Abstract: A semiconductor device includes a substrate, at least one via, a liner layer and a conductive layer. The substrate includes an electronic circuitry. The at least one via passes through the substrate. The at least one via includes a plurality of concave portions on a sidewall thereof. The liner layer fills in the plurality of concave portions of the at least one via. The conductive layer is disposed on the sidewall of the at least one via, covers the liner layer, and extends onto a surface of the substrate. The thickness of the conductive layer on the sidewall of the at least one via is varied.

Abstract: A micro electro mechanical system (MEMS) includes a circuit substrate comprising electronic circuitry, a support substrate having a recess, a bonding layer disposed between the circuit substrate and the support substrate, through holes passing through the circuit substrate to the recess, a first conductive layer disposed on a front side of the circuit substrate, and a second conductive layer disposed on an inner wall of the recess. The first conductive layer extends into the through holes and the second conductive layer extends into the through holes and coupled to the first conductive layer.

Abstract: A precious metal recovery device is revealed. A robot arm holds a cover of at least one loader for opening and moving the cover so as to put an object in or move an object out the loader. The loader is a pentagonal prism with an opening on one side thereof. The area of the opening is enlarged for convenience of loading objects containing precious metal. The loader is to receive the object containing the precious metal. By means of a conveying device, the loader is carried to an immersion device, at least one dissolver and at least one water cleaning device in sequence so as to recover precious metal from the objects containing precious metal. The precious metal recovery device recovers the precious metal continuously and automatically. Therefore, the speed of precious metal recovery is improved and the amount of precious metal recovered is increased.

Abstract: The present invention provides an apparatus for recycling noble metals, which comprises one or more conveyers, one or more carriers, an immersion device, one or more dissolution devices, and one or more rinse devices. The carriers, the immersion device, the dissolution devices, and the rinse devices are arranged in U-shape. Thereby, adding an object containing noble metals or pouring the object containing noble metals can be performed on the same side of the apparatus for recycling noble metals. Hence, a user needs not to operate on both sides of the apparatus for recycling noble metals, enhancing ease of operation. The carriers carry objects containing noble metals. The conveyer is used for conveying the carriers to the immersion device, the dissolution devices, and the rinse devices sequentially for recycling noble metals from the objects containing noble metals. The apparatus according to the present invention can recycle noble metals continuously.

Abstract: The present invention provides an apparatus for recycling noble metals, which comprises a conveyer, one or more carriers, an immersion device, one or more dissolution devices, and one or more rinse devices. The carriers carry objects containing noble metals. The conveyer is used for conveying the carriers to the immersion device, the dissolution devices, and the rinse devices sequentially for recycling noble metals from the objects containing noble metals. The apparatus according to the present invention can recycle noble metals continuously. Thereby, the speed of recycling is enhanced, and the amount of recycled noble metals is increased as well.