Abstract: A packaging fabrication for an organic electroluminescence panel is disclosed. The panel comprises a printed circuit board, one or a plurality of OEL panels and a plurality of bumps, wherein the OEL is provided with poly solder interconnections in area array. The printed circuit board is provided with a plurality of solder pads arranged with bumps. One or a plurality of OEL is arranged on the printed circuit board and the poly solder interconnections and bumps are used to electrically connect the OEL with the printed circuit board. Further, the excellent heat dissipation property of the low re-flow temperature of the poly solder interconnections and the ceramic printed circuit board provides packaging fabrication for low temperature low stress OEL.

Abstract: An organic light-emitting panel includes a rear board, a heat spreader and a front board. In this case, the rear board has a first surface and a second surface opposite to the first surface. The heat spreader covers over the first surface and extends to the second surface. The heat spreader, which covers over the first surface of the rear board is formed with plural holes. The front board is set on the first surface and the heat spreader. The invention also discloses a manufacturing method of the panel. The method includes the steps of: fitting a rear board into a heat spreader in such a manner that the heat spreader covers over a first surface of the rear board and extends to a second surface opposite to the first surface of the rear board; and adhering a front board to the first surface of the rear board and the heat spreader.

Abstract: An organic light-emitting panel includes a rear board, a heat spreader and a front board. In this case, the rear board has a first surface and a second surface opposite to the first surface. The heat spreader covers over the first surface and extends to the second surface. The heat spreader, which covers over the first surface of the rear board is formed with plural holes. The front board is set on the first surface and the heat spreader. The invention also discloses a manufacturing method of the panel. The method includes the steps of: fitting a rear board into a heat spreader in such a manner that the heat spreader covers over a first surface of the rear board and extends to a second surface opposite to the first surface of the rear board; and adhering a front board to the first surface of the rear board and the heat spreader.

Abstract: A package structure of an OEL panel includes a printed circuit board, at least one OEL panel, and several bumps. Wherein, the OEL panel has several poly solder interconnections arranged in an array structure. The printed circuit board has several solder pads, which are also implemented with bumps. The at least one OEL panel is disposed on the printed circuit board to have the electric connection with the printed circuit board through the poly solder interconnections and the bumps.

Abstract: A process of packaging an OEL panel is disclosed. A printed circuit board is provided, wherein the printed circuit board comprises a plurality of bonding pads and a plurality of bumps on the bonding pads. Next, at least one OEL panel having a plurality of polysolder interconnections is provided. Next, the OEL panel disposed on the printed circuit board. A reflow process is performed so that the OEL panel can electrically connect with the PCB by the polysolder interconnections. Because of the low-temperature reflow process, the process of packaging an OEL panel can be accomplished by a low temperature process.

Abstract: A package structure of an OEL panel includes a printed circuit board, at least one OEL panel, and several bumps. Wherein, the OEL panel has several poly solder interconnections arranged in an array structure. The printed circuit board has several solder pads, which are also implemented with bumps. The at least one OEL panel is disposed on the printed circuit board to have the electric connection with the printed circuit board through the poly solder interconnections and the bumps.

Abstract: A process of packaging an OEL panel is disclosed. A printed circuit board is provided, wherein the printed circuit board comprises a plurality of bonding pads and a plurality of bumps on the bonding pads. Next, at least one OEL panel having a plurality of polysolder interconnections is provided. Next, the OEL panel disposed on the printed circuit board. A reflow process is performed so that the OEL panel can electrically connect with the PCB by the polysolder interconnections. Because of the low-temperature reflow process, the process of packaging an OEL panel can be accomplished by a low temperature process.

Abstract: A package structure of OEL panel is composed of a printed circuit board, one or multiple OEL panels, and multiple bumps. Wherein, the OEL panel has multiple poly solder interconnection arranged in an array structure. The printed circuit board has multiple solder pads, and bumps are disposed on the solder pads. The one or more OEL panel are disposed on the printed circuit board with the electric coupling via the poly solder interconnections, so as to have the electric connection for the OEL panel and the printed circuit board.

Abstract: An organic light-emitting panel includes a rear board, a heat spreader and a front board. In this case, the rear board has a first surface and a second surface opposite to the first surface. The heat spreader covers over the first surface and extends to the second surface. The heat spreader, which covers over the first surface of the rear board is formed with plural holes. The front board is set on the first surface and the heat spreader. The invention also discloses a manufacturing method of the panel. The method includes the steps of: fitting a rear board into a heat spreader in such a manner that the heat spreader covers over a first surface of the rear board and extends to a second surface opposite to the first surface of the rear board; and adhering a front board to the first surface of the rear board and the heat spreader.

Abstract: A linear motion damping device comprises a cylindrical body having a receiving compartment and an axial hole, in which a dragging rod is slidably disposed such that the threaded portion of the dragging rod is engaged with a fastening member which is confined to turn around the dragging rod at such time when the dragging rod is exerted on by an external force along the axial direction of the dragging rod. The fastening member acts to provide the dragging rod with a damping force at the time when the dragging rod is engaged in a displacement along the axial direction thereof.

Abstract: A ball grid array semiconductor package includes a substrate, a die mounted on the substrate and electrically connected to the substrate by bonding wires, a heat ring mounted on the substrate to surround the die and the bonding wires, and a heat slug mounted on the heat ring to entirely cover the die and the bonding wires thereby providing improved heat dissipation efficiency and overall electrical performance. Encapsulation material is filled into an inner space surrounded by the heat ring, heat slug and substrate to form an encapsulant for protecting the die and bonding wires. The heat ring and heat slug has at least a portion of surface area sequentially coated with a metal medium layer and an insulation layer to enhance the bonding degree between the encapsulant and the heat ring and heat slug.

Abstract: An adjustable torsion damper has a mount which is divided in the longitudinal direction thereof into two submounts made of a material conductive to magnetism. Located between the two submounts is a portion nonconductive to magnetism. The mount is provided at an upper end thereof and a lower end thereof with a first round hole and a second round hole. The first round hole runs between the submounts. A magnetic block is rotatably disposed in the first round hole. A rotary shaft is rotatably disposed in the second round hole. The rotary shaft is made of a material conductive to magnetism. The value of torsional moment of the rotary shaft changes along with the magnetic block in motion.

Abstract: A screwdriver is composed of a handle, a magnetic member, a shank, and an adjusting device. The handle is provided with an axial hole in which the magnetic member is disposed. The shank is pivotally disposed in the axial hole such that the shank is fastened at one end thereof with a blade, and that another end of the shank is capable of a mutual attraction with the magnetic member. The magnitude of the mutual attraction is adjusted by the adjusting device to determine a pre-set desired torsional moment. The handle and the shank are capable of turning relative to each other at the time when a torsional moment exerting on the screwdriver is greater than the pre-set desired torsional moment.

Abstract: A device for stopping automatically an overloaded lathe comprises a support base, a front holding base, a rear holding base eccentric cam, a locating block, and a lathe tool. The front holding base is fastened with the front end of the support base by means of a screw which is fitted over by a resilient washer. The lathe tool has a handle which is fastened at the front end thereof with the front holding base. The rear holding base eccentric cam is fastened with the rear end of the support base by means of a screw which is fitted over by a resilient washer. The handle of the lathe tool is urged at the rear end thereof by the rear holding base eccentric cam. The locating block is fastened with the support base and is provided with a proximity switch having an electric circuit connected with the electric circuit of the main shaft motor of the lathe. The rear end of the handle of the lathe tool is urged by the locating block.

Abstract: A method and a device for preventing a drilling chip from winding around a drill bit and for removing the drilling chip deposited in flutes of the drill bit comprising a drill bit acting as a driving member and a driven gear having at least one tooth engageable with flutes of the drill bit. As the drill bit is turned to drill a hole, the driven gear is actuated to turn such that the tooth of the driven gear engages the flute of the drill bit so as to scrape off any drilling chip deposited in the flute of the drill bit and to prevent the drilling chip from winding around the drill bit in action. The driven gear is rotatably and movably fastened to a support rod which is in turn fastened to a drill press.