Technology Research Institute
    Inventors: Hung-Yi Lin, Hung-Yin Tsai, Jung-Yen Huang, Chin-Hon Fan