Abstract: A method for manufacturing a semiconductor structure includes forming a first interconnect feature in a first dielectric feature, the first interconnect feature including a first conductive element exposed from the first dielectric feature; forming a first cap feature over the first conductive element, the first cap feature including a first cap element which includes a two-dimensional material; forming a second dielectric feature with a first opening that exposes the first cap element; forming a barrier layer over the second dielectric feature while exposing the first cap element from the barrier layer; removing a portion of the first cap element exposed from the barrier layer; and forming a second conductive element in the first opening.

Abstract: A backplane with multiple arrayed electrodes positioned on the backplane is provided in a method of fabricating a liquid crystal (LC) panel. The method begins with coating an alignment layer on the backplane. By performing a rubbing process, multiple alignment trenches are formed on the alignment layer. A photoresist layer is then formed on the alignment layer. By performing a lithography process, both a side frame, having at least one slit, and multiple photoresist spacers(PR spacers) are formed on the alignment layer. A gasket seal is coated on the side frame and the multiple PR spacers. By performing a lamination process, a transparent conductive layer is laminated on the backplane. A liquid crystal filling (LC filling) processis then performed to fill a cell gap between the backplane and the transparent conductive layer with liquid crystal. Finally, an end sealing process is performed to seal the slit.

Abstract: A backplane with multiple arrayed electrodes positioned on the backplane is provided in a method of fabricating a liquid crystal (LC) panel. The method begins with coating an alignment layer on the backplane. By performing a rubbing process, multiple alignment trenches are formed on the alignment layer.A photoresist layer is then formed on the alignment layer. By performing a lithography process, both a side frame, having at least one slit, and multiple photoresist spacers(PR spacers) are formed on the alignment layer. A gasket seal is coated on the side frame and the multiple PR spacers. By performing a lamination process, a transparent conductive layer is laminated on the backplane. A liquid crystal filling (LC filling) process is then performed to fill a cell gap between the backplane and the transparent conductive layer with liquid crystal. Finally, an end sealing process is performed to seal the slit.

Abstract: A silicon backpanel structure of a LCOS is described. The present silicon back panel has a cell region and a routing/pad region, wherein the cell region of the silicon backpanel is arranged with a plurality of pixels and an alignment layer is disposed over the silicon backpanel, and the routing/pad region is arranged with a patterned trace and a plurality of routing/pads, and the routings/pads are electrically bonded to the pixels by means of the patterned trace. Furthermore, the patterned trace of the routing/pad regions is mounted with a break protective layer. This break protective layer protects the patterned trace of the routing/pad region from damage by the pressing of the upper transparent substrate in the subsequent breaking stage.

Abstract: A monitor filter includes a body having a front cover formed on an upper edge with a recess having a semi-tubular portion at both ends, a rear cover formed on an upper edge with a recess having a semi-tubular portion at both ends, the semi-tubular portion of the rear cover being adapted to the semi-tubular portion of the front cover to form a tubular portion, a spring fitted in the tubular portion, a screen disposed between the front cover and the rear cover; and a fixing frame having two toothed ends each having a protuberance engaged with the spring, the fixing frame being formed with a groove on a top for receiving the body; whereby the monitor filter can be easily assembled and can be turned over through an angle of 210 degrees thereby making it easier to be cleaned.