Patents by Inventor Chin Huang Cheng

Chin Huang Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8400360
    Abstract: A loop antenna for communication is provided, which includes a microwave substrate, being a hexahedron; a first conductive layer, disposed on an upper surface of the substrate for forming a first loop; a second conductive layer, disposed on a first side surface of the substrate, and electrically connected to a feed-in point and a ground point; and a third conductive layer, disposed on a lower surface of the substrate for forming a second loop. The first conductive layer and the second conductive layer are electrically connected at the junction between the upper surface and the first side surface, and the second conductive layer and the third conductive layer are electrically connected at the junction between the first side surface and the lower surface. The antenna also has an appropriate bandwidth for wireless communication application.
    Type: Grant
    Filed: January 16, 2009
    Date of Patent: March 19, 2013
    Assignee: Inpaq Technology Co., Ltd.
    Inventors: Yueh-Lin Tsai, Meng Hsueh Tsai, Chin Huang Cheng
  • Publication number: 20100007575
    Abstract: A loop antenna for communication is provided, which includes a microwave substrate, being a hexahedron; a first conductive layer, disposed on an upper surface of the substrate for forming a first loop; a second conductive layer, disposed on a first side surface of the substrate, and electrically connected to a feed-in point and a ground point; and a third conductive layer, disposed on a lower surface of the substrate for forming a second loop. The first conductive layer and the second conductive layer are electrically connected at the junction between the upper surface and the first side surface, and the second conductive layer and the third conductive layer are electrically connected at the junction between the first side surface and the lower surface. The antenna also has an appropriate bandwidth for wireless communication application.
    Type: Application
    Filed: January 16, 2009
    Publication date: January 14, 2010
    Inventors: Yueh-Lin TSAI, Meng Hsueh TSAI, Chin Huang CHENG