Patents by Inventor Chin-Hsien Chang

Chin-Hsien Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240146288
    Abstract: A system includes a measuring device, a processing device and a signal generating device. The measuring device is configured to measure a voltage difference between a first node and a second node. The processing device is coupled between the first node and the second node. The signal generating device is configured to provide a first clock signal to the processing device to adjust the voltage difference, configured to generate the first clock signal according to a first enable signal and a second clock signal, and configured to align an edge of the first enable signal with an edge of the second clock signal. A method and a device are also disclosed herein.
    Type: Application
    Filed: January 11, 2024
    Publication date: May 2, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Tsung-Che LU, Chin-Ming FU, Chih-Hsien CHANG
  • Publication number: 20240136602
    Abstract: A consumer electronic device includes a battery module and a system chip. The battery module includes: battery cells, a heater adjacent to the battery cells, a battery management circuit coupled to the battery cells and the heater, and an electrical connector including an information transmission interface and a power transmission interface. The information transmission interface is coupled to the battery management circuit, and the power transmission interface is coupled to the battery cells. The system chip is coupled to the information transmission interface, and is configured to receive battery information from the battery management circuit through the information transmission interface. When a battery temperature of the battery information is lower than a first threshold, the system chip sends an activation signal to the battery management circuit through the information transmission interface, for the battery management circuit to activate the heater according to the activation signal.
    Type: Application
    Filed: January 26, 2023
    Publication date: April 25, 2024
    Inventors: CHUI-HSIEN LI, CHIN-JUNG CHANG
  • Patent number: 11961580
    Abstract: A sense amplifier includes a first pair of transistors having gate terminals respectively coupled to a first input terminal for receiving a first input signal and to a second input terminal for receiving a second input signal, source terminals coupled to a first power supply terminal, and drain terminals. The sense amplifier also includes a second pair of transistors having gate terminals coupled to a clock terminal, source terminals respectively coupled to the drain terminals of the first pair of transistors, and drain terminals. The sense amplifier also includes a third pair of transistors having gate terminals coupled to the clock terminal, drain terminals respectively coupled to the drain terminals of the second pair of transistors, and source terminals coupled to a second power supply terminal. In addition, the sense amplifier includes an output circuit coupled to the drain terminals of the second pair of transistors and having an output terminal.
    Type: Grant
    Filed: June 1, 2022
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tsung-Che Lu, Chin-Ming Fu, Chih-Hsien Chang
  • Publication number: 20240085941
    Abstract: An impedance measurement circuit and an operating method thereof are provided. The impedance measurement circuit includes a current source, a voltage controlled oscillator (VCO), an operation circuit, and a first delay circuit. The current source, electrically connected to a power rail, is able to sink a current from the power rail according to the delayed clock signal. The VCO is configured to generate an oscillation signal according to a power voltage on the power rail. The operation circuit is electrically connected to the VCO and is configured to receive a sampling clock signal and the oscillation signal, sense the power voltage to generate a sampled signal, and accumulate the sampled signal to generate a measurement result. The first delay circuit, electrically connected to the current source and the operation circuit, is able to receive the sampling clock signal and transmit the delayed clock signal to the current source.
    Type: Application
    Filed: November 22, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tsung-Che Lu, Chin-Ming Fu, Chih-Hsien Chang
  • Patent number: 11922887
    Abstract: A display may include an array of pixels. Each pixel in the array includes an organic light-emitting diode coupled to associated thin-film transistors. The diode may be coupled to drive transistor circuitry, a data loading transistor, and emission transistors. The drive transistor circuitry may include at least two transistor portions connected in series. The data loading transistor has a drain region connected to a data line and a source region connected directly to the drive transistor circuitry. The data line may be connected to and overlap the drain region of the data loading transistor. The data line and the source region of the data loading transistor are non-overlapping to reduce row-to-row crosstalk.
    Type: Grant
    Filed: July 6, 2021
    Date of Patent: March 5, 2024
    Assignee: Apple Inc.
    Inventors: Shinya Ono, Chin-Wei Lin, Chuan-Jung Lin, Gihoon Choo, Hassan Edrees, Hei Kam, Jung Yen Huang, Pei-En Chang, Rungrot Kitsomboonloha, Szu-Hsien Lee, Zino Lee
  • Patent number: 11513564
    Abstract: A casing structure including a plastic casing, at least one metal component, and a conductive layer is provided. The at least one metal component is disposed on the plastic casing, and at least one side surface of the at least one metal component is covered by the plastic casing. The conductive layer is disposed on the metal component and extends to the plastic casing. In addition, a manufacturing method of the casing structure is also provided.
    Type: Grant
    Filed: March 2, 2020
    Date of Patent: November 29, 2022
    Assignee: COMPAL ELECTRONICS, INC.
    Inventor: Chin-Hsien Chang
  • Patent number: 11448294
    Abstract: A linkage mechanism includes a pivoting assembly, a cam, a sliding assembly and at least one linkage. The cam pivots coaxially with the rotating axis of the pivoting assembly. A leaning element is located on one side of the cam. A sliding frame pivots the leaning element and has at least one limiting area. The linkage includes a main body portion, a first linkage portion protruded beyond the limiting area and a second linkage portion. When the pivoting assembly drives the cam to pivot from a first position to a second position, the cam pushes against the leaning element to slide the sliding frame in a first direction relative to a plate, and the limiting area interferes with the first linkage portion of the linkage to rotate the main body portion in a first clock direction to allow the second linkage portion to provide a thrust in a second direction.
    Type: Grant
    Filed: January 16, 2020
    Date of Patent: September 20, 2022
    Assignee: COMPAL ELECTRONICS, INC
    Inventors: Chin-Hsien Chang, Chih-Hsueh Tsai
  • Patent number: 10963021
    Abstract: An electronic device includes a first body, a second body, a touch pad module and a speaker module. The first body has an assembling region. The second body is pivoted to the first body. The touch pad module and the speaker module are disposed in the assembling region, wherein the touch pad module includes a first extending circuit board which is configured with a conductive pad. The speaker module is located at one side of the touch pad module. The speaker module includes a speaker and a conductive elastic component, and the conductive elastic component contacts the conductive pad. An assembling method of an electronic device is also provided.
    Type: Grant
    Filed: June 26, 2019
    Date of Patent: March 30, 2021
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Chin-Hsien Chang, Yen-Chia Chang
  • Patent number: 10936028
    Abstract: An electronic device and a method for controlling a fan operation are provided. A containing space of the electronic device has a fan module and a deformation sensor. The deformation sensor detects whether a fan housing of the fan module is deformed. The deformation sensor transmits a deformation signal to a controller when detecting that the fan housing is deformed. The controller drives a fan blade of the fan module to stop running after receiving the deformation signal.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: March 2, 2021
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Chih-Chin Chien, I-Feng Hsu, Ching-Chung Chen, Tse-Yang Lin, Tse-An Chu, Ching-Ya Tu, Chang-Yuan Wu, Hao-Wu Yang, Huan-Yang Yeh, Chin-Hsien Chang, Chin-Yuan Chuang, Chia-Hung Lin
  • Patent number: 10915150
    Abstract: A linkage mechanism includes a pivoting assembly, a cam, a sliding assembly, and a linkage assembly. The cam pivots coaxially with the rotating axis. The sliding assembly is assembled on a plate member and has a leaning surface and a sliding slot. The linkage assembly includes a linkage passing through the sliding slot and a carrier base including at least one bump and fastened to the linkage. When the pivoting assembly drives the cam to pivot from a first position to a second position, the cam pushes against the leaning surface to slide the sliding assembly relative to the plate member in a first direction, and the linkage rotates in the sliding slot to drive the carrier base to move in a second direction, and the bump gradually enters into a cavity of a frame from leaning the frame to move the frame in a third direction.
    Type: Grant
    Filed: October 5, 2019
    Date of Patent: February 9, 2021
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Chin-Hsien Chang, Chih-Hsueh Tsai
  • Publication number: 20210010576
    Abstract: A linkage mechanism includes a pivoting assembly, a cam, a sliding assembly and at least one linkage. The cam pivots coaxially with the rotating axis of the pivoting assembly. A leaning element is located on one side of the cam. A sliding frame pivots the leaning element and has at least one limiting area. The linkage includes a main body portion, a first linkage portion protruded beyond the limiting area and a second linkage portion. When the pivoting assembly drives the cam to pivot from a first position to a second position, the cam pushes against the leaning element to slide the sliding frame in a first direction relative to a plate, and the limiting area interferes with the first linkage portion of the linkage to rotate the main body portion in a first clock direction to allow the second linkage portion to provide a thrust in a second direction.
    Type: Application
    Filed: January 16, 2020
    Publication date: January 14, 2021
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Chin-Hsien Chang, Chih-Hsueh Tsai
  • Publication number: 20210011521
    Abstract: A linkage mechanism includes a pivoting assembly, a cam, a sliding assembly, and a linkage assembly. The cam pivots coaxially with the rotating axis. The sliding assembly is assembled on a plate member and has a leaning surface and a sliding slot. The linkage assembly includes a linkage passing through the sliding slot and a carrier base including at least one bump and fastened to the linkage. When the pivoting assembly drives the cam to pivot from a first position to a second position, the cam pushes against the leaning surface to slide the sliding assembly relative to the plate member in a first direction, and the linkage rotates in the sliding slot to drive the carrier base to move in a second direction, and the bump gradually enters into a cavity of a frame from leaning the frame to move the frame in a third direction.
    Type: Application
    Filed: October 5, 2019
    Publication date: January 14, 2021
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Chin-Hsien Chang, Chih-Hsueh Tsai
  • Publication number: 20200293091
    Abstract: A casing structure including a plastic casing, at least one metal component, and a conductive layer is provided. The at least one metal component is disposed on the plastic casing, and at least one side surface of the at least one metal component is covered by the plastic casing. The conductive layer is disposed on the metal component and extends to the plastic casing. In addition, a manufacturing method of the casing structure is also provided.
    Type: Application
    Filed: March 2, 2020
    Publication date: September 17, 2020
    Applicant: COMPAL ELECTRONICS, INC.
    Inventor: Chin-Hsien Chang
  • Patent number: 10631445
    Abstract: An electronic assembly with RFI shielding including a circuit board, a high frequency electromagnetic radiation device, and a shielding cover is provided. The circuit board includes a connector. The high frequency electromagnetic radiation device is detachably inserted to the connector of the circuit board to be electrically connected with the circuit board. The shielding cover is detachably assembled to the connector to be opened or closed relative to the circuit board. The shielding cover shields high frequency radiation generated by the high frequency electromagnetic radiation device when the shielding cover is in a closed state, and at least a portion of the shielding cover contacts the circuit board in the closed state, and the shielding cover is electrically connected to a grounding portion of the circuit board via the connector.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: April 21, 2020
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Chin-Hsien Chang, Shang-Chu Chien, Ting-Tuan Chang, Chi-Chu Chen
  • Publication number: 20200012315
    Abstract: An electronic device includes a first body, a second body, a touch pad module and a speaker module. The first body has an assembling region. The second body is pivoted to the first body. The touch pad module and the speaker module are disposed in the assembling region, wherein the touch pad module includes a first extending circuit board which is configured with a conductive pad. The speaker module is located at one side of the touch pad module. The speaker module includes a speaker and a conductive elastic component, and the conductive elastic component contacts the conductive pad. An assembling method of an electronic device is also provided.
    Type: Application
    Filed: June 26, 2019
    Publication date: January 9, 2020
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Chin-Hsien Chang, Yen-Chia Chang
  • Publication number: 20180310441
    Abstract: An electronic assembly with RFI shielding including a circuit board, a high frequency electromagnetic radiation device, and a shielding cover is provided. The circuit board includes a connector. The high frequency electromagnetic radiation device is detachably inserted to the connector of the circuit board to be electrically connected with the circuit board. The shielding cover is detachably assembled to the connector to be opened or closed relative to the circuit board. The shielding cover shields high frequency radiation generated by the high frequency electromagnetic radiation device when the shielding cover is in a closed state, and at least a portion of the shielding cover contacts the circuit board in the closed state, and the shielding cover is electrically connected to a grounding portion of the circuit board via the connector.
    Type: Application
    Filed: December 20, 2017
    Publication date: October 25, 2018
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Chin-Hsien Chang, Shang-Chu Chien, Ting-Tuan Chang, Chi-Chu Chen
  • Publication number: 20180228050
    Abstract: An electronic device and a method for controlling a fan operation are provided. A containing space of the electronic device has a fan module and a deformation sensor. The deformation sensor detects whether a fan housing of the fan module is deformed. The deformation sensor transmits a deformation signal to a controller when detecting that the fan housing is deformed. The controller drives a fan blade of the fan module to stop running after receiving the deformation signal.
    Type: Application
    Filed: December 27, 2017
    Publication date: August 9, 2018
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Chih-Chin Chien, I-Feng Hsu, Ching-Chung Chen, Tse-Yang Lin, Tse-An Chu, Ching-Ya Tu, Chang-Yuan Wu, Hao-Wu Yang, Huan-Yang Yeh, Chin-Hsien Chang, Chin-Yuan Chuang, Chia-Hung Lin
  • Patent number: 8169564
    Abstract: A display module including a display panel, a frame and a bracket is provided. The frame surrounds the display panel and has a protruding part and a first position limiting structure. The bracket has a body with a second position limiting structure and a first protrusion, wherein the protruding part is aligned with the first protrusion when the first position limiting structure is engaged with the second position limiting structure to fix the bracket on the frame in a non-screw manner.
    Type: Grant
    Filed: April 28, 2009
    Date of Patent: May 1, 2012
    Assignee: Compal Electronics, Inc.
    Inventor: Chin-Hsien Chang
  • Publication number: 20100141863
    Abstract: A display module including a display panel, a frame and a bracket is provided. The frame surrounds the display panel and has a protruding part and a first position limiting structure. The bracket has a body with a second position limiting structure and a first protrusion, wherein the protruding part is aligned with the first protrusion when the first position limiting structure is engaged with the second position limiting structure to fix the bracket on the frame in a non-screw manner.
    Type: Application
    Filed: April 28, 2009
    Publication date: June 10, 2010
    Applicant: COMPAL ELECTRONICS, INC.
    Inventor: Chin-Hsien Chang
  • Patent number: 7704085
    Abstract: A cover module of an electronic device and a control method thereof are provided. The cover module includes a body, a flexible connecting element, and a flip cover. The body has an opening exposing the connector. A sidewall of the opening has a first fixing structure. The flip cover is in the opening, and a sidewall of the flip cover has a second fixing structure locked with the first fixing structure. The flexible connecting element is connected between the body and the flip cover. When a force is applied to the flip cover, the flexible connecting element is deformed, the flip cover moves with the deformation of the flexible connecting element, and the locking between the first and the second fixing structures is released to cause the flip cover swinging open away from the body with a part of the flexible connecting element as an axis.
    Type: Grant
    Filed: July 2, 2009
    Date of Patent: April 27, 2010
    Assignee: Compal Electronics, Inc.
    Inventor: Chin-Hsien Chang