Abstract: Provided is an antenna module including a first planar inverted-F antenna radiator, a first ground plane, a second ground plane, and a conductor. The first planar inverted-F antenna radiator includes a first feeding terminal and a first ground terminal. The first ground terminal is connected to the first ground plane. The second ground plane is located on one side of the first ground plane. A gap exists between the first ground plane and the second ground plane. The conductor is located between the first ground plane and the second ground plane and connects the first ground plane with the second ground plane.

Abstract: A single wafer spin cleaning apparatus with soaking, cleaning, and etching functions in accordance with the present invention includes a spin driver device, a wafer spin chuck, and a wafer support disk. The wafer spin chuck is driven by the spin driver device to spin. The wafer support disk is annular and surrounds the wafer spin chuck, can act relative to the wafer spin chuck to a wafer support position or a wafer disengagement position, and includes a soaking trough. The wafer support disk at the wafer support position can support a wafer such that the wafer is soaked in processing liquid injected in the soaking trough for implementing a high efficient cleaning or etching process.

Abstract: A method for eliminating bubbles from a liquid dispensing system includes flowing a liquid containing bubbles into a liquid inlet of a tank from a filter to substantially fill the tank, wherein substantially all bubbles accumulate in an upper portion of the tank having a lateral dimension greater than a lateral dimension of a lower portion of the tank, and flowing the liquid into the tank comprises flowing the liquid through an inlet pipe extending at an acute angle relative to a horizontally-oriented axis of the tank. The method further includes flowing a liquid substantially free of bubbles out of the tank via a liquid outlet at the lower portion of the tank for dispensing to a substrate.

Abstract: An antenna device includes a body and at least one external antenna. The body includes a processor and a sensor electrically connected to the processor. The processor is configured to receive a sensing signal from the sensor. The external antenna is externally connected to the body at an adjustable angle, and includes a first antenna, a second antenna, and a switch. The switch is electrically connected to the processor, and is switchably electrically connected to the first antenna and the second antenna. When the sensor senses that the external antenna is at a first angle or a second angle relative to the body, the processor switches the switch electrically connected to the first antenna or the second antenna according to the sensing signal, so that the external antenna has a first radiation pattern or a second radiation pattern.

Abstract: A semiconductor structure and method of manufacture is provided. In some embodiments, a semiconductor structure includes a semiconductor layer, a first isolation structure in the semiconductor layer, a first gate structure adjacent a first side of the first isolation structure, a first source/drain region adjacent a second side of the first isolation structure, a second source/drain region adjacent the first gate structure, and a first conductive field plate at least partially embedded in the first isolation structure.

Abstract: A light emitting module includes a base unit, a substrate unit, a light emitting unit and a driving unit. The base unit includes a base body having a horizontal carrying surface and at least one inclined carrying surface. The inclined carrying surface is inclined by a predetermined angle relative to the horizontal carrying surface. The substrate unit includes a bendable substrate disposed on the base body. The bendable substrate has a horizontal portion disposed on the horizontal carrying surface, at least one inclined portion disposed on the inclined carrying surface, and at least one bending portion disposed between the horizontal and the inclined portions. The inclined portion is inclined by a predetermined angle relative to the horizontal portion. The light emitting unit includes at least one light emitting group disposed on the horizontal portion. The driving unit includes a plurality of electronic components disposed on the inclined portion.

Abstract: A lamp structure includes an electrical connection unit, a light emitting unit, and a light guiding unit. The electrical connection unit includes an electrical connection element. The light emitting unit includes at least one light emitting element disposed on the top side of the electrical connection unit and electrically connected to the electrical connection element. The light guiding unit includes a light guiding element disposed on the top side of the electrical connection unit. The light guiding element has a bottom light-input surface, a top light-output surface, and a surrounding light-output surface. The surrounding light-output surface has a first surrounding region gradually outwardly expanded from bottom to top, a second surrounding region connected to the first surrounding region and gradually inwardly contracted from bottom to top, and a third surrounding region connected to the second surrounding region and gradually outwardly expanded from bottom to top.

Abstract: A LED package structure includes a substrate unit, a light emitting unit, a package unit, and a phosphor unit. The substrate unit includes a substrate body. The light emitting unit includes at least one light emitting element disposed on and electrically connected to the substrate body. The package unit includes a package resin body formed on the substrate body to cover the light emitting element. The package resin body has a light output surface formed on the top surface thereof to guide light beams generated by the light emitting element to leave the package resin body. The phosphor unit includes a prefabricated phosphor cap disposed on the substrate body to enclose the package resin body. The prefabricated phosphor cap is separated from the package resin body by a predetermined distance to form a receiving portion between the prefabricated phosphor cap and the package resin body.

Abstract: A LED package structure for increasing the light uniforming effect includes a substrate unit, a light emitting unit, a first package unit, and a second package unit. The substrate unit includes at least one substrate body. The light emitting unit includes at least one light emitting element disposed on the at least one substrate body and electrically connected to the at least one substrate body. The first package unit includes a first package resin body formed on the at least one substrate body to cover the at least one light emitting element. The second package unit includes a second package resin body formed on the at least one substrate body to cover the first package resin body. The second package resin body is a light uniforming resin body having a light diffusing material mixed therein, and the second package resin body has an exposed light uniforming surface formed thereon.