Patents by Inventor Chin-Hua Hung
Chin-Hua Hung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230006109Abstract: A light emitting device and a manufacturing method thereof are provided. The light emitting device includes a light emitting unit, a fluorescent layer, a reflective layer, and a light-absorbing layer. The light emitting unit has a top surface, a bottom surface opposite to the top surface, and a side surface located between the top surface and the bottom surface. The light emitting unit includes an electrode disposed at the bottom surface. The fluorescent layer is disposed on the top surface of the light emitting unit. The reflective layer covers the side surface of the light emitting unit. The light-absorbing layer covers the reflective layer, so that the reflective layer is located between the side surface of the light emitting unit and the light-absorbing layer.Type: ApplicationFiled: June 24, 2022Publication date: January 5, 2023Applicant: Genesis Photonics Inc.Inventors: Yun-Han Wang, Chin-Hua Hung, Chuan-Yu Liu, Tsai-Chieh Shih, Jui-Fu Chang, Yu-Jung Wu, Yu-Feng Lin
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Publication number: 20210159369Abstract: A light emitting device includes a wavelength conversion layer, at least one light emitting unit and a reflective protecting element. The wavelength conversion layer has an upper surface and a lower surface opposite to each other. The light emitting unit has two electrode pads located on the same side of the light emitting unit. The light emitting unit is disposed on the upper surface of the wavelength conversion layer and exposes the two electrode pads. The reflective protecting element encapsulates at least a portion of the light emitting unit and a portion of the wavelength conversion layer, and exposes the two electrode pads of the light emitting unit.Type: ApplicationFiled: February 1, 2021Publication date: May 27, 2021Applicant: Genesis Photonics Inc.Inventors: Cheng-Wei Hung, Chin-Hua Hung, Long-Chi Du, Jui-Fu Chang, Po-Tsun Kuo, Hao-Chung Lee, Yu-Feng Lin
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Patent number: 10957674Abstract: A manufacturing method is provided. The manufacturing method includes the following steps. Firstly, a substrate and a light-emitting component are provided, wherein the light-emitting component is disposed on the substrate. Then, a wavelength conversion layer is provided, wherein the wavelength conversion layer includes a high-density phosphor layer and a low-density phosphor layer. Then, the high-density phosphor layer is adhered to the light-emitting component by an adhesive. Then, a reflective layer is formed above the substrate, wherein the reflective layer covers a lateral surface of the light-emitting component, a lateral surface of the adhesive and a lateral surface of the wavelength conversion layer.Type: GrantFiled: December 2, 2019Date of Patent: March 23, 2021Assignee: GENESIS PHOTONICS INCInventors: Cheng-Wei Hung, Jui-Fu Chang, Chin-Hua Hung, Yu-Feng Lin
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Patent number: 10910523Abstract: A light emitting device includes a wavelength conversion layer, at least one light emitting unit and a reflective protecting element. The wavelength conversion layer has an upper surface and a lower surface opposite to each other. The light emitting unit has two electrode pads located on the same side of the light emitting unit. The light emitting unit is disposed on the upper surface of the wavelength conversion layer and exposes the two electrode pads. The reflective protecting element encapsulates at least a portion of the light emitting unit and a portion of the wavelength conversion layer, and exposes the two electrode pads of the light emitting unit.Type: GrantFiled: June 11, 2018Date of Patent: February 2, 2021Assignee: Genesis Photonics Inc.Inventors: Cheng-Wei Hung, Chin-Hua Hung, Long-Chi Du, Jui-Fu Chang, Po-Tsun Kuo, Hao-Chung Lee, Yu-Feng Lin
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Patent number: 10854780Abstract: A light emitting device including a light emitting unit and a phosphor resin layer is provided. The light emitting unit has a top surface and a bottom surface opposite to each other. Each of the light emitting units includes two electrodes. The two electrodes are disposed on the bottom surface. The phosphor resin layer is disposed on the top surface of the light emitting unit. One side of the phosphor resin layer has a mark. One of the two electrodes is closer to the mark with respect to the other one of the two electrodes.Type: GrantFiled: November 5, 2018Date of Patent: December 1, 2020Assignee: Genesis Photonics Inc.Inventors: Cheng-Wei Hung, Chin-Hua Hung, Xun-Xain Zhan, Chuan-Yu Liu, Yun-Chu Chen, Yu-Feng Lin
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Patent number: 10784423Abstract: A light emitting device including a first light emitting unit, a second light emitting unit, a heat dissipation substrate, a plurality of first bumps and a plurality of second bumps is provided. The heat dissipation substrate is disposed between the first light emitting unit and the second light emitting unit. The first bumps are connected between the first light emitting unit and the heat dissipation substrate. The second bumps are connected between the second light emitting unit and the heat dissipation substrate.Type: GrantFiled: November 5, 2018Date of Patent: September 22, 2020Assignee: GENESIS PHOTONICS INC.Inventors: Cheng-Wei Hung, Chin-Hua Hung, Xun-Xain Zhan, Chuan-Yu Liu, Yu-Feng Lin
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Publication number: 20200105725Abstract: A manufacturing method is provided. The manufacturing method includes the following steps. Firstly, a substrate and a light-emitting component are provided, wherein the light-emitting component is disposed on the substrate. Then, a wavelength conversion layer is provided, wherein the wavelength conversion layer includes a high-density phosphor layer and a low-density phosphor layer. Then, the high-density phosphor layer is adhered to the light-emitting component by an adhesive. Then, a reflective layer is formed above the substrate, wherein the reflective layer covers a lateral surface of the light-emitting component, a lateral surface of the adhesive and a lateral surface of the wavelength conversion layer.Type: ApplicationFiled: December 2, 2019Publication date: April 2, 2020Inventors: Cheng-Wei Hung, Jui-Fu Chang, Chin-Hua Hung, Yu-Feng Lin
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Publication number: 20200083419Abstract: A light emitting device including a light emitting unit, two electrodes, a reflective member, and a light transmissive member is provided. The two electrodes are disposed on one side of the light emitting unit, and electrically connected to the light emitting unit. The reflective member is disposed on the other side of the light emitting unit, and has at least one reflective surface. The light transmissive member is disposed between the reflective member and the light emitting unit, and covers a part of the light emitting unit. A lateral surface of the light transmissive member is served as a light emitting surface of the light emitting device. A manufacturing method of a light emitting device is also provided.Type: ApplicationFiled: August 19, 2019Publication date: March 12, 2020Applicant: Genesis Photonics Inc.Inventors: Yun-Han Wang, Chin-Hua Hung, Jui-Fu Chang, Chuan-Yu Liu, Yu-Feng Lin, Cheng-Wei Hung, Jian-Xiang Huang, Po-Hsiang Wang
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Publication number: 20190371983Abstract: A manufacturing method of a light-emitting device is provided. A substrate and a light-emitting component disposed on the substrate are provided. A translucent layer is provided. The translucent layer is connected with the light-emitting component by an adhesive layer. A reflective layer is formed above the substrate, wherein the reflective layer covers a lateral surface of the light-emitting component, a lateral surface of the adhesive layer and a lateral surface of the translucent layer. A translucent encapsulant is formed on the substrate to encapsulate the light-emitting component, the translucent layer and the reflective layer.Type: ApplicationFiled: August 19, 2019Publication date: December 5, 2019Inventors: Chin-Hua Hung, Cheng-Wei Hung, Yu-Feng Lin, Cheng-Chuan Chen
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Patent number: 10497681Abstract: A light-emitting device includes a substrate, a light-emitting component, a wavelength conversion component, an adhesive and a reflective layer. The light-emitting component is disposed on the substrate. The wavelength conversion component includes a high-density phosphor layer and a lower-density phosphor layer. The adhesive is formed between the light-emitting device and the high-density phosphor layer. The reflective layer is formed above the substrate and covers a lateral surface of the light-emitting component, a lateral surface of the adhesive and a lateral surface of the wavelength conversion component.Type: GrantFiled: March 19, 2018Date of Patent: December 3, 2019Assignee: GENESIS PHOTONICS INC.Inventors: Cheng-Wei Hung, Jui-Fu Chang, Chin-Hua Hung, Yu-Feng Lin
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Patent number: 10388838Abstract: A light-emitting device includes a substrate, a light-emitting component, a translucent layer, an adhesive layer, a reflective layer and translucent encapsulant. The light-emitting component is disposed on the substrate. The adhesive layer is formed between the light-emitting component and the translucent layer. The reflective layer is formed above the substrate and covering a lateral surface of the light-emitting component, a lateral surface of the adhesive layer and a lateral surface of the translucent layer. The translucent encapsulant is formed on the substrate and encapsulating the light-emitting component, the translucent layer and the reflective layer.Type: GrantFiled: October 19, 2017Date of Patent: August 20, 2019Assignee: GENESIS PHOTONICS INC.Inventors: Chin-Hua Hung, Cheng-Wei Hung, Yu-Feng Lin, Cheng-Chuan Chen
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Publication number: 20190165232Abstract: A light emitting device including a first light emitting unit, a second light emitting unit, a heat dissipation substrate, a plurality of first bumps and a plurality of second bumps is provided. The heat dissipation substrate is disposed between the first light emitting unit and the second light emitting unit. The first bumps are connected between the first light emitting unit and the heat dissipation substrate. The second bumps are connected between the second light emitting unit and the heat dissipation substrate.Type: ApplicationFiled: November 5, 2018Publication date: May 30, 2019Inventors: Cheng-Wei Hung, Chin-Hua Hung, Xun-Xain Zhan, Chuan-Yu Liu, Yu-Feng Lin
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Publication number: 20190157503Abstract: A light emitting device including a light emitting unit and a phosphor resin layer is provided. The light emitting unit has a top surface and a bottom surface opposite to each other. Each of the light emitting units includes two electrodes. The two electrodes are disposed on the bottom surface. The phosphor resin layer is disposed on the top surface of the light emitting unit. One side of the phosphor resin layer has a mark. One of the two electrodes is closer to the mark with respect to the other one of the two electrodes.Type: ApplicationFiled: November 5, 2018Publication date: May 23, 2019Applicant: Genesis Photonics Inc.Inventors: Cheng-Wei Hung, Chin-Hua Hung, Xun-Xain Zhan, Chuan-Yu Liu, Yun-Chu Chen, Yu-Feng Lin
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Publication number: 20180294388Abstract: A light emitting device includes a wavelength conversion layer, at least one light emitting unit and a reflective protecting element. The wavelength conversion layer has an upper surface and a lower surface opposite to each other. The light emitting unit has two electrode pads located on the same side of the light emitting unit. The light emitting unit is disposed on the upper surface of the wavelength conversion layer and exposes the two electrode pads. The reflective protecting element encapsulates at least a portion of the light emitting unit and a portion of the wavelength conversion layer, and exposes the two electrode pads of the light emitting unit.Type: ApplicationFiled: June 11, 2018Publication date: October 11, 2018Applicant: Genesis Photonics Inc.Inventors: Cheng-Wei Hung, Chin-Hua Hung, Long-Chi Du, Jui-Fu Chang, Po-Tsun Kuo, Hao-Chung Lee, Yu-Feng Lin
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Patent number: 10090445Abstract: A package method includes steps of providing a light emitting module, a mold and a molding compound, wherein the light emitting module includes a substrate and at least one light emitting unit disposed on the substrate, the mold has at least one recess, and a side wall of the recess is parallel to a side surface of the light emitting unit; filling the recess with the molding compound; placing the substrate on the mold reversely, so that the light emitting unit is immersed into the recess and the molding compound directly encapsulates the light emitting unit; and heating and pressing the substrate and the mold, so as to solidify the molding compound.Type: GrantFiled: June 19, 2017Date of Patent: October 2, 2018Assignee: GENESIS PHOTONICS INC.Inventors: Chin-Hua Hung, Hao-Chung Lee, Yu-Feng Lin
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Publication number: 20180261572Abstract: A manufacturing method of a semiconductor light-emitting device is provided. Steps of the manufacturing method includes: providing a substrate; placing at least one light-emitting unit on the substrate; encapsulating the at least one light-emitting unit onto the substrate by a phosphor layer and a reflective layer. The phosphor layer at least covers an upper surface of the at least one light-emitting unit, and the reflective layer surrounds the at least one light-emitting unit.Type: ApplicationFiled: May 8, 2018Publication date: September 13, 2018Applicant: Genesis Photonics Inc.Inventors: Chin-Hua Hung, Yu-Feng Lin, Cheng-Wei Hung, Hao-Chung Lee, Xun-Xain Zhan
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Publication number: 20180211942Abstract: A light-emitting device includes a substrate, a light-emitting component, a wavelength conversion component, an adhesive and a reflective layer. The light-emitting component is disposed on the substrate. The wavelength conversion component includes a high-density phosphor layer and a lower-density phosphor layer. The adhesive is formed between the light-emitting device and the high-density phosphor layer. The reflective layer is formed above the substrate and covers a lateral surface of the light-emitting component, a lateral surface of the adhesive and a lateral surface of the wavelength conversion component.Type: ApplicationFiled: March 19, 2018Publication date: July 26, 2018Inventors: Cheng-Wei Hung, Jui-Fu Chang, Chin-Hua Hung, Yu-Feng Lin
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Patent number: 10032747Abstract: A light emitting diode package structure and a manufacturing method thereof are disclosed. The light emitting diode package structure includes a carrier substrate, a electrostatic protection component, and a light-emitting diode (LED). The carrier substrate has a first conductive pad and a second conductive pad. The electrostatic protection component is disposed on the carrier substrate and has a first electrode and a second electrode, wherein the first electrode and the second electrode are electrically connected to the first conductive pad and the second conductive pad respectively. The LED is disposed on the electrostatic protection component and has a third electrode and a fourth electrode, wherein the third electrode and the fourth electrode are electrically connected to the first conductive pad and the second conductive pad respectively.Type: GrantFiled: March 18, 2016Date of Patent: July 24, 2018Assignee: GENESIS PHOTONICS INC.Inventors: Chin-Hua Hung, Yu-Feng Lin
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Patent number: 9997676Abstract: A light emitting device includes a wavelength conversion layer, at least one light emitting unit and a reflective protecting element. The wavelength conversion layer has an upper surface and a lower surface opposite to each other. The light emitting unit has two electrode pads located on the same side of the light emitting unit. The light emitting unit is disposed on the upper surface of the wavelength conversion layer and exposes the two electrode pads. The reflective protecting element encapsulates at least a portion of the light emitting unit and a portion of the wavelength conversion layer, and exposes the two electrode pads of the light emitting unit.Type: GrantFiled: September 19, 2016Date of Patent: June 12, 2018Assignee: Genesis Photonics Inc.Inventors: Cheng-Wei Hung, Chin-Hua Hung, Long-Chi Du, Jui-Fu Chang, Po-Tsun Kuo, Hao-Chung Lee, Yu-Feng Lin
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Publication number: 20180138378Abstract: A light-emitting device includes a substrate, a light-emitting component, a translucent layer, an adhesive layer, a reflective layer and translucent encapsulant. The light-emitting component is disposed on the substrate. The adhesive layer is formed between the light-emitting component and the translucent layer. The reflective layer is formed above the substrate and covering a lateral surface of the light-emitting component, a lateral surface of the adhesive layer and a lateral surface of the translucent layer. The translucent encapsulant is formed on the substrate and encapsulating the light-emitting component, the translucent layer and the reflective layer.Type: ApplicationFiled: October 19, 2017Publication date: May 17, 2018Inventors: Chin-Hua Hung, Cheng-Wei Hung, Yu-Feng Lin, Cheng-Chuan Chen