Patents by Inventor Chin-Khye Pang

Chin-Khye Pang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Buffer apparatus and thin film deposition system
    Patent number: 8328938
    Abstract: A buffer apparatus and a thin film deposition system are provided. The buffer apparatus is connected between a liquid material supply apparatus and a deposition machine. The buffer apparatus includes a container and a baffle. The container is used for containing a liquid material supplied from the liquid material supply apparatus. The top of the container has an input hole and an output hole. The baffle is disposed in the container and located under the input hole.
    Type: Grant
    Filed: August 21, 2008
    Date of Patent: December 11, 2012
    Assignee: United Microelectronics Corp.
    Inventors: Cheng-Chung Lim, Zhao-Jin Sun, Jui-Ling Tang, Chin-Khye Pang, Yu-Heng Liu
  • BUFFER APPARATUS AND THIN FILM DEPOSITION SYSTEM
    Publication number: 20100043701
    Abstract: A buffer apparatus and a thin film deposition system are provided. The buffer apparatus is connected between a liquid material supply apparatus and a deposition machine. The buffer apparatus includes a container and a baffle. The container is used for containing a liquid material supplied from the liquid material supply apparatus. The top of the container has an input hole and an output hole. The baffle is disposed in the container and located under the input hole.
    Type: Application
    Filed: August 21, 2008
    Publication date: February 25, 2010
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Cheng-Chung Lim, Zhao-Jin Sun, Jui-Lin Tang, Chin-Khye Pang, Yu-Heng Liu