Patents by Inventor Chin-Hsiang Hsiao

Chin-Hsiang Hsiao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Complex CMP process and fabricating methods of STI structure and interconnect structure
    Publication number: 20070062910
    Abstract: A complex CMP process is described. A target film is coarsely polished using a first polishing platen in a first CMP machine. The remaining target film is then fine polished using successively a second polishing platen and a third polishing platen in a second CMP machine that is different from the first CMP machine.
    Type: Application
    Filed: September 22, 2005
    Publication date: March 22, 2007
    Inventors: Ming-Hsin Yeh, Cheng-Chuan Lee, Ming-Te Chen, Yi-Ching Wu, Chin-Hsiang Hsiao