Abstract: A dynamic imaging system is provided. The system includes an assembly line, for an object to be placed thereon and for moving the object in a moving direction; a sensor set, for sensing a moving speed and the width of the object on the assembly line; a photography device, for capturing images of the object; and a controller, coupled to the sensor set and the photography device, for controlling the photography device to move and capture images of the object according to the moving speed and the width of the object.

Abstract: An optical inspection method including the following steps is disclosed. A tester is utilized to obtain an image of an inspection object. A target image region of the image is determined. Multiple central coordinates of multiple inspection ranges of a target image region are obtained. The central coordinates are filled to an array, and then the central coordinates are reordered according to relative relationships of the central coordinates to obtain a reordered coordinate array. The reordered coordinate array is compared with an original coordinate array to inspect whether parts of the inspection object corresponding to the inspection ranges are missed.

Abstract: An optical inspection method including the following steps is disclosed. A tester is utilized to obtain an image of an inspection object. A target image region of the image is determined. Multiple central coordinates of multiple inspection ranges of a target image region are obtained. The central coordinates are filled to an array, and then the central coordinates are reordered according to relative relationships of the central coordinates to obtain a reordered coordinate array. The reordered coordinate array is compared with an original coordinate array to inspect whether parts of the inspection object corresponding to the inspection ranges are missed.

Abstract: A dynamic imaging system is provided. The system includes an assembly line, for an object to be placed thereon and for moving the object in a moving direction; a sensor set, for sensing a moving speed and the width of the object on the assembly line; a photography device, for capturing images of the object; and a controller, coupled to the sensor set and the photography device, for controlling the photography device to move and capture images of the object according to the moving speed and the width of the object.

Abstract: The invention discloses a data processing system and method for managing production information associated with N1 electronic products requested according to a work order. N2 main devices are prepared based on the information of the work order and produced through a manufacturing line to produce N3 semi-products, and further through an assembling line to produce the N1 electronic products. Each of the main devices is provided with a respective first identification code at the start of the manufacturing line. Each of the semi-products is provided with a respective second identification code at the start of the assembling line.

Abstract: In the invention, a photoresist layer is first spread on a semiconductor structure, and then using a photomask with a specially designed pattern exposes the photoresist layer. Next, the photoresist layer is developed to form a patterned photoresist layer. Thereafter, using the patterned photoresist layer as a mask, a trench is formed in the semiconductor structure by selective etching. The pattern of the photomask according to the invention is formed as in the following steps. At first, a first pattern extending in a first direction and having a first side and a second side that is opposite to the first side is formed. Next, a second pattern extending in a second direction that is perpendicular to the first direction is formed in such a way that an end of the second pattern is connected with the first side of the first pattern. Thereafter, a concave edge is formed on the second side to substantially face the second pattern.

Abstract: A method for forming a self-aligned contact for a trench DMOS transistor comprises: providing a semiconductor substrate; etching a trench into the semiconductor substrate at a selected location on the surface of the semiconductor substrate; forming a first dielectric layer that covers the semiconductor substrate and walls of the trench; forming a plug in the trench, which comprises a step of depositing a semiconductor layer that covers the semiconductor substrate and fills in the trench, and a step of etching the semiconductor layer until the plug is below the trench for about 0.2 to 0.3 micron; forming a second dielectric layer on the plug; and forming a conductive layer over the second dielectric layer and the surface of the semiconductor substrate for ohmic contact regions.

Abstract: A horizontal type of packing machine with an adjustable pouch former, in which a guide screw having half left-handed threads and half right-handed threads is used for adjusting the width of the pouch former; a cylindrical gear is in mesh with two gears to drive a left and a right gear racks and to simultaneously adjust the height of two guide plates on both sides of the machine in order to adjust the height of the pouch former. According to the design of replaceable paper-guiding plates, a user can select the proper paper-guiding plates in accordance with the products and the packing paper for the purpose of increasing the function of the pouch former; the metal plate parts are used for forming a near quadric chain assembly by means of a rotary connector so as to have such parts moved and adjusted upon the adjustment of the pouch width.