Abstract: A foam and a foaming composition are provided. The foam includes a composite material and a plurality of foam cells, wherein the foam cells are disposed in the composite material. The composite material includes a modified sulfur-containing polymer and a fluorine-containing polymer fiber, wherein a degree of orientation as defined by the ratio I110/I200 is from 1.0 to 1.3, wherein I110 is the X-ray diffraction peak intensity of (110) planes of the modified sulfur-containing polymer and I200 is the X-ray diffraction peak intensity of (200) planes of the modified sulfur-containing polymer.

Abstract: A composite material and a foam prepared from the composite material are provided. The composite material includes a network polymer, a fluorine-containing polymer fiber, and a reinforcement fiber. The polymer network is a crosslinking reaction product of a polymer and an oligomer, wherein the polymer is polyamide, polyester, polyurethane, or a combination thereof, and the oligomer is a vinyl aromatic-co-acrylate oligomer with an epoxy functional group. The oligomer has a weight percentage of 1% to 10%, based on the weight of the network polymer. The ratio of the weight of the reinforcement fiber to the total weight of the network polymer and the fluorine-containing polymer fiber is from 1:9 to 4:6.

Abstract: A composite material and a foam prepared from the composite material are provided. The composite material includes a network polymer, a fluorine-containing polymer fiber, and a reinforcement fiber. The polymer network is a crosslinking reaction product of a polymer and an oligomer, wherein the polymer is polyamide, polyester, polyurethane, or a combination thereof, and the oligomer is a vinyl aromatic-co-acrylate oligomer with an epoxy functional group. The oligomer has a weight percentage of 1% to 10%, based on the weight of the network polymer. The ratio of the weight of the reinforcement fiber to the total weight of the network polymer and the fluorine-containing polymer fiber is from 1:9 to 4:6.

Abstract: A branched polymer, a preparation method thereof and a method for preparing a foam are provided. The branched polymer is a transesterification product of a composition, and the composition includes 100 parts by weight of polyethylene terephthalate and 0.5-2.0 parts by weight of polyol. The branched polymer has an inherent viscosity of from 1.2 dL/g to 1.6 dL/g, a number average molecular weight of from 75,000 g/mol to 90,000 g/mol, a polydispersity index from 3.0 to 6.0, a melt index from 0.8 g/10 min to 7.5 g/10 min, a shear viscosity from 800 Pa·s to 1900 Pa·s, and a melt strength from 30 cN to 80 cN.

Abstract: A branched polymer, a preparation method thereof and a method for preparing a foam are provided. The branched polymer is a transesterification product of a composition, and the composition includes 100 parts by weight of polyethylene terephthalate and 0.5-2.0 parts by weight of polyol. The branched polymer has an inherent viscosity of from 1.2 dL/g to 1.6 dL/g, a number average molecular weight of from 75,000 g/mol to 90,000 g/mol, a polydispersity index from 3.0 to 6.0, a melt index from 0.8 g/10 min to 7.5 g/10 min, a shear viscosity from 800 Pa·s to 1900 Pa·s, and a melt strength from 30 cN to 80 cN.

Abstract: Disclosed is a thermoplastic polyester elastomer, which is formed by reacting 100 parts by weight of polyester and 0.01 to 2 parts by weight of an epoxy resin with two epoxy groups, wherein the polyester is formed by reacting a parts by mole of a hard-segment diol, b parts by mole of a soft-segment diol, and 1 part by mole of a diacid, wherein 1?a?3 and 0.005?b?1.5.

Abstract: Disclosed is a thermoplastic polyester elastomer, which is formed by reacting 100 parts by weight of ester and 0.01 to 2 parts by weight of an epoxy resin with two epoxy groups, wherein the ester is formed by reacting a parts by mole of a hard-segment diol, b parts by mole of a soft-segment diol, and 1 part by mole of a diacid, wherein 1?a?3 and 0.005?b?1.5.

Abstract: A method for packaging a light emitting diode is provided. The steps comprise: providing a material; drying the material; feeding the material into a feeding inlet; and providing a mold with pre-embedded light diodes. The material enters the feeding inlet and is injected into the mold by pressing a screw, allowing the material to combine with the light emitting diode.

Abstract: Disclosed is a high thermally conductive composite, including a first composite and a second composite having a co-continuous and incompatible dual-phase manner. The first composite consists of glass fiber distributed into polyphenylene sulfide, and the second composite consists of carbon material distributed into polyethylene terephthalate. The carbon material includes graphite, graphene, carbon fiber, carbon nanotube, or combinations thereof.

Abstract: The disclosed is a copolymer having a formula as: R1 is a combination of naphthalene, phenylene, butyl, and hexyl. R2 is a combination of ethylene, cyclohexlene, 2-methylpropyl, and neopentyl. n is a number of 1500 to 3000. The copolymer has a transparency greater than 80%, a thermal resistance greater than 100° C., a moisture absorption less than 0.5 wt %, and yellowing under UV/climate resistance greater than 1000 hours.

Abstract: The disclosed is a copolymer having a formula as: R1 is a combination of naphthalene, phenylene, butyl, and hexyl. R2 is a combination of ethylene, cyclohexlene, 2-methylpropyl, and neopentyl. n is a number of 1500 to 3000. The copolymer has a transparency greater than 80%, a thermal resistance greater than 100, a moisture absorption less than 0.5 wt %, and yellowing under UV/climate resistance greater than 1000 hours, such that the copolymer is adapted to be applied in packaging material for light emitting devices.

Abstract: A method for packaging a light emitting diode is provided. The steps comprise: providing a material; drying the material; feeding the material into a feeding inlet; and providing a mold with pre-embedded light diodes. The material enters the feeding inlet and is injected into the mold by pressing a screw, allowing the material to combine with the light emitting diode.

Abstract: The disclosed is a blend including 20 to 80 parts by weight of polycarbonate, 20 to 80 parts by weight of polyarylate, and 20 to 80 parts by weight of copolymer having a formula as below: wherein R1 is a combination of at least two of ethylene, cyclohexlene dimethylene, 2-methyl propyl, and neopentyl. R2 is a combination of at least two of naphthalene, phenylene, butyl, and hexyl. n is a number of 1500 to 3000. The blend has high transparency, high thermal resistance, and high yellowing resistance under UV/climate, such that the blend is suitable to be applied in packaging material for light emitting device.

Abstract: The disclosed is a copolymer having a formula as: R1 is a combination of naphthalene, phenylene, butyl, and hexyl. R2 is a combination of ethylene, cyclohexene, 2-methylpropyl, and neopentyl. n is a number of 1500 to 3000. The copolymer has a transparency greater than 80%, a thermal resistance greater than 100° C., a moisture absorption less than 0.5 wt %, and yellowing under UV/climate resistance greater than 1000 hours, such that the copolymer is adapted to be applied in packaging material for light emitting devices.