Patents by Inventor Chin-Hsing Chung

Chin-Hsing Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for improving the liquid dispensing of IC packages
    Patent number: 6395584
    Abstract: A flat plate mold with special treatment or a metallic flat plate mold is adopted to flatten the resin painted over on IC chips during package dispensing process, such that it is able to maintain a consistent flatness of the surface of IC products after dispensing for laser or ink marking. And heat sinks can be attached to the flat plate mold to increase the heat-dissipating rate of IC products after dispensing.
    Type: Grant
    Filed: December 26, 2000
    Date of Patent: May 28, 2002
    Assignee: FICTA Technology Inc.
    Inventors: Chi-Hsing Hsu, Chin-Hsing Chung, Wen-Fu Hsu
  • Method for improving the liquid dispensing of IC packages
    Publication number: 20010001070
    Abstract: A flat plate mold with special treatment or a metallic flat plate mold is adopted to flatten the resin painted over on IC chips during package dispensing process, such that it is able to maintain a consistent flatness of the surface of IC products after dispensing for laser or ink marking. And heat sinks can be attached to the flat plate mold to increase the heat-dissipating rate of IC products after dispensing.
    Type: Application
    Filed: December 26, 2000
    Publication date: May 10, 2001
    Applicant: NeoPac Semiconductor Corp.
    Inventors: Chi-Hsing Hsu, Chin-Hsing Chung, Wen-Fu Hsu