Abstract: An electronic assembly includes a Light Emitting Diode (LED) and a substrate. The LED has a solderable surface other than the contacts. The substrate has an opening. The solderable surface is mounted substantially over the opening. When the opening is filled with solder, the solderable surface is metallically bonded with the solder in the opening.

Abstract: Light sources are disclosed herein. One embodiment comprises a substrate having a first surface and a second surface located opposite the first surface. At least one first electrically conductive layer is affixed to the first surface of the substrate and partially covering the first surface of the substrate. At least one second electrically conductive layer is affixed to the first surface of the substrate and partially covering the first surface of the substrate. A light emitter is affixed to the first surface of the substrate in an area not covered by either of the at least one first electrically conductive layer or the at least one second electrically conductive layer. The substrate may be thinner in the area where the light emitter is affixed than in the areas where the first and second electrically conductive layers are affixed. A heat sink may be attached to the second surface of the substrate.

Abstract: A light emitter is disclosed herein. An embodiment of the light emitter comprises a substrate having a substrate surface; a light emitting diode located on the substrate surface; an encapsulant located on the substrate surface and encapsulating the light emitting diode; and a reflector cup attached to the substrate, the reflector cup having a reflector cup first side and a reflector cup second side with a hole extending between the reflector cup first side and the reflector cup second side, wherein the reflector cup first side is attached to the substrate surface so that the hole in the reflector cup first side encompasses the light emitting diode.

Abstract: Light sources are disclosed herein. An embodiment of a light sources comprises a substrate having a first surface and a second surface located opposite the first surface. At least one first electrically conductive layer is affixed to the first surface of the substrate and partially covering the first surface of the substrate. At least one second electrically conductive layer is affixed to the first surface of the substrate and partially covering the first surface of the substrate. A light emitter is affixed to the first surface of the substrate in an area not covered by either of the at least one first electrically conductive layer or the at least one second electrically conductive layer.

Abstract: A system and method for lighting structure designs, for example LED packaging, reflector designs and optics in lighting fixture, has been illustrated. In one embodiment, the lighting structure has multiple reflective surfaces such that a first reflective surface and a second surface form a first angle less than 90 degree while the second surface and a third reflective surface forms a second angle of less than 270 degree. The method can be applied in both LEDs package designs and second level optical application designs of a light module.

Abstract: Light sources are disclosed herein. An embodiment of a light sources comprises a substrate having a first surface and a second surface located opposite the first surface. At least one first electrically conductive layer is affixed to the first surface of the substrate and partially covering the first surface of the substrate. At least one second electrically conductive layer is affixed to the first surface of the substrate and partially covering the first surface of the substrate. A light emitter is affixed to the first surface of the substrate in an area not covered by either of the at least one first electrically conductive layer or the at least one second electrically conductive layer.

Abstract: Light sources are disclosed herein. One embodiment comprises a substrate having a first surface and a second surface located opposite the first surface. At least one first electrically conductive layer is affixed to the first surface of the substrate and partially covering the first surface of the substrate. At least one second electrically conductive layer is affixed to the first surface of the substrate and partially covering the first surface of the substrate. A light emitter is affixed to the first surface of the substrate in an area not covered by either of the at least one first electrically conductive layer or the at least one second electrically conductive layer. The substrate may be thinner in the area where the light emitter is affixed than in the areas where the first and second electrically conductive layers are affixed. A heat sink may be attached to the second surface of the substrate.

Abstract: An electronic assembly includes a Light Emitting Diode (LED) and a substrate. The LED has a solderable surface other than the contacts. The substrate has an opening. The solderable surface is mounted substantially over the opening. When the opening is filled with solder, the solderable surface is metallically bonded with the solder in the opening.

Abstract: A light emitting device comprising a ceramic substrate is disclosed. And embodiment of the substrate comprises a mounting portion, a peripheral wall extending from the mounting portion, and a reflective surface extending from the peripheral wall opposite the mounting portion. The reflective surface has a reflective material located thereon. The peripheral wall, the mounting portion, and the reflective surface form a well. A light emitter is located adjacent the mounting portion. A transparent material is located in the well. The peripheral wall is devoid of the reflective material.

Abstract: A system and method for lighting structure designs, for example LED packaging, reflector designs and optics in lighting fixture, has been illustrated. In one embodiment, the lighting structure has multiple reflective surfaces such that a first reflective surface and a second surface form a first angle less than 90 degree while the second surface and a third reflective surface forms a second angle of less than 270 degree. The method can be applied in both LEDs package designs and second level optical application designs of a light module.

Abstract: A light emitting device comprising a ceramic substrate is disclosed. And embodiment of the substrate comprises a mounting portion, a peripheral wall extending from the mounting portion, and a reflective surface extending from the peripheral wall opposite the mounting portion. The reflective surface has a reflective material located thereon. The peripheral wall, the mounting portion, and the reflective surface form a well. A light emitter is located adjacent the mounting portion. A transparent material is located in the well. The peripheral wall is devoid of the reflective material.