Patents by Inventor Chin Kung Goh

Chin Kung Goh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LAPTOP ARRANGEMENT FOR HEAT CONTROL
    Publication number: 20240147654
    Abstract: The present disclosure is directed to a laptop arrangement including: a chassis defining a space that is divided into a first compartment and a second compartment, the first compartment including an air inlet and the second compartment including an air outlet; and a partitioning element positioned between the first and second compartments, whereby the partitioning element at least partially seals the first compartment from the second compartment and enables the second compartment to have a greater pressurization than the first compartment.
    Type: Application
    Filed: October 28, 2022
    Publication date: May 2, 2024
    Inventors: Jiunn Shyong CHEE, Howe Yin LOO, Tin Poay CHUAH, Chin Kung GOH, Yew San LIM
  • COOLING SYSTEMS, COOLING STRUCTURES AND ELECTRONIC DEVICES AND METHODS FOR MANUFACTURING OR OPERATING COOLING SYS-TEMS, COOLING STRUCTURES AND ELECTRONIC DEVICES
    Publication number: 20230337406
    Abstract: An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.
    Type: Application
    Filed: December 23, 2020
    Publication date: October 19, 2023
    Inventors: Ritu BAWA, Ruander CARDENAS, Kathiravan D, Jia Yan GO, Chin Kung GOH, Jeff KU, Prakash Kurma RAJU, Baomin LIU, Twan Sing LOO, Mikko MAKINEN, Columbia MISHRA, Juha PAAVOLA, Prasanna PICHUMANI, Daniel RAGLAND, Kannan RAJA, Khai Ern SEE, Javed SHAIKH, Gokul SUBRAMANIAM, George Baoci SUN, Xiyong TIAN, Hua YANG, Mark CARBONE, Vivek PARANJAPE, Nehakausar PINJARI, Hari Shanker THAKUR, Christopher MOORE, Gustavo FRICKE, Justin HUTTULA, Gavin SUNG, Sammi WY LIU, Arnab SEN, Chun-Ting LIU, Jason Y. JIANG, Gerry JUAN, Shih Wei NIEN, Lance LIN, Evan KUKLINSKI
  • EXPANDABLE THERMAL SOLUTION FOR LAPTOPS
    Publication number: 20210333848
    Abstract: According to the present disclosure, a laptop may be provided with a compartment including a moveable segment, an expandable heat exchanger with a movable section, and an expandable fan unit. The release of the movable segment of the compartment from a lower portion of the compartment produces an opening in the compartment and the movable section of the expandable heat exchanger is extended downward, and the expandable fan unit is lowered when the movable segment of the compartment is released.
    Type: Application
    Filed: July 7, 2021
    Publication date: October 28, 2021
    Inventors: Jeff KU, Tin Poay CHUAH, Howe Yin LOO, Chin Kung GOH, Yew San LIM, Cora Shih Wei NIEN
  • FAN MODULE INTERCONNECT APPARATUS FOR ELECTRONIC DEVICES
    Publication number: 20210120699
    Abstract: Fan module interconnect apparatus are disclosed. An example fan module includes a fan and a fan housing to carry the fan. The fan is to rotate in the fan housing. A flange extends from the fan housing and including signal paths to provide an interconnect to electrically couple at least portions of a first electrical circuit and a second electrical circuit of an electronic device.
    Type: Application
    Filed: December 23, 2020
    Publication date: April 22, 2021
    Inventors: Chee How Lim, Khai Ern See, Chin Kung Goh, Twan Sing Loo