Abstract: A cover and a lamp structure. The cover whose curvature has a light incident surface and a light outgoing surface, and includes a plurality of 3D micro-structures disposed thereon and arranged in the form of an array. When a light is emitted into the light outgoing surface from the light incident surface, the light emitting angle of the light outgoing surface is increased through the refraction of the 3D micro-structures, so that the occurrence of mura or spots due to uneven distribution of the light is avoid.

Abstract: A lighting module is provided. The lighting module comprises a circuit board, a first light source array, a second light source array, and a plurality of first light guides. The first light source array is disposed on the circuit board and comprises a plurality of first solid light emitting semiconductors providing a first light with a first wavelength. The second light source array is disposed on the circuit board and comprises a plurality of second solid light emitting semiconductors providing a second light with a second wavelength. The first light guides are disposed on the circuit board and between the second solid light emitting semiconductors. The second solid light emitting semiconductors are located on a side of each of the first light guides, respectively, so that the second light emitted by the second solid light emitting semiconductors enters the first light guides to be uniformly emitted.

Abstract: A lighting module is provided. The lighting module comprises a circuit board, a first light source array, a second light source array, and a plurality of first light guides. The first light source array is disposed on the circuit board and comprises a plurality of first solid light emitting semiconductors providing a first light with a first wavelength. The second light source array is disposed on the circuit board and comprises a plurality of second solid light emitting semiconductors providing a second light with a second wavelength. The first light guides are disposed on the circuit board and between the second solid light emitting semiconductors. The second solid light emitting semiconductors are located on a side of each of the first light guides, respectively, so that the second light emitted by the second solid light emitting semiconductors enters the first light guides to be uniformly emitted.

Abstract: A cover and a lamp structure. The cover whose curvature has a light incident surface and a light outgoing surface, and includes a plurality of 3D micro-structures disposed thereon and arranged in the form of an array. When a light is emitted into the light outgoing surface from the light incident surface, the light emitting angle of the light outgoing surface is increased through the refraction of the 3D micro-structures, so that the occurrence of mura or spots due to uneven distribution of the light is avoid.

Abstract: A light emitting diode (LED) cup lamp including a base, an LED light source and a light guiding device is disclosed. The LED light source is disposed on the base. The light guiding device is disposed above the LED light source. The light guiding device has a light guiding region facing the LED light source. After the light emitted from the LED light source is guided through the light guiding region, the light is further guided by other parts of the light guiding device so that the light is emitted towards the exterior of the LED cup lamp.

Abstract: A backlight module includes a bezel having at least one edge, a circuit board, one or more light emitting diodes connected to the circuit board for emitting light. Each light emitting diode has a light axis which is neither parallel nor vertical to the edge of the bezel. The backlight module utilizes a heat conductive block disposed between the bezel and the light emitting diode for transferring heat generated by the light emitting diode to the bezel.

Abstract: A lamp device includes a supporting frame, a light emitting diode (LED) array source, a light filter, two end caps and two couples of electrodes. The LED array source is disposed on the supporting frame. The light filter is arc-shaped and combined with the supporting frame as a tubular structure, wherein the arc surface of the light filter is a light emitting surface of the LED array source. The light filter is used for absorbing a ray in a specific wavelength range of the emitting light of the LED array source. The two end caps are disposed at two ends of the tubular structure respectively. The two couples of electrodes are disposed at two ends of the tubular structure and mounted on the two end caps respectively for electrically connecting to the LED array source.

Abstract: A backlight module includes a bezel having at least one edge, a circuit board, one or more light emitting diodes connected to the circuit board for emitting light. Each light emitting diode has a light axis which is neither parallel nor vertical to the edge of the bezel. The backlight module utilizes a heat conductive block disposed between the bezel and the light emitting diode for transferring heat generated by the light emitting diode to the bezel.

Abstract: A backlight system and an LCD using the same are provided. The present backlight system is equipped with a light-source driving module and several light sources of different optimum working temperature ranges. Hence, according to the environmental temperature, appropriate light source(s) will be driven by the light-source driving module to maintain a constant light output of the backlight system.

Abstract: The present invention disclosed a light module, which comprises a plurality of LED package units and a plurality of connecting units. Opposite sides of each of the LED package units has one connector respectively, and opposite sides of each of the connecting units has one connector respectively. The LED package unit and the connecting unit connect each other through the connectors. To vary the arrangement and the amount of the connecting units and the LED package units is to suit different dimensions of side light modules of liquid crystal displays with different luminosities.

Abstract: Organic light emitting diode (OLED) devices with heat dissipation elements for electronic devices. The OLED devices comprise an OLED module and a frame enclosing the OLED module, wherein the frame comprises an exposing portion to outside the electronic device.

Abstract: A backlight module includes a bezel having at least one edge, a circuit board, one or more light emitting diodes connected to the circuit board for emitting light. Each light emitting diode has a light axis which is neither parallel nor vertical to the edge of the bezel. The backlight module utilizes a heat conductive block disposed between the bezel and the light emitting diode for transferring heat generated by the light emitting diode to the bezel.

Abstract: A backlight module with a plurality of light sources is provided. The backlight module includes a bezel, a first light emitting diode disposed at one side of the bezel for emitting light, a second light emitting diode for emitting light, and a light guiding plate disposed on the bezel for guiding light from the first and second light emitting diodes. The light axis of the first light emitting diode is not parallel to that of the second light emitting diode.

Abstract: The present invention disclosed a light module, which comprises a plurality of LED package units and a plurality of connecting units. Opposite sides of each of the LED package units has one connector respectively, and opposite sides of each of the connecting units has one connector respectively. The LED package unit and the connecting unit connect each other through the connectors. To vary the arrangement and the amount of the connecting units and the LED package units is to suit different dimensions of side light modules of liquid crystal displays with different luminosities.

Abstract: An electronic device comprises a flexible printed circuit board and a circuit board. The flexible printed circuit board comprises two first connection portions and a multifunction opening, wherein the multifunction opening comprises a flow-stopping portion and a first positioning hole, the flow-stopping portion is disposed between the two first connection portions and serves to prevent solder bridging between the connection portions during reflow, and the first positioning hole is formed to be continuous with an end of the flow-stopping portion to form a single elongated opening (120). The circuit board comprises a first positioning aperture corresponding to the first positioning hole, wherein the circuit board is connected to the flexible printed circuit board. A second positioning hole (110) and a second positioning aperture (211) may be formed on the flexible printed circuit board and the circuit board and the multifunction opening 120 may be expanded to include both the positioning holes.

Abstract: A backlight system and an LCD using the same are provided. The present backlight system is equipped with a light-source driving module and several light sources of different optimum working temperature ranges. Hence, according to the environmental temperature, appropriate light source(s) will be driven by the light-source driving module to maintain a constant light output of the backlight system.

Abstract: A backlight unit with high heat transfer rate disposed under a display panel. The backlight unit includes a light source generator for generating light beams, a diffusing plate positioned between the light source generator and the display panel for scattering the light beams to the display panel, and a reflecting sheet position under the light source generator for reflecting the light beams upward. The reflecting sheet has at least one opening for increasing the heat transfer rate of the backlight unit.

Abstract: An electronic device comprises a flexible printed circuit board and a circuit board. The flexible printed circuit board comprises two first connection portions and a multifunction opening, wherein the multifunction opening comprises a flow-stopping portion and a first positioning portion, the flow-stopping portion is disposed between the two first connection portions, and the first positioning portion is connected to an end of the flow-stopping portion. The circuit board comprises a first positioning hole corresponding to the first positioning portion, wherein the circuit board is connected to the flexible printed circuit board.

Abstract: A direct backlight module. The direct backlight module includes a diffuser, a reflecting plate, an illumination tube and a support. The reflecting plate is disposed under the diffuser. The illumination tube is disposed between the diffuser and the reflecting plate. The support is disposed on the reflecting plate and between the diffuser and the reflecting plate. In addition, the support has a fitting portion into which the illumination tube directly fits. The support supports the diffuser and the illumination tube simultaneously.