Patents by Inventor Chin-Hua Yang

Chin-Hua Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11990418
    Abstract: A method for forming a chip package structure is provided. The method includes removing a first portion of a substrate to form a first recess in the substrate. The method includes forming a buffer structure in the first recess. A first Young's modulus of the buffer structure is less than a second Young's modulus of the substrate. The method includes forming a first wiring structure over the buffer structure and the substrate. The method includes bonding a chip package to the first wiring structure. The chip package has an interposer substrate and a chip structure over the interposer substrate, and a first corner of the interposer substrate and a second corner of the chip structure overlap the buffer structure in a top view of the chip package and the buffer structure.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: May 21, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chin-Hua Wang, Po-Chen Lai, Ping-Tai Chen, Che-Chia Yang, Yu-Sheng Lin, Po-Yao Lin, Shin-Puu Jeng
  • Publication number: 20240088061
    Abstract: A method includes forming a first dielectric layer, forming a first redistribution line comprising a first via extending into the first dielectric layer, and a first trace over the first dielectric layer, forming a second dielectric layer covering the first redistribution line, and patterning the second dielectric layer to form a via opening. The first redistribution line is revealed through the via opening. The method further includes forming a second via in the second dielectric layer, and a conductive pad over and contacting the second via, and forming a conductive bump over the conductive pad. The conductive pad is larger than the conductive bump, with a first center of conductive pad being offsetting from a second center of the conductive bump. The second via is further offset from the second center of the conductive bump.
    Type: Application
    Filed: November 22, 2023
    Publication date: March 14, 2024
    Inventors: Shu-Shen Yeh, Che-Chia Yang, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng, Chia-Hsiang Lin
  • Patent number: 11717069
    Abstract: The present invention discloses a draw bar structure with a multifunctional bracket and a multifunctional suitcase. The draw bar structure with the multifunctional bracket includes a draw bar body. A bracket fixing seat is transversely arranged between two draw bars of the draw bar body; the multifunctional bracket is fixed on the bracket fixing seat and positioned between the two draw bars; the multifunctional bracket is of a foldable structure; and the multifunctional bracket at least has one functional surface after unfolded. In the draw bar structure with the multifunctional bracket and the multifunctional suitcase in the present application, the multifunctional bracket is added on the draw bars, so that use convenience is brought to a user, and overall sense of line and attractive appearance of the suitcase are not affected.
    Type: Grant
    Filed: May 28, 2021
    Date of Patent: August 8, 2023
    Assignee: TAIXIN (SUZHOU) TRAVEL ACCESSORIES CO., LTD.
    Inventors: I-hsuan Weng, Po-Lun Chi, Chin-hua Yang
  • Publication number: 20210282520
    Abstract: The present invention discloses a draw bar structure with a multifunctional bracket and a multifunctional suitcase. The draw bar structure with the multifunctional bracket includes a draw bar body. A bracket fixing seat is transversely arranged between two draw bars of the draw bar body; the multifunctional bracket is fixed on the bracket fixing seat and positioned between the two draw bars; the multifunctional bracket is of a foldable structure; and the multifunctional bracket at least has one functional surface after unfolded. In the draw bar structure with the multifunctional bracket and the multifunctional suitcase in the present application, the multifunctional bracket is added on the draw bars, so that use convenience is brought to a user, and overall sense of line and attractive appearance of the suitcase are not affected.
    Type: Application
    Filed: May 28, 2021
    Publication date: September 16, 2021
    Inventors: I-hsuan Weng, Po-Lun Chi, Chin-hua Yang
  • Publication number: 20050250412
    Abstract: A collapsible and inflatable fabric-covered toy figure having a fabric casing and a collapsible and inflatable inner tube therewithin. The fabric casing has a bottom opening through which the inner tube can be inserted into the fabric casing. The fabric casing has a head and torso portion while the inner tube has a top portion and a bottom portion conforming to the contours of the head and torso portions of the fabric casing, respectively. An air inlet is placed near the bottom of the inner tube. The inner tube has a flat bottom on which the inner tube or the toy figure can stand up. The head portion of the casing may additional have a pair eyes, nose, beard, and ears. Arm appendages with compressible padding materials are attached on the fabric casing, whereby after manufacturing the inner tube can be deflated and detached from the fabric casing for the ease of packing, storing, and transporting. When use, consumers can inflate the inner tube and put the fabric casing onto the inner tube for entertainment.
    Type: Application
    Filed: May 5, 2004
    Publication date: November 10, 2005
    Inventor: Chin-Hua Yang