Patents by Inventor Chin-Huei Yen

Chin-Huei Yen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220332981
    Abstract: The present disclosure provides a hot melt tape at least including a substrate, an adhesive layer, and an anti-sticking layer, wherein the anti-sticking layer is adjacent to the adhesive layer and is the outermost layer of the hot melt tape. The hot melt tape may be used to seal objects, and preferably is made of a multilayer co-extrusion process. The anti-sticking layer prevents the hot melt tape from sticking the objects without needing a release film, and the hot melt tape can be directly heated during sealing the objects.
    Type: Application
    Filed: April 1, 2022
    Publication date: October 20, 2022
    Inventors: Hung-Wei Pan, Tai-Shen Hsiao, Chin-Huei Yen
  • Publication number: 20180009209
    Abstract: The invention provides a cover tape and the method for manufacturing the same. The cover tape comprises an antistatic layer, two intermediate layers, a base layer, two tie layers and a heat seal layer. These seven layers are formed by a co-extrusion process.
    Type: Application
    Filed: June 23, 2017
    Publication date: January 11, 2018
    Inventors: Hung-Wei Pan, Li-Sheng Hsu, Chin-Huei Yen
  • Publication number: 20150016117
    Abstract: A wide-angle light emitting diode bulb comprises a LED chip module, a LED driver component for provide power, and a lamp cup for housing the LED chip module and the LED driver component. Main portion of light emitted from the LED chip is through the lamp cover out but a portion of LED light is scatted by the diffused powder on the lamp cover and through the apertures at the lamp cup out to light the ceiling when the LED bulb lit. The diffused powders are in-situ doped during manufacturing the lamp cover. The apertures are hided at the cabin-shaped recesses of the lamp cup.
    Type: Application
    Filed: July 10, 2014
    Publication date: January 15, 2015
    Inventors: Cheng-Che Tsai, Tsung-Mo Hsu, Chin-Huei YEN
  • Publication number: 20130116371
    Abstract: A composition of thermally conductive flame-retarded plastic comprises of: (A) 5 wt % to 45 wt % of polyolefines; (B) 3 wt % to 25 wt % of thermoplastic elastomer; (C) 35 wt % to 85 wt % of thermal conductive fillers; (D) 5 wt % to 55 wt % of flame retardant additive free of halogen, phosphorus and nitrogen; and (E) 0.5 wt % to 6 wt % of coupling agents. The composition exhibits high surface impedance and meets at least the UL94 V1 rating. The composition has a thermal conductivity greater than 1.0 Watts/m-K, a heat deflection temperature greater than 105° C. Besides, the composition is easy to mold and can be made by the method of injection, extrusion or thermoforming.
    Type: Application
    Filed: April 30, 2012
    Publication date: May 9, 2013
    Applicant: KENNER MATERIAL & SYSTEM CO., LTD.
    Inventors: Hyurin Oktavia, Chin-Huei Yen
  • Publication number: 20040116571
    Abstract: A heat transfer material includes thermoplastic elastomer such as styrenic block copolymer, oil and fillers, and has a composite heat transfer coefficient greater than 0.8 watts/m-K. The material is easily conformable to irregularly shaped surfaces and has low thermal impedance values less than 0.1K-in2/W at 0.5 MPa mounting pressure. The material has a good dry-out performance of less than 0.15% at 70° C., 240 hours, which are better than the existing thermal conductive grease. More particularly, the material has excellent re-usability.
    Type: Application
    Filed: December 12, 2002
    Publication date: June 17, 2004
    Inventors: Yung-Ming Su, Chin-Huei Yen