Abstract: A method for predicting clinical severity of a neurological disorder includes steps of: a) identifying, according to a magnetic resonance imaging (MRI) image of a brain, brain image regions each of which contains a respective portion of diffusion index values of a diffusion index, which results from image processing performed on the MRI image; b) for one of the brain image regions, calculating a characteristic parameter based on the respective portion of the diffusion index values; and c) calculating a severity score that represents the clinical severity of the neurological disorder of the brain based on the characteristic parameter of the one of the brain image regions via a prediction model associated with the neurological disorder.

Abstract: A protective mobile phone casing which is engaged on the peripheral edges and the back of a mobile phone, the mobile phone casing has a back plate being confronted with the back side of the mobile phone, the exterior surface or the inner surface of the back plate is provided thereon with a recess, and the recess is sealed and covered by a cover plate; filling liquid and a kind of light energy storage luminous powder are filled between the recess and the cover plate, the luminous powder flows downwards in the filling liquid by the function of gravity when the mobile phone casing is moved, hence a dynamic visual effect quasi sand shifting is induced.

Abstract: A light emitting earphone structure comprising a controller, a broadcasting line set and a sound source line set, the controller is provided inside of it with at least an LED lamp, the broadcasting line set includes two broadcasting units, and at least two light guiding fibers respectively provided along the broadcasting lines; when a user is listening music, the LED lamp lightens and flashes, and by optically guiding of the guiding fibers, lightening and flashing rise surrounding the broadcasting lines, hence an effect of easily being seen and a warning function and an effect of amusement can be obtained.

Abstract: An earpiece set capable of emitting light and flashing according to changing of acoustic frequency including a pair of sound broadcasting units having earplugs and ear muffs, a pair of audio connectors and a pair of audio cables to transmit acoustic signals, wherein the audio cables electrically connect with a pair of control units for receiving acoustic signals, the control units are respectively electrically connected with a pair of LED light strips respectively extending along the audio cables to the sound broadcasting units, for driving the LED light strips for light emitting and flashing according to changing of acoustic frequency of the acoustic signals, thus effects of being easily discerned and providing safe warning and amusement can be achieved for a user.

Abstract: An exhaust gas processing conduit includes a main pipe and a purge pipe. The main pipe has a first sidewall and a connecting port formed on the first sidewall. The purge pipe has one end connected to the first sidewall via the connecting port. The purge pipe has a second sidewall in contact with the first sidewall at an oblique angle. A gas provided by the purge pipe is injected along the first sidewall and into the main pipe so as to guide the gas flowing along a spiral route at the oblique angle. In addition, a manufacturing apparatus and a gas flow guiding method thereof are also disclosed in the invention.

Abstract: A semiconductor package having chip using copper process is revealed. A chip using copper process is disposed on a substrate. The substrate has a core layer, a copper circuitry with connecting pads, a patterned diffusion barrier, and a solder mask. The copper circuitry is formed on the core layer. The patterned diffusion barrier has such a pattern identical to the one of the copper circuitry that an upper surface of the copper circuitry is completely covered. The substrate further has a bonding layer formed on a portion of the patterned diffusion barrier inside the solder mask's opening. Therefore, diffusion of copper ions from the copper circuitry of the substrate to the active surface of the chip can be avoided to prevent function failure of the chip.

Abstract: A semiconductor package having chip using copper process is revealed. A chip using copper process is disposed on a substrate. The substrate has a core layer, a copper circuitry with connecting pads, a patterned diffusion barrier, and a solder mask. The copper circuitry is formed on the core layer. The patterned diffusion barrier has such a pattern identical to the one of the copper circuitry that an upper surface of the copper circuitry is completely covered. The substrate further has a bonding layer formed on a portion of the patterned diffusion barrier inside the solder mask's opening. Therefore, diffusion of copper ions from the copper circuitry of the substrate to the active surface of the chip can be avoided to prevent function failure of the chip.

Abstract: A semiconductor package with MPS-C2 configuration is revealed, primarily comprising a substrate and a chip. A plurality of leads covered by a solder mask having a rectangular slot disposed on the top surface of the substrate to expose parts of the leads. A plurality of metal pillars are disposed on the active surface of the chip. A patterned plating layer is partially formed on the exposed portions of the leads located inside the slot to form a plurality of plating-defined fingers. Therefore, the soldering area of the solder on the leads can be constrained without exceeding the patterned plating layer to avoid issue of excessive solder ability.

Abstract: A wafer structure with conductive bumps and fabrication method thereof are disclosed herein. Conductive bumps are later converted into conductive balls. A central area and a marginal area are defined on the wafer. To achieve heights among conductive balls formed on the wafer structure, the sizes (can be but not limited to one) of under bump metallurgy (UBM) layer blocks in the central area are smaller than that in the marginal area. The fabrication procedure for forming under bump metallurgy layer blocks of different size includes depositing a photoresist layer on the metallurgy layer and pattern the photoresist with a photomask of smaller opening area for the central area than for the marginal area, and removing the photoresist layer and the portion of metallurgy layer under the photoresist layer.

Abstract: An optical display module includes a liquid crystal panel, a driving IC, a flexible printed circuit board, a plurality of first pads, a plurality of second pads, at least a light source and a heat conductive member. The driving IC is provided on the liquid crystal panel and electrically connected to the flexible printed circuit board. The flexible printed circuit board includes through holes open at opposite sides. The first and second pads are provided on the opposite sides of the flexible printed circuit board respectively and connected to each other through the through holes. The light source electrically connected to the first pads. The heat conductive member is attached on the second pads. Heat of the light source is conducted to the heat conductive member through the first pads and the second pads in sequence to reduce the temperature around the light source.

Abstract: A stabilizing system for a plasma process is provided. The system has a high frequency power source, a plasma chamber, a control circuit for outputting a control signal, first switch element and an impedance matching network. The first switch element has a first, a second and a first switch control terminals, wherein the first and the first switch control terminals are coupled to the control circuit to determines whether the first and the second terminals element are connected or not according to the control signal. The impedance matching network has a first terminal coupled to the plasma chamber, a second terminal coupled to the high frequency power source and a matching control terminal coupled to the second terminal of the first switch element. In this way, whether an impedance matching auto-tune operation for the high frequency power is performed or not is determined based on the control signal.