Abstract: A method of manufacturing a semiconductor device includes: providing a substrate, the substrate defining a logic region and a memory region; depositing a bottom electrode layer across the logic region and the memory region; depositing a magnetic tunnel junction (MTJ) layer over the bottom electrode layer; depositing a first conductive layer over the MTJ layer; depositing a sacrificial layer over the first conductive layer; etching the sacrificial layer in the memory region to expose the first conductive layer in the memory region while keeping the first conductive layer in the logic region covered; depositing a second conductive layer in the memory region and the logic region; patterning the second conductive layer to expose the MTJ layer in the memory region; and etching the patterned second conductive layer and the MTJ layer to form a top electrode and an MTJ, respectively, in the memory region.

Abstract: A semiconductor process system includes a process chamber. The process chamber includes a wafer support configured to support a wafer. The system includes a bell jar configured to be positioned over the wafer during a semiconductor process. The interior surface of the bell jar is coated with a rough coating. The rough coating can include zirconium.

Abstract: A card connector includes a base member including a bottom wall, two opposite sidewalls, a first space and a second space defined between the two sidewalls at different elevations and disposed in communication with each other and an identification terminal that has an actuation segment upwardly backwardly extended from the bottom wall, conducting terminals mounted in the base member, and a cover member including a mating conduction terminal that has a falling segment downwardly extended from a top portion of the cover member and a horizontal segment horizontally extended from the distal end of the falling segment and suspended below the distal end of the actuation segment of the identification terminal so that the identification terminal is pressable downward into contact with the mating conduction terminal upon insertion of a predetermined card.

Abstract: A micro reactor having micro flow-guiding blocks includes a first gas flow channel, a second gas flow channel and a catalytic converter. There are several flow-guiding portions disposed on the first gas flow channel. Each flow-guiding portion has micro flow-guiding blocks, flow-impact recesses, and catalytic portions. The function of the micro flow-guiding block is to guide a flowing direction of the flow toward the catalytic portion on the flow-impact recess in order to increase a possibility of contacting and chemical reaction with the catalytic portion. So, guiding the flow direction toward the catalytic portion can increase the overall reaction efficiency. More turbulence is generated to obtain a better mixing. Plus, its structure is simple.

Abstract: A micro reactor having micro flow-guiding blocks includes a first gas flow channel, a second gas flow channel and a catalytic converter. There are several flow-guiding portions disposed on the first gas flow channel. Each flow-guiding portion has micro flow-guiding blocks, flow-impact recesses, and catalytic portions. The function of the micro flow-guiding block is to guide a flowing direction of the flow toward the catalytic portion on the flow-impact recess in order to increase a possibility of contacting and chemical reaction with the catalytic portion. So, guiding the flow direction toward the catalytic portion can increase the overall reaction efficiency. More turbulence is generated to obtain a better mixing. Plus, its structure is simple.

Abstract: A thin-film detecting device includes a plate set and a thin-film detecting portion especially for fuel cell, steam reformer and the like. This plate set has a first plate and a second plate. Each first plate has an inner surface, an outer surface, at least one channel, a gas inlet and a gas outlet. The thin-film detecting portion is disposed between the first plate and the second plate. This thin-film detecting portion is deformable and has at least one sensor. Each sensor has a connecting line extending from the sensor to a controller. About this invention, its structure is simple. It is easy to install. The exchangeability is high. And, it can be disposed on a specific position easily.