Patents by Inventor Chin-Hsun WANG

Chin-Hsun WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250183572
    Abstract: A gold finger connector and memory storage device having the same. The gold finger connector includes a connector body; a plurality of ground pins; and at least one signal shielding structures, disposed on a first ground pin of the plurality of ground pins, wherein the at least one first signal shielding structure is connected to the outside of a first side of an extension part of the first ground pin and electrically conducts at least two layers of the first ground pin.
    Type: Application
    Filed: January 18, 2024
    Publication date: June 5, 2025
    Applicant: PHISON ELECTRONICS CORP.
    Inventors: Chin-Hsun Wang, Yong Lin Chen, Jen Chieh Wang, Yen-Wen Tseng
  • Publication number: 20240397621
    Abstract: A circuit board device includes a transition region that includes a first conductive layer at a first level, a second conductive layer at a second level, and conductive vias. The first conductive layer includes a pad connected to the solderless connector, a transmission line, and a first reference layer. The transmission line includes first and second segments. A second width of the second segment is the same as or less than a first width of the first segment. The first reference layer has a first anti-pad region for the pad and the transmission line disposed therein. In a plan view, the first anti-pad region surrounding the pad is completely located within a second anti-pad region of a second reference layer of the second conductive layer. The conductive vias are disposed between the first and second conductive layers and surround the pad.
    Type: Application
    Filed: June 30, 2023
    Publication date: November 28, 2024
    Applicants: UNIMICRON TECHNOLOGY CORP., National Taiwan University
    Inventors: Chin-Hsun WANG, Ruey-Beei WU, Chun-Jui HUANG, Wei-Yu LIAO, Ching-Sheng CHEN, Chi-Min CHANG
  • Patent number: 12133323
    Abstract: A transmission device for suppressing the glass-fiber effect includes a circuit board and a transmission line. The circuit board includes a plurality of glass fibers, so as to define a fiber pitch. The transmission line is disposed on the circuit board. The transmission line includes a plurality of non-parallel segments. Each of the non-parallel segments of the transmission line has an offset distance with respect to a reference line. The offset distance is longer than or equal to a half of the fiber pitch.
    Type: Grant
    Filed: November 23, 2022
    Date of Patent: October 29, 2024
    Assignees: UNIMICRON TECHNOLOGY CORP., NATIONAL TAIWAN UNIVERSITY
    Inventors: Chin-Hsun Wang, Ruey-Beei Wu, Ching-Sheng Chen, Chun-Jui Huang, Wei-Yu Liao, Chi-Min Chang
  • Publication number: 20240130038
    Abstract: A transmission device for suppressing the glass-fiber effect includes a circuit board and a transmission line. The circuit board includes a plurality of glass fibers, so as to define a fiber pitch. The transmission line is disposed on the circuit board. The transmission line includes a plurality of non-parallel segments. Each of the non-parallel segments of the transmission line has an offset distance with respect to a reference line. The offset distance is longer than or equal to a half of the fiber pitch.
    Type: Application
    Filed: November 23, 2022
    Publication date: April 18, 2024
    Applicants: UNIMICRON TECHNOLOGY CORP., National Taiwan University
    Inventors: Chin-Hsun WANG, Ruey-Beei Wu, Ching-Sheng Chen, Chun-Jui Hung, Wei-Yu Liao, Chi-Min Chang