Abstract: A method of manufacturing a semiconductor device includes dividing a number of dies along an x axis in a die matrix in each exposure field in an exposure field matrix delineated on the semiconductor substrate, wherein the x axis is parallel to one edge of a smallest rectangle enclosing the exposure field matrix. A number of dies is divided along a y axis in the die matrix, wherein the y axis is perpendicular to the x axis. Sequences SNx0, SNx1, SNx, SNxr, SNy0, SNy1, SNy, and SNyr are formed. p*(Nbx+1)?2 stepping operations are performed in a third direction and first sequence exposure/stepping/exposure operations and second sequence exposure/stepping/exposure operations are performed alternately between any two adjacent stepping operations as well as before a first stepping operation and after a last stepping operation. A distance of each stepping operation in order follows the sequence SNx.

Abstract: A method for forming a semiconductor device structure is provided. The method includes forming a resist layer over a material layer, the resist layer includes an inorganic material. The inorganic material includes a plurality of metallic cores and a plurality of first linkers bonded to the metallic cores. The method includes forming a modified layer over the resist layer, and the modified layer includes an auxiliary. The method includes performing an exposure process on the modified layer and the resist layer, and removing a portion of the modified layer and a first portion of the resist layer by a first developer. The first developer includes a ketone-based solvent having a substituted or unsubstituted C6-C7 cyclic ketone, an ester-based solvent having a formula (b), or a combination thereof.

Abstract: The present disclosure describes structures and methods for a via structure for three-dimensional integrated circuit (IC) packaging. The via structure includes a middle portion that extends through a planar structure and a first end and a second end each connected to the middle portion and on a different side of the planar structure. One or more of the first end and the second end includes one or more of a plurality of vias and a pseudo metal layer.

Abstract: A method includes illuminating radiation to a resist layer over a substrate to pattern the resist layer. The patterned resist layer is developed by using a positive tone developer. The patterned resist layer is rinsed using a basic aqueous rinse solution. A pH value of the basic aqueous rinse solution is lower than a pH value of the developer, and a rinse temperature of rinsing the patterned resist layer is in a range of about 20° C. to about 40° C.

Abstract: A system (for generating a layout diagram of a wire routing arrangement) includes a processor and memory including computer program code for one or more programs, the system generating the layout diagram including: placing, relative to a given one of masks in a multi-patterning context, a given cut pattern at a first candidate location over a corresponding portion of a given conductive pattern in a metallization layer; determining that the first candidate location results in an intra-row non-circular group of a given row which violates a design rule, the intra-row non-circular group including first and second cut patterns which abut a same boundary of the given row, and a total number of cut patterns in the being an even number; and temporarily preventing placement of the given cut pattern in the metallization layer at the first candidate location until a correction is made which avoids violating the design rule.

Abstract: A pinwheel comprises a rotating seat, a screw rod passing through the rotating seat, a head disposed on a top end of the screw rod, and a plurality of blades connected to the rotating seat. The screw rod has a tip end. The rotating seat has a center hole, a plurality of periphery recesses, a plurality of enlarged grooves, a round hole, and a plurality of blocking plates. Each of the periphery recesses communicating with each of the corresponding enlarged grooves. A plug has a guide plate. The guide plate has a camber edge. The guide plate is inserted in the round hole. A spring is inserted in the round hole. A screw screws the round hole. Each of the blades has a post. The screw rod has a screw recess to receive the camber edge. Each of the posts is inserted in each of the corresponding enlarged grooves. Each of the blades is inserted in each of the corresponding periphery recesses.

Abstract: An improved sunshade opening and supporting device is provided with a rack-like member disposed on the main shaft of a sunshade at a section thereof over which the runner of the sunshade travels during the opening and closing of the sunshade; the rack-like member is equipped with a plurality of consecutive Z-shaped teeth each having an oblique face; a horizontal stop piece is disposed at the topmost end of the rack-like member. A groove is disposed on the inner wall of the slidable runner so as to permit the runner to be slidably engaged with the rack-like member; and a cavity is disposed on the wall of the groove of the runner with a spring housed therein. One end of the spring Abuts against a restraint flange of a supporting pin and the other end is limited by a lid secured at one end of the open-ended cavity.