Abstract: An active single-ended transmission cable is disclosed. The active single-ended transmission cable allows connection between a first and a second electronic device and comprises a first port, a second port, and a transmission wire. The first or second port is used for receiving or transmitting a differential signal between the first and the second electronic devices, and for converting between a differential signal and a single-ended signal. The transmission wire is used for transmitting the single-ended signal. This allows the conversion between the received or transmitted differential signal at the first and second ports into the single-ended signal so as to allow the transmission of the single-ended signal within the transmission wire.

Abstract: A display may include an array of pixels such as light-emitting diode pixels. The pixels may include multiple circuitry decks that each include one or more circuit components such as transistors, capacitors, and/or resistors. The circuitry decks may be vertically stacked. Each circuitry deck may include a planarization layer formed from a siloxane material that conforms to underlying components and provides a planar upper surface. In this way, circuitry components may be vertically stacked to mitigate the size of each pixel footprint. The circuitry components may include capacitors that include both a high-k dielectric layer and a low-k dielectric layer. The display pixel may include a via with a width of less than 1 micron.

Abstract: Systems and methods for customizing medical tapes from a roll stock at customer use sites are provided. The system includes a tape converting machine where an adhesion modification mechanism is configured to modify adhesion properties of the tape from the roll stock, automatically or based on received customization instructions.

Abstract: Method to form low-contact-resistance contacts to source/drain features are provided. A method of the present disclosure includes receiving a workpiece including an opening that exposes a surface of an n-type source/drain feature and a surface of a p-type source/drain feature, selectively depositing a first silicide layer on the surface of the p-type source/drain feature while the surface of the n-type source/drain feature is substantially free of the first silicide layer, depositing a metal layer on the first silicide layer and the surface of the n-type source/drain feature, and depositing a second silicide layer over the metal layer. The selectively depositing includes passivating the surface of the surface of the n-type source/drain features with a self-assembly layer, selectively depositing the first silicide layer on the surface of the p-type source/drain feature, and removing the self-assembly layer.

Abstract: The present disclosure includes: a casing with an open top; a combustion compartment including: a combustion chamber disposed inside the casing to generate a blue flame-shaped flame by burning vegetable oil; a combustion cover enclosing the combustion chamber therein, and having an inner wall spaced apart from an outer wall of the combustion chamber by a predetermined distance to form a predetermined cavity; and an air chamber disposed below the combustion cover with a lower end of the combustion chamber being positioned above, wherein the air chamber supplies outside air toward the combustion chamber during combustion of the vegetable oil; an oil tank that supplies the vegetable oil to the combustion chamber; and a control unit that controls whether or not to drive the air chamber, the flow and supply pressure of the outside air, and whether or not to supply the vegetable oil and a supply amount of the vegetable oil.

Abstract: Provided is an inductor structure and manufacturing method thereof, including forming an inductance coil in a semiconductor packaging carrier plate and disposing a patterned magnetic conductive layer in the inductance coil. Therefore, a patterned build-up wiring method is used to form a magnetic material in the carrier plate, thereby improving electrical characteristics of the inductor.

Abstract: A component-embedded packaging structure is provided, in which a plurality of metal layers are formed on an inactive surface of a semiconductor chip so as to serve as a buffer portion, and the semiconductor chip is disposed on a carrying portion with the buffer portion via an adhesive. Then, the semiconductor chip is encapsulated by an insulating layer, and a build-up circuit structure is formed on the insulating layer and electrically connected to the semiconductor chip. Therefore, the buffer portion can prevent delamination from occurring between the semiconductor chip and the adhesive on the carrying portion if the semiconductor chip has a CTE (Coefficient of Thermal Expansion) less than a CTE of the adhesive.

Abstract: A training method for video stabilization and an image processing device using the same are proposed. The method includes the following steps. An input video including low dynamic range (LDR) images is received. The LDR images are converted to high dynamic range (HDR) images by using a first neural network. A feature extraction process is performed to obtain features based on the LDR images and the HDR images. A second neural network for video stabilization is trained according to the LDR images and the HDR images based on a loss function by minimizing a loss value of the loss function to generate stabilized HDR images in a time-dependent manner, where the loss value of the loss function depends upon the features. An HDR classifier is constructed according to the LDR images and the HDR images. The stabilized HDR images are classified by using the HDR classifier to generate a reward value, where the loss value of the loss function further depends upon the reward value.

Abstract: An intermediate substrate is provided with a plurality of conductive posts and support members arranged at opposite sides of a coreless circuit structure and insulating layers encapsulating the conductive posts and the support members. Through the arrangement of the support members and the insulating layers, the intermediate substrate can meet the rigidity requirement so as to effectively resist warping and achieve an application of fine-pitch circuits.

Abstract: A flip-chip package substrate is provided. A strengthening structure is provided on one side of a circuit structure to increase the rigidity of the flip-chip package substrate. When the flip-chip package substrate is used in large-scale packaging, the flip-chip package substrate can have good rigidity, so that the electronic package can be prevented from warping.

Abstract: An intermediate substrate is provided with a plurality of conductive posts and support members arranged at opposite sides of a coreless circuit structure and insulating layers encapsulating the conductive posts and the support members. Through the arrangement of the support members and the insulating layers, the intermediate substrate can meet the rigidity requirement so as to effectively resist warping and achieve an application of fine-pitch circuits.

Abstract: A training method for video stabilization and an image processing device using the same are proposed. The method includes the following steps. An input video including low dynamic range (LDR) images is received. The LDR images are converted to high dynamic range (HDR) images by using a first neural network. A feature extraction process is performed to obtain features based on the LDR images and the HDR images. A second neural network for video stabilization is trained according to the LDR images and the HDR images based on a loss function by minimizing a loss value of the loss function to generate stabilized HDR images in a time-dependent manner, where the loss value of the loss function depends upon the features. An HDR classifier is constructed according to the LDR images and the HDR images. The stabilized HDR images are classified by using the HDR classifier to generate a reward value, where the loss value of the loss function further depends upon the reward value.

Abstract: A training method for video stabilization and an image processing device using the same are proposed. The method includes the following steps. An input video including low dynamic range (LDR) images is received. The LDR images are converted to high dynamic range (HDR) images by using a first neural network. A second neural network for video stabilization is trained to generate stabilized HDR images in a time-dependent manner.

Abstract: The present disclosure includes: a casing with an open top; a combustion compartment including: a combustion chamber disposed inside the casing to generate a blue flame-shaped flame by burning vegetable oil; a combustion cover enclosing the combustion chamber therein, and having an inner wall spaced apart from an outer wall of the combustion chamber by a predetermined distance to form a predetermined cavity; and an air chamber disposed below the combustion cover with a lower end of the combustion chamber being positioned above, wherein the air chamber supplies outside air toward the combustion chamber during combustion of the vegetable oil; an oil tank that supplies the vegetable oil to the combustion chamber; and a control unit that controls whether or not to drive the air chamber, the flow and supply pressure of the outside air, and whether or not to supply the vegetable oil and a supply amount of the vegetable oil.

Abstract: A training method for video stabilization and an image processing device using the same are proposed. The method includes the following steps. An input video including low dynamic range (LDR) images is received. The LDR images are converted to high dynamic range (HDR) images by using a first neural network. A second neural network for video stabilization is trained to generate stabilized HDR images in a time-dependent manner.

Abstract: A manufacturing method for a semiconductor package structure, which includes the steps of providing a circuit build-up substrate, which has a first surface that exposes multiple flip-chip bonding pads and multiple first bonding pads located around the flip-chip bonding pads; forming a conductive substrate embedded with a chip and multiple conductive pillars on the first surface of the circuit build-up substrate, in which the first surface of the chip is disposed corresponding to the flip-chip bonding pads and the second end of the conductive pillars is disposed corresponding to the first bonding pads; a second surface of the chip and a first end of each conductive pillars are exposed from an upper surface of the conductive substrates; and arranging a memory module on the conductive substrate, corresponding to the first end of the conductive pillars, wherein the memory module and the chip do not overlap in an orthographic projection direction.

Abstract: A method of fabricating a packaging substrate is provided, which includes: forming on a carrier a conductor layer having a plurality of openings; forming a plurality of conductive bumps on the conductor layer, wherein each of the conductive bumps has a post body disposed in a corresponding one of the openings and a conductive pad disposed on the conductor layer, the post body being integrally formed with the conductive pad and less in width than the conductive pad; forming a plurality of conductive posts on the conductive pads; forming on the carrier a first insulating layer that encapsulates the conductive bumps and the conductive posts; removing the carrier; and removing the entire conductor layer to expose the post bodies from a first surface of the first insulating layer. As such, a semiconductor chip can be bonded to the packaging substrate through the conductive bumps.

Abstract: A video processing apparatus and a video processing circuit of the video processing apparatus are provided. The video processing circuit includes a video processor, a first memory controller, a second memory controller and a distributor. The video processor includes at least one sub-processing-tasks processor which is configured to execute one or more sub-processing tasks respectively. The first memory controller controls a first memory. The second memory controller controls a second memory. The distributor stores the data outputted by the video processor to the first memory and the second memory through the first memory controller and the second memory controller respectively.

Abstract: An electronic package is provided, which includes: an insulating layer; an electronic element embedded in the insulating layer and having a sensing area exposed from the insulating layer; and a circuit layer formed on the insulating layer and electrically connected to the electronic element, thereby reducing the thickness of the overall package structure.