Patents by Inventor Chin-Hui PAN

Chin-Hui PAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11942403
    Abstract: In an embodiment, a package includes: an interposer having a first side; a first integrated circuit device attached to the first side of the interposer; a second integrated circuit device attached to the first side of the interposer; an underfill disposed beneath the first integrated circuit device and the second integrated circuit device; and an encapsulant disposed around the first integrated circuit device and the second integrated circuit device, a first portion of the encapsulant extending through the underfill, the first portion of the encapsulant physically disposed between the first integrated circuit device and the second integrated circuit device, the first portion of the encapsulant being planar with edges of the underfill and edges of the first and second integrated circuit devices.
    Type: Grant
    Filed: November 4, 2022
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Chien Pan, Li-Hui Cheng, Chin-Fu Kao, Szu-Wei Lu
  • Publication number: 20240079399
    Abstract: A package structure and methods of forming a package structure are provided. The package structure includes a first die, a second die, a wall structure and an encapsulant. The second die is electrically bonded to the first die. The wall structure is located aside the second die and on the first die. The wall structure is in contact with the first die and a hole is defined within the wall structure for accommodating an optical element. The encapsulant laterally encapsulates the second die and the wall structure.
    Type: Application
    Filed: November 13, 2023
    Publication date: March 7, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Chien Pan, Chin-Fu Kao, Li-Hui Cheng, Szu-Wei Lu
  • Patent number: 11784541
    Abstract: A grounding structure for a motor stator includes a silicon steel sheet unit, and upper and lower insulating frames clamping the silicon steel sheet unit therebetween. The grounding structure further includes a conductive member and a circuit board. The conductive member is clamped between the silicon steel sheet unit and the lower insulating frame, and protruding from a lower end of the lower insulating frame. The circuit board is disposed at a lower side of the lower insulating frame, and includes a negative contact that is connected to a lower edge of the conductive member.
    Type: Grant
    Filed: April 1, 2022
    Date of Patent: October 10, 2023
    Assignee: YEN SUN TECHNOLOGY CORP.
    Inventors: Graham Chen, Chih-Tsung Hsu, Hsin-Hsien Wu, Chin-Hui Pan, Yu-Chuan Huang
  • Patent number: 11739768
    Abstract: A fan includes a frame member, a fan body, a surrounding plate and a housing unit. The frame member surrounds an axis and defines an accommodating space in which the fan body is disposed. The fan body is rotatable about the axis. The surrounding plate surrounds the frame member and is formed with at least one plate hole extending in a transverse direction transverse to an axial direction of the axis therethrough. The housing unit surrounds the surrounding plate and has a plurality of housing holes extending in the axial direction of the axis therethrough. The housing unit and the surrounding plate cooperatively define a surrounding space therebetween that is surrounded by the housing holes.
    Type: Grant
    Filed: May 18, 2022
    Date of Patent: August 29, 2023
    Assignee: YEN SUN TECHNOLOGY CORP.
    Inventors: Graham Chen, Chih-Tsung Hsu, Hsin-Hsien Wu, Chin-Hui Pan
  • Publication number: 20230204047
    Abstract: A fan includes a frame member, a fan body, a surrounding plate and a housing unit. The frame member surrounds an axis and defines an accommodating space in which the fan body is disposed. The fan body is rotatable about the axis. The surrounding plate surrounds the frame member and is formed with at least one plate hole extending in a transverse direction transverse to an axial direction of the axis therethrough. The housing unit surrounds the surrounding plate and has a plurality of housing holes extending in the axial direction of the axis therethrough. The housing unit and the surrounding plate cooperatively define a surrounding space therebetween that is surrounded by the housing holes.
    Type: Application
    Filed: May 18, 2022
    Publication date: June 29, 2023
    Inventors: Graham CHEN, Chih-Tsung HSU, Hsin-Hsien WU, Chin-Hui PAN
  • Publication number: 20230133593
    Abstract: A grounding structure for a motor stator includes a silicon steel sheet unit, and upper and lower insulating frames clamping the silicon steel sheet unit therebetween. The grounding structure further includes a conductive member and a circuit board. The conductive member is clamped between the silicon steel sheet unit and the lower insulating frame, and protruding from a lower end of the lower insulating frame. The circuit board is disposed at a lower side of the lower insulating frame, and includes a negative contact that is connected to a lower edge of the conductive member.
    Type: Application
    Filed: April 1, 2022
    Publication date: May 4, 2023
    Inventors: Graham CHEN, Chih-Tsung HSU, Hsin-Hsien WU, Chin-Hui PAN, Yu-Chuan HUANG
  • Patent number: 11585357
    Abstract: A fan casing for mounting of a fan includes a frame including four corner segments and four side segments that are arranged alternately with the corner segments, a seat disposed in the frame, and four support members extending radially and outwardly from the seat and connected respectively to the corner segments. Each support member includes a base connected to the seat and having a width reducing in a direction away from the seat, and a rib connected between the base and the corresponding corner segment. The bases are interconnected to surround the seat. Any two adjacent bases are interconnected to form an arc surface facing the corresponding side segment and adapted to absorb shock.
    Type: Grant
    Filed: June 27, 2022
    Date of Patent: February 21, 2023
    Assignee: YEN SUN TECHNOLOGY CORP.
    Inventors: Graham Chen, Chih-Tsung Hsu, Hsin-Hsien Wu, Chin-Hui Pan, Yu-Ting Liu
  • Publication number: 20200132080
    Abstract: A fan device includes a casing unit and a fan impeller unit mounted in the casing unit. The casing unit includes a casing body formed with a receiving space and an air outlet port, a porous plate formed with a plurality of through holes and is disposed in the receiving space to divide the receiving space into an air-flowing room and a noise-reduction room, and an air-entering tube in spatial communication with the air-flowing room. The fan impeller unit is disposed in the air-flowing room and rotatable to generate airflow partially flowing from the air-flowing room into the noise-reduction room through the through holes.
    Type: Application
    Filed: October 25, 2019
    Publication date: April 30, 2020
    Inventors: Chien-Jung CHEN, Hsin-Hsien WU, Chih-Tsung HSU, Chin-Hui PAN