Abstract: A semiconductor device includes a substrate, a dielectric layer and a floating gate. The dielectric layer disposed on the substrate. The floating gate disposed on the dielectric layer. After a first programming process, the floating gate is configured to store first electrons that are to be combined with ions from the dielectric layer. After a second programming process, the floating gate is configured to store second electrons, and a number of the second electrons is larger than a number of the first electrons.

Abstract: A semiconductor device includes a substrate, a dielectric layer and a floating gate. The dielectric layer disposed on the substrate. The floating gate disposed on the dielectric layer. After a first programming process, the floating gate is configured to store first electrons that are to be combined with ions from the dielectric layer. After a second programming process, the floating gate is configured to store second electrons, and a number of the second electrons is larger than a number of the first electrons.

Abstract: Some embodiments regard a memory array that has a plurality of eFuse memory cells arranged in rows and columns, a plurality of bit lines, and a plurality of word lines. A column includes a bit line selector, a bit line coupled to the bit line selector, and a plurality of eFuse memory cells. An eFuse memory cell of the column includes a PMOS transistor and an eFuse. A drain of the PMOS transistor is coupled to a first end of the eFuse. A gate of the PMOS transistor is coupled to a word line. A source of the PMOS transistor is coupled to the bit line of the column.

Abstract: Some embodiments regard a memory array that has a plurality of eFuse memory cells arranged in rows and columns, a plurality of bit lines, and a plurality of word lines. A column includes a bit line selector, a bit line coupled to the bit line selector, and a plurality of eFuse memory cells. An eFuse memory cell of the column includes a PMOS transistor and an eFuse. A drain of the PMOS transistor is coupled to a first end of the eFuse. A gate of the PMOS transistor is coupled to a word line. A source of the PMOS transistor is coupled to the bit line of the column.

Abstract: A sense amplifier comprising a sense output circuit for providing a sense output signal and a logical inverse of the sense output signal based on a sense signal of a memory circuit, a charge control circuit for providing a precharge signal based on the output of the sense output circuit and a sense enable signal, a latch control circuit for providing control of a latch circuit based on the sense signal, the precharge signal and the logical inverse of the sense output signal, wherein when the sense signal is read, the latch control circuit provides one or more predetermined signals to the latch circuit to latch the sense signal to a logical level.

Abstract: A method of embedding the forming of peripheral devices such as HV-LDMOS into the forming of flash memory is presented. A layered structure is formed with a first insulating layer formed on a substrate, and a poly silicon formed on the first insulating layer in the flash memory region. A mask layer is formed. Openings are formed in the flash memory region in the peripheral region. A local oxidation of silicon (LOCOS) is performed to form thick oxides on poly silicon, and a field oxide on silicon substrate respectively. The mask layer is removed. A control gate and a control gate oxide are formed on the thick oxide and the poly silicon. A gate electrode is formed with at least one end residing on a field oxide so that the resulting HV-LDMOS has a high breakdown voltage. Spacers and a source/drain of the flash cells and HV-LDMOSs are then formed.

Abstract: A sense amplifier comprising a sense output circuit for providing a sense output signal and a logical inverse of the sense output signal based on a sense signal of a memory circuit, a charge control circuit for providing a precharge signal based on the output of the sense output circuit and a sense enable signal, a latch control circuit for providing control of a latch circuit based on the sense signal, the precharge signal and the logical inverse of the sense output signal, wherein when the sense signal is read, the latch control circuit provides one or more predetermined signals to the latch circuit to latch the sense signal to a logical level.

Abstract: A method of embedding the forming of peripheral devices such as HV-LDMOS into the forming of flash memory is presented. A layered structure is formed with a first insulating layer formed on a substrate, and a poly silicon formed on the first insulating layer in the flash memory region. A mask layer is formed. Openings are formed in the flash memory region in the peripheral region. A local oxidation of silicon (LOCOS) is performed to form thick oxides on poly silicon, and a field oxide on silicon substrate respectively. The mask layer is removed. A control gate and a control gate oxide are formed on the thick oxide and the poly silicon. A gate electrode is formed with at least one end residing on a field oxide so that the resulting HV-LDMOS has a high breakdown voltage. Spacers and a source/drain of the flash cells and HV-LDMOSs are then formed.

Abstract: A method of embedding the forming of peripheral devices such as HV-LDMOS into the forming of flash memory is presented. A layered structure is formed with a first insulating layer formed on a substrate, and a poly silicon formed on the first insulating layer in the flash memory region. A mask layer is formed. Openings are formed in the flash memory region in the peripheral region. A local oxidation of silicon (LOCOS) is performed to form thick oxides on poly silicon, and a field oxide on silicon substrate respectively. The mask layer is removed. A control gate and a control gate oxide are formed on the thick oxide and the poly silicon. A gate electrode is formed with at least one end residing on a field oxide so that the resulting HV-LDMOS has a high breakdown voltage. Spacers and a source/drain of the flash cells and HV-LDMOSs are then formed.

Abstract: The present invention discloses a memory device that includes a first memory cell array for storing one or more codes; a second memory cell array for storing one or more data, which are updated substantially more frequently than the codes; and a third memory cell array for storing address mapping information that indicates one or more locations of one or more memory cells in the second memory cell array. The second memory cell array endures substantially more programming cycles than the first memory cell array does.

Abstract: The present invention discloses a memory device that includes a first memory cell array for storing one or more codes; a second memory cell array for storing one or more data, which are updated substantially more frequently than the codes; and a third memory cell array for storing address mapping information that indicates one or more locations of one or more memory cells in the second memory cell array. The second memory cell array endures substantially more programming cycles than the first memory cell array does.

Abstract: This invention provides a memory array and it support signals and a method for byte access for programming, erasing and reading memory cells. The advantage of this array and method is the ability to access bytes for program, erase, and read operations. This array and method uses an added isolation transistor to isolate the high voltage from the unselected byte. In addition, it utilizes a separate source line for each byte in a row. This source line is also shared by a byte in a different row. The array has very little peripheral circuit overhead requirement and it avoids programming disturbances of unselected memory cells.

Abstract: This invention provides a circuit and a method for limiting the power consumed by memory array sense amplifiers while enhancing the speed of memory systems. It provides a circuit and a method which automatically limits the precharge time and voltage, which limits the power consumed and speeds the voltage transitions. The invention automatically disables the data line precharge right after achieving the trip point of the first inverter of the sense output circuit. This is the essence of the automatic saving of power consumption. In addition, the circuit and method of this invention provide for faster access speed, since the data line precharge and voltage swing are limited. Also, the circuit and method of this invention allow for smaller integrated circuit layout area due to no required reference circuit and no required circuit for generating the precharge period.

Abstract: A method of embedding the forming of peripheral devices such as HV-LDMOS into the forming of flash memory is presented. A layered structure is formed with a first insulating layer formed on a substrate, and a poly silicon formed on the first insulating layer in the flash memory region. A mask layer is formed. Openings are formed in the flash memory region in the peripheral region. A local oxidation of silicon (LOCOS) is performed to form thick oxides on poly silicon, and a field oxide on silicon substrate respectively. The mask layer is removed. A control gate and a control gate oxide are formed on the thick oxide and the poly silicon. A gate electrode is formed with at least one end residing on a field oxide so that the resulting HV-LDMOS has a high breakdown voltage. Spacers and a source/drain of the flash cells and HV-LDMOSs are then formed.

Abstract: A flash memory cell of an EEPROM split-gate flash memory, the memory cell including a substrate having a plurality of active regions, and a floating gate structure disposed over the substrate. The floating gate structure extends across at least three of the active regions of the substrate such that the floating gate structure and the at least three active regions define at least two channel regions dedicated for programming.

Abstract: This invention provides a circuit and a method for limiting the power consumed by memory array sense amplifiers while enhancing the speed of memory systems. It provides a circuit and a method which automatically limits the precharge time and voltage, which limits the power consumed and speeds the voltage transitions. The invention automatically disables the data line precharge right after achieving the trip point of the first inverter of the sense output circuit. This is the essence of the automatic saving of power consumption. In addition, the circuit and method of this invention provide for faster access speed, since the data line precharge and voltage swing are limited. Also, the circuit and method of this invention allow for smaller integrated circuit layout area due to no required reference circuit and no required circuit for generating the precharge period.

Abstract: A flash memory cell of an EEPROM split-gate flash memory, the memory cell including a substrate having a plurality of active regions, and a floating gate structure disposed over the substrate. The floating gate structure extends across at least three of the active regions of the substrate such that the floating gate structure and the at least three active regions define at least two channel regions dedicated for programming.

Abstract: This invention provides a memory array and it support signals and a method for byte access for programming, erasing and reading memory cells. The advantage of this array and method is the ability to access bytes for program, erase, and read operations. This array and method uses an added isolation transistor to isolate the high voltage from the unselected byte. In addition, it utilizes a separate source line for each byte in a row. This source line is also shared by a byte in a different row. The array has very little peripheral circuit overhead requirement and it avoids programming disturbances of unselected memory cells.