Abstract: A multi-stage adsorber device including a plurality of adsorption stages distributed in sequence, each including an adsorber coupled to an adjacent vapor chamber, wherein the adsorber of each following adsorption stage is thermally coupled to the vapor chamber of a preceding adsorption stage via a heat transfer structure. A heating stage is thermally coupled to a first one of the adsorption stages to selectively provide thermal energy to the adsorbers, while a cooling stage is thermally coupled to a final one of the adsorption stages to selectively cause condensation of desorbed vapor in the vapor chambers. The adsorber device further includes a cooling circuit having first and second cooling sections to selectively cause circulation of a cooling fluid through the cooling stage and through each of the adsorbers, respectively.

Abstract: A method of cooling a device generating thermal energy, which device may especially be a photovoltaic device. A thermally conductive substrate is provided, which is coupled to a portion of the device generating thermal energy to allow heat transfer therefrom to the thermally conductive substrate. A porous wick structure is further provided, which is coupled to the thermally conductive substrate. This porous wick structure is configured to be wettable by a liquid cooling medium and be partly exposed to air. The porous wick structure is wetted by means of the liquid cooling medium and subjected to the action of an airflow to cause evaporation of the liquid cooling medium at an interface between the wetted porous wick structure and air, thereby inducing cooling by evaporation. A cooling apparatus suitable for carrying out such method may also be provided.

Abstract: The invention relates to a modular building structure (10) comprising: a framework (12) including a plurality of rods (14) and connectors (16) to interconnect the plurality of rods (14) together, the framework (12) comprising empty spaces bordered by corresponding rods (14) of said plurality of rods; a plurality of panels (20), wherein one panel (20) is mounted inside each empty space and connected to the framework (12) in order to create an interior (40), an air chamber layer (44) inside which air may circulate, said air chamber layer (44) forming at least a portion of an outer surface of said interior (40), at least one upper valve system (46a) mounted in the upper portion of the structure (10), and at least one lower valve system (46b) mounted in the lower portion of the structure (10).

Abstract: A structure for cooling an integrated circuit. The structure may include; an interposer cold plate having at least two expanding channels, each expanding channel having a flow direction from a channel inlet to a channel outlet, the flow direction having different directions for at least two of the at least two expanding channels, the channel inlet having an inlet width and the channel outlet having an outlet width, wherein the inlet width is less than the outlet width.

Abstract: A structure for cooling an integrated circuit. The structure may include; an interposer cold plate having at least two expanding channels, each expanding channel having a flow direction from a channel inlet to a channel outlet, the flow direction having different directions for at least two of the at least two expanding channels, the channel inlet having an inlet width and the channel outlet having an outlet width, wherein the inlet width is less than the outlet width.

Abstract: A thermal water purification system and a related method including distilling units consecutively flowed through by raw feed liquid, each having a boiling liquid section and a vapor section, and including a heat exchanger cavity adapted to transfer thermal energy to the raw feed liquid before entering the boiling liquid section of a first distilling unit. Heat exchanger tubes in fluidic communication with the heat exchanger cavity extend through the boiling liquid section of the first distilling unit to transfer thermal energy from a medium in the tubes to cause the raw feed liquid to boil. Preheating tubes extend through the vapor section of each distilling unit to heat the raw feed liquid before entering the boiling sections using thermal energy from vapor condensing against external surfaces of the preheating tubes, which produces the distillate liquid that flows through a discharge port and a conduit supplying a storage tank.

Abstract: A device for converting heat into mechanical energy is disclosed. The device includes a channel flow boiler having at least one channel adapted to heat a working fluid for generating a liquid-gas mixture; an expansion device adapted to expand the liquid-gas mixture; and a movable element arranged such that the expanding liquid-gas mixture at least partially converts an internal and/or kinetic energy of the liquid-gas mixture into mechanical energy associated with the movable element; wherein the channel flow boiler and/or the expansion device is adapted to supply heat to the liquid-gas mixture.

Abstract: A structure for cooling an integrated circuit. The structure may include; an interposer cold plate having at least two expanding channels, each expanding channel having a flow direction from a channel inlet to a channel outlet, the flow direction having different directions for at least two of the at least two expanding channels, the channel inlet having an inlet width and the channel outlet having an outlet width, wherein the inlet width is less than the outlet width.

Abstract: A structure for cooling an integrated circuit. The structure may include; an interposer cold plate having at least two expanding channels, each expanding channel having a flow direction from a channel inlet to a channel outlet, the flow direction having different directions for at least two of the at least two expanding channels, the channel inlet having an inlet width and the channel outlet having an outlet width, wherein the inlet width is less than the outlet width.

Abstract: A structure for cooling an integrated circuit. The structure may include; an interposer cold plate having at least two expanding channels, each expanding channel having a flow direction from a channel inlet to a channel outlet, the flow direction having different directions for at least two of the at least two expanding channels, the channel inlet having an inlet width and the channel outlet having an outlet width, wherein the inlet width is less than the outlet width.

Abstract: The present invention relates to a thermal water purification system for producing a distillate liquid from a raw liquid, including: a plurality of distilling units which are consecutively flowed through by the raw feed liquid, wherein each distilling unit includes one boiling liquid section and one vapor section adjacent thereto, and wherein any two consecutive distilling units, respectively an upstream distilling unit and a downstream distilling unit, are implemented such that the boiling liquid section of the downstream distilling unit is separated from the vapor section of the upstream distilling unit by a liquid-tight and vapor-tight separation plate, and separated from the vapor section of the downstream distilling unit by a liquid-tight and vapor-permeable membrane; a plurality of heat exchanger tubes adapted to boil the raw feed liquid inside the boiling liquid sections; and a plurality of preheating tubes adapted to preheat the raw feed liquid before it flows inside the boiling liquid sections.

Abstract: A structure for cooling an integrated circuit. The structure may include; an interposer cold plate having at least two expanding channels, each expanding channel having a flow direction from a channel inlet to a channel outlet, the flow direction having different directions for at least two of the at least two expanding channels, the channel inlet having an inlet width and the channel outlet having an outlet width, wherein the inlet width is less than the outlet width.

Abstract: An apparatus and corresponding method for heat exchange. The heat exchange apparatus may include an adsorber device. The adsorber device is configured to draw heat from a first heat reservoir and transfer heat to a first heat sink. The heat exchange apparatus may include a heat exchanger fluidly connected to the adsorber device by the working fluid. The heat exchanger transfers heat to a second heat sink. The heat exchange apparatus may include an expansion device fluidly connected to the heat exchanger by the working fluid. The expansion device expands the working fluid, and exchanges heat with a second heat reservoir. The expansion device includes a turbine device for converting at least a part of an exergy of the working fluid during expansion into mechanical work. The heat exchange apparatus may include the adsorber device being fluidly connected to the expansion device by the working fluid.

Abstract: A structure for cooling an integrated circuit. The structure may include; an interposer cold plate having at least two expanding channels, each expanding channel having a flow direction from a channel inlet to a channel outlet, the flow direction having different directions for at least two of the at least two expanding channels, the channel inlet having an inlet width and the channel outlet having an outlet width, wherein the inlet width is less than the outlet width.

Abstract: A package structure to implement two-phase cooling includes a chip stack disposed on a substrate, and a package lid that encloses the chip stack. The chip stack includes a plurality of conjoined chips, a central inlet manifold formed through a central region of the chip stack, and a peripheral outlet manifold. The central input manifold includes inlet nozzles to feed liquid coolant into flow cavities formed between adjacent conjoined chips. The peripheral outlet manifold outputs heated liquid and vapor from the flow cavities. The package lid includes a central coolant supply inlet aligned to the central inlet manifold, and a peripheral liquid-vapor outlet to output heated liquid and vapor that exits from the peripheral outlet manifold. Guiding walls may be included in the flow cavities to guide a flow of liquid and vapor, and the guiding walls can be arranged to form radial flow channels that are feed by different inlet nozzles of the central inlet manifold.

Abstract: A structure for cooling an integrated circuit. The structure may include; an interposer cold plate having at least two expanding channels, each expanding channel having a flow direction from a channel inlet to a channel outlet, the flow direction having different directions for at least two of the at least two expanding channels, the channel inlet having an inlet width and the channel outlet having an outlet width, wherein the inlet width is less than the outlet width.

Abstract: A package structure to implement two-phase cooling includes a chip stack disposed on a substrate, and a package lid that encloses the chip stack. The chip stack includes a plurality of conjoined chips, a central inlet manifold formed through a central region of the chip stack, and a peripheral outlet manifold. The central input manifold includes inlet nozzles to feed liquid coolant into flow cavities formed between adjacent conjoined chips. The peripheral outlet manifold outputs heated liquid and vapor from the flow cavities. The package lid includes a central coolant supply inlet aligned to the central inlet manifold, and a peripheral liquid-vapor outlet to output heated liquid and vapor that exits from the peripheral outlet manifold. Guiding walls may be included in the flow cavities to guide a flow of liquid and vapor, and the guiding walls can be arranged to form radial flow channels that are feed by different inlet nozzles of the central inlet manifold.

Abstract: A package structure to implement two-phase cooling includes a chip stack disposed on a substrate, and a package lid that encloses the chip stack. The chip stack includes a plurality of conjoined chips, a central inlet manifold formed through a central region of the chip stack, and a peripheral outlet manifold. The central input manifold includes inlet nozzles to feed liquid coolant into flow cavities formed between adjacent conjoined chips. The peripheral outlet manifold outputs heated liquid and vapor from the flow cavities. The package lid includes a central coolant supply inlet aligned to the central inlet manifold, and a peripheral liquid-vapor outlet to output heated liquid and vapor that exits from the peripheral outlet manifold. Guiding walls may be included in the flow cavities to guide a flow of liquid and vapor, and the guiding walls can be arranged to form radial flow channels that are feed by different inlet nozzles of the central inlet manifold.

Abstract: A desalination system (1) for producing a distillate from a feed liquid includes: a steam raising device (2) having a liquid section (5) and a steam section (6) which are separated by a membrane system (7); a membrane distillation device (3) having a first steam section (11) and a liquid section (12) which are separated by a wall (14) and having a second steam section (13) which is separated from the liquid section (12) by a membrane system (15); and a heat exchange device (4) having a first liquid section (21) and a second liquid section (22), which are separated by a wall (23).

Abstract: An apparatus and corresponding method for heat exchange. The heat exchange apparatus may include an adsorber device. The adsorber device is configured to draw heat from a first heat reservoir and transfer heat to a first heat sink. The heat exchange apparatus may include a heat exchanger fluidly connected to the adsorber device by the working fluid. The heat exchanger transfers heat to a second heat sink. The heat exchange apparatus may include an expansion device fluidly connected to the heat exchanger by the working fluid. The expansion device expands the working fluid, and exchanges heat with a second heat reservoir. The expansion device includes a turbine device for converting at least a part of an exergy of the working fluid during expansion into mechanical work. The heat exchange apparatus may include the adsorber device being fluidly connected to the expansion device by the working fluid.