Abstract: An inductor comprises a coil, a non-ferrite layer, two electrodes, a first ferrite layer, and a second ferrite layer, where the coil is encapsulated by the non-ferrite layer having a first surface and a second surface opposite to the first surface, two electrodes coupled to the coil are respectively extended out from the non-ferrite layer for connecting a module, and the first ferrite layer and the second ferrite layer are respectively arranged adjacent to the first surface and the second surface of the non-ferrite layer.

Abstract: An inductor comprises a coil, a non-ferrite layer, two electrodes, a first ferrite layer, and a second ferrite layer, where the coil is encapsulated by the non-ferrite layer having a first surface and a second surface opposite to the first surface, two electrodes coupled to the coil are respectively extended out from the non-ferrite layer for connecting a module, and the first ferrite layer and the second ferrite layer are respectively arranged adjacent to the first surface and the second surface of the non-ferrite layer.

Abstract: A high-density power module package wherein the circuits and a part of chips of the power module are formed on respective substrates such that the circuit patterns are not influenced by the chips. Accordingly, the density of the circuit can be improved so as to save the required area of substrate and production cost.

Abstract: A chip package comprising a substrate, a lead frame, a chip, a set of bonded wires, a heat sink and a packaging material is provided. The substrate has a first metallic layer, a second metallic layer and a conductor. The first metallic layer is formed on a first surface of the substrate and the second metallic layer is formed on a second surface of the substrate. The conductor is formed on a lateral surface of the substrate. The first metallic layer is electrically connected to the second metallic layer through the conductor. The lead frame is attached on the first surface of the substrate and is electrically connected to the first metallic layer. The chip has a back surface attached to the lead frame or the first surface of the substrate. The chip is connected with the lead frame through the bonding wires. The heat sink is attached on the second surface of the substrate and electrically connected with the second metallic layer.

Abstract: A high-density power module package wherein the circuits and a part of chips of the power module are formed on respective substrates such that the circuit patterns are not influenced by the chips. Accordingly, the density of the circuit can be improved so as to save the required area of substrate and production cost.

Abstract: A high density power module package where in the circuits and a part of chips of the power module are formed on respective substrates such that the circuit patterns are not influenced by the chips. Accordingly, the density of the circuit can be improved so as to save the required area of substrate and production cost.