Abstract: An assembling structure includes a base, an assembling body and a fastening element. The base has a ring groove. The assembling body includes at least two first fastening portions. The fastening element is disposed inside the ring groove and can be rotatably installed on the base. The fastening element includes at least two second fastening portions. The fastening element can rotate relative to the base and has a fastening position and a releasing position. When the fastening element is at the fastening position, the two first fastening portions are fastened with the two second fastening portions respectively. When the fastening element is at the releasing position, the two first fastening portions are detached from the two second fastening portions respectively.

Abstract: An electronic device and a joint are provided. The electronic device includes a casing, an electronic element and the joint. The casing has a cable hole. The electronic element is disposed inside the casing. The joint includes a body, a waterproof and breathable film and a fastener. The body is fixed to the cable hole and has a breathable channel. The waterproof and breathable film is disposed at the breathable channel. The fastener is used for fastening a power cable to the body. The power cable passes through the fastener and the body and electrically connects the electronic element. The joint, a power cable and the casing form a waterproof and breathable chamber.

Abstract: A lens-holding-and-aligning seat and an LED light panel thereof are presented. The light panel includes a substrate, an LED, a lens and a holding-and-aligning seat. The LED is disposed on the substrate in corresponding to a soldering pad of the substrate, and the holding-and-aligning seat has a holding portion and an aligning element. The lens is fixed on the holding-and-aligning seat by the holding portion, and the aligning element is bonded on the soldering pad corresponding to the soldering pad by a reflow process. Therefore, the lens is aligned with the LED by a soldering self-alignment mechanism, such that the light shape and light intensity distribution of the light emitted by the LED may be adjusted by the lens.

Abstract: A lens-holding-and-aligning seat and an LED light panel thereof are presented. The light panel includes a substrate, an LED, a lens and a holding-and-aligning seat. The LED is disposed on the substrate in corresponding to a soldering pad of the substrate, and the holding-and-aligning seat has a holding portion and an aligning element. The lens is fixed on the holding-and-aligning seat by the holding portion, and the aligning element is bonded on the soldering pad corresponding to the soldering pad by a reflow process. Therefore, the lens is aligned with the LED by a soldering self-alignment mechanism, such that the light shape and light intensity distribution of the light emitted by the LED may be adjusted by the lens.

Abstract: A flexible radio frequency identification label and a method for fabricating the same are proposed. A first flexible protection layer is attached to a second flexible protection layer to form a closed space for receiving a radio frequency identification circuit. By such arrangement, a good flexibility can be provided by the flexible protection layers, and the closed space also enables the radio frequency identification circuit to be protected and isolated from the moisture in the outside environment, such that the circuit can be prevented from being oxidized and the service life of the product can be extended.

Abstract: A flexible radio frequency identification label and a method for fabricating the same are proposed. A first flexible protection layer is attached to a second flexible protection layer to form a closed space for receiving a radio frequency identification circuit. By such arrangement, a good flexibility can be provided by the flexible protection layers, and the closed space also enables the radio frequency identification circuit to be protected and isolated from the moisture in the outside environment, such that the circuit can be prevented from being oxidized and the service life of the product can be extended.

Abstract: A semiconductor device with reinforced under-support structure and a method for fabricating the semiconductor device are provided, which can be used in the packaging of an MPBGA/TFBGA (Multi-Package Ball Grid Array & Thin Fine-pitch Ball Grid Array) module to help reinforce the TFBGA under-support structure therein. The proposed chip-packaging method is characterized by the provision of large-area solder pads at the corners of a solder-pad array used for TFBGA attaching application, in order to form solder bumps of a large cross section and volume during reflow process to help reinforce the TFBGA under-package structure. This feature can reinforce the TFBGA under-package structure without having to use flip-chip underfill technology, and without having to use extra large type solder balls and arrange pads into different pitches as in the prior art.

Abstract: A semiconductor device with reinforced under-support structure and a method for fabricating the semiconductor device are provided, which can be used in the packaging of an MPBGA/TFBGA (Multi-Package Ball Grid Array & Thin Fine-pitch Ball Grid Array) module to help reinforce the TFBGA under-support structure therein. The proposed chip-packaging method is characterized by the provision of large-area solder pads at the corners of a solder-pad array used for TFBGA attaching application, in order to form solder bumps of a large cross section and volume during reflow process to help reinforce the TFBGA under-package structure. This feature can reinforce the TFBGA under-package structure without having to use flip-chip underfill technology, and without having to use extra large type solder balls and arrange pads into different pitches as in the prior art.