Abstract: A method includes forming a set of through-vias in a substrate, the set of through-vias partially penetrating a thickness of the substrate. First connectors are formed over the set of through-vias on a first side of the substrate. The first side of the substrate is attached to a carrier. The substrate is thinned from the second side to expose the set of through-vias. Second connectors are formed over the set of through-vias on the second side of the substrate. A device die is bonded to the second connectors. The substrate is singulated into multiple packages.

Abstract: A method includes forming a set of through-vias in a substrate, the set of through-vias partially penetrating a thickness of the substrate. First connectors are formed over the set of through-vias on a first side of the substrate. The first side of the substrate is attached to a carrier. The substrate is thinned from the second side to expose the set of through-vias. Second connectors are formed over the set of through-vias on the second side of the substrate. A device die is bonded to the second connectors. The substrate is singulated into multiple packages.

Abstract: A method includes forming a set of through-vias in a substrate, the set of through-vias partially penetrating a thickness of the substrate. First connectors are formed over the set of through-vias on a first side of the substrate. The substrate is singulated to form dies. The first side of the dies are attached to a carrier. The dies are thinned from the second side to expose the set of through-vias. Second connectors are formed over the set of through-vias on the second side of the dies. A device die is bonded to the second connectors. The dies and device dies are singulated into multiple packages.

Abstract: A control assembly includes two controllers and a retractable and foldable mechanism, the retractable and foldable mechanism includes two retractable parts and a central part, and the two controllers are respectively movably connected to two opposite ends of the central part via the two retractable parts.

Abstract: A microstrip antenna having a slot structure is disclosed for providing a sufficient bandwidth so as to meet the antenna requirements. The microstrip antenna is composed of a base board (such as a printed circuit board) and a microstrip patch radiator having the slot structure, wherein the microstrip patch radiator is formed on the base board. The slot structure is composed of an L-shaped slot and an inverted reversed-L-shaped slot, wherein the L-shaped slot and the inverted reversed-L-shaped slot are mirror-reflected to each other symmetrically to a point. One end of each of the L-shaped and inverted reversed-L-shaped slots is connected to an extension slot.

Abstract: A microstrip antenna having a slot structure is disclosed for providing a sufficient bandwidth so as to meet the antenna requirements. The microstrip antenna is composed of a base board (such as a printed circuit board) and a microstrip patch radiator having the slot structure, wherein the microstrip patch radiator is formed on the base board. The slot structure is composed of a T-shaped slot, an L-shaped slot and a reversed-L-shaped slot, wherein the L-shaped slot and the reversed-L-shaped slot are mirror-reflected to each other.

Abstract: A microstrip antenna having a slot structure is disclosed for providing a sufficient bandwidth so as to meet the antenna requirements. The microstrip antenna is composed of a base board (such as a printed circuit board) and a microstrip patch radiator having the slot structure, wherein the microstrip patch radiator is formed on the base board. The slot structure is composed of an L-shaped slot and an inverted reversed-L-shaped slot, wherein the L-shaped slot and the inverted reversed-L-shaped slot are mirror-reflected to each other symmetrically to a point. One end of each of the L-shaped and inverted reversed-L-shaped slots is connected to an extension slot.

Abstract: A microstrip antenna having a slot structure is disclosed for providing a sufficient bandwidth so as to meet the antenna requirements. The microstrip antenna is composed of a base board (such as a printed circuit board) and a microstrip patch radiator having the slot structure, wherein the microstrip patch radiator is formed on the base board. The slot structure is composed of an L-shaped slot and an inverted reversed-L-shaped slot, wherein the L-shaped slot and the inverted reversed-L-shaped slot are mirror-reflected to each other symmetrically to a point. One end of each of the L-shaped and inverted reversed-L-shaped slots is connected to an extension slot.

Abstract: A microstrip antenna having a slot structure is disclosed for providing a sufficient bandwidth so as to meet the antenna requirements. The microstrip antenna is composed of a base board (such as a printed circuit board) and a microstrip patch radiator having the slot structure, wherein the microstrip patch radiator is formed on the base board. The slot structure is composed of a T-shaped slot, an L-shaped slot and a reversed-L-shaped slot, wherein the L-shaped slot and the reversed-L-shaped slot are mirror-reflected to each other.