Abstract: Package structures and methods for manufacturing the same are provided. The package structure includes a first bump structure formed over a first substrate. The first bump structure includes a first pillar layer formed over the first substrate and a first barrier layer formed over the first pillar layer. In addition, the first barrier layer has a first protruding portion laterally extending outside a first edge of the first pillar layer. The package structure further includes a second bump structure bonded to the first bump structure through a solder joint. In addition, the second bump structure includes a second pillar layer formed over a second substrate and a second barrier layer formed over the second pillar layer. The first protruding portion of the first barrier layer is spaced apart from the solder joint.

Abstract: A display device includes an array substrate, an electronic paper display medium, a counter substrate, a supporting layer, and an adhesive. The electronic paper display medium is disposed on the array substrate. The counter substrate is disposed on the electronic paper display medium. The adhesive adheres the supporting layer to a surface of the array substrate facing away from the electronic paper display medium.