Abstract: An optical input/output tray for management of optical fibers installed in a switch assembly is disclosed. The switch assembly has a co-packaged optics module with an optical data signal input and a laser input, and a front panel. The optical input/output tray includes a housing insertable in the switch assembly. A first set of adapters are connectable to the co-packaged optics module. A second set of adapters is connectable to the front panel. WDM components convert a plurality of multi-wavelength signals from the first set of adapters to a single multiplexed signal coupled to the second set of adapters. The WDM components converts a single multiplexed signal from the second set of adapters to multi-wavelength signals coupled to the first set of adapters. A fiber management structure in the housing communicates optical signals between the first set of adapters, the WDM components, and the second set of adapters.

Abstract: The present disclosure provides a method for treating Parkinson's disease by using Parabacteroides goldsteinii. The Parabacteroides goldsteinii of the present disclosure achieves the effect of treating Parkinson's disease through various efficacy experiments.

Abstract: A multi-chip stack package mainly includes a substrate, a first chip, a redistribution structure and at least one second chip. The first chip is disposed on the substrate with an active surface facing upwards. The redistribution structure includes a plurality of first intermediate pads, a plurality of second intermediate pads and a plurality of external pads. The first intermediate pads, the second intermediate pads, and the external pads are formed on the first active surface of the first chip, wherein the first intermediate pads and the second intermediate pads are electrically connected with each other. The second chip is disposed on the redistribution structure, and electrically connected to the first intermediate pads. The second intermediate pads are electrically connected to the substrate through a plurality of bonding wires, so that the second chip and the substrate are electrically conducted, and the connection length of the bonding wires is reduced.

Abstract: A thermoelectric wafer chuck is disclosed. The thermoelectric wafer chuck includes a wafer support surface for supporting a wafer; and a thermoelectric module provided in thermal contact with the wafer support surface for heating and/or cooling the wafer support surface and wafer.

Abstract: A multi-chip stack package mainly comprises a substrate, a first chip, a redistribution structure and at least one second chip. The first chip is disposed on the substrate by an active surface facing upwards. The redistribution structure comprises a plurality of first intermediate pads, a plurality of second intermediate pads and a plurality of external pads. The first intermediate pads, the second intermediate pads, and the external pads are formed on the first active surface of the first chip, wherein the first intermediate pads and the second intermediate pads are electrically connected with each other. The second chip is disposed on the redistribution structure, and electrically connected to the first intermediate pads. The second intermediate pads are electrically connected to the substrate through a plurality of bonding wires, so that the second chip and the substrate are electrically conducted, and the connection length of the bonding wires is reduced.

Abstract: A method of manufacturing a package is disclosed. The manufacturing method includes the steps of providing a substrate having an opening, disposing a metal slice on a bottom surface of the substrate to cover the opening and bond pads on the bottom surface of the substrate, disposing a die on the metal slice inside the opening or above the top surface of the substrate outside the opening, forming a number of bond wires between the top surface of the die and the top surface of the substrate to electrically connect the die to the substrate, forming an encapsulating mold compound to cover the die, the bond wires, and a part of the top surface of the substrate, removing a part of the metal slice to form a metal heat slug thermally connected to the die and to expose the bond pads, and forming a number of solder balls on the exposed bond pads.

Abstract: A method of manufacturing a package is disclosed. The manufacturing method includes the steps of providing a substrate having an opening, disposing a metal slice on a bottom surface of the substrate to cover the opening and bond pads on the bottom surface of the substrate, disposing a die on the metal slice inside the opening or above the top surface of the substrate outside the opening, forming a number of bond wires between the top surface of the die and the top surface of the substrate to electrically connect the die to the substrate, forming an encapsulating mold compound to cover the die, the bond wires, and a part of the top surface of the substrate, removing a part of the metal slice to form a metal heat slug thermally connected to the die and to expose the bond pads, and forming a number of solder balls on the exposed bond pads.

Abstract: A method for making metal-insulator-metal (MIM) capacitors having insulators with high-dielectric-constant and sandwiched between wide-band-gap insulators resulting in low leakage currents and high capacitance per unit area is achieved. The high-k layer increases the capacitance per unit area for next generation mixed-signal devices while the wide-band-gap insulators reduce leakage currents. In a second embodiment, a multilayer of different high-k materials is formed between the wide-band-gap insulators to substantially increase the capacitance per unit area. The layer materials and thicknesses are optimized to reduce the nonlinear capacitance dependence on voltage.