Abstract: A method includes receiving a wafer, measuring a surface topography of the wafer; calculating a topographical variation based on the surface topography measurement performing a single-zone alignment compensation when the topographical variation is less than a predetermined value or performing a multi-zone alignment compensation when the topographical variation is greater than the predetermined value; and performing a wafer alignment according to the single-zone alignment compensation or the multi-zone alignment compensation.

Abstract: An energy storage apparatus includes a core and a first coil. The core has a winding portion, and the first coil includes a first coil body and a first pin portion. The first coil body is formed by winding a flat conductor around the winding portion perpendicularly and has a first inner end and a first outer end, and an edge of the first coil body has a notch to form a first wire crossing slot. The first pin portion includes a first inner end pin and a first outer end pin coupled to the first inner end and the first outer end respectively. The first inner end pin passes through a first wire crossing slot and crosses the first coil body to achieve the effects of reducing the overall volume and inserting components easily and quickly.