Abstract: This disclosure provides combination therapy for treating a subject, such as a subject afflicted with a lung cancer, comprising administering to the subject an anti-fucosyl-GM1 antibody and an anti-CD137 antibody, or antigen-binding portions of either or both.

Abstract: A carrier board conveying box with a reinforced structure comprises a container body, two clamping parts, and at least two reinforced structures. The container body has a top plate, a bottom plate, a plurality of side plates connecting the top plate and the bottom plate and a side opening. The top plate, the bottom plate, and the side plates are clamped to form an accommodating space. Two clamping parts are respectively disposed at two opposite sides of the container body. At least two reinforced structures are respectively disposed at the two opposite sides of the container body, and each of the reinforced structures is adjacent to a position of the side opening. The carrier board conveying box with a reinforced structure solves the problem of container distortion and deformation of the container body caused by load factors because of repeatedly bearing the weight of the carrier boards during transfer.

Abstract: A top-opening substrate carrier comprises a container body, a door member and at least one latching mechanism. The latching mechanism includes a rotary drive member, a first driven cam, a second driven cam, a first connecting rod, a second connecting rod, two longitudinal latching arms and two lateral latching arms. The first driven cam and the second driven cam are disposed at two sides of the rotary drive member. When the rotary drive member is rotated by force, it links and activates the first connecting rod and the second connecting rod to synchronously drive the first driven cam and the second driven cam to rotate, thereby driving the two longitudinal latching arms and the two lateral latching arms to project towards locking holes of the container body and locked, or retract from the locking holes of the container body and unlocked.

Abstract: A door locking mechanism and semiconductor container using the same include door panel, cover, and locking module. The door panel has a first stop structure. The cover and the door panel define an accommodating space for receiving the locking module. The locking module includes rotating member, holding member, and elastic member. The elastic member is disposed on the holding member and has a second stop structure near the first stop structure. The elastic member is disposed between the holding and the rotating member. The elastic member is compressed when a force is applied to the holding member, and the second stop structure detaches from a limitation state with the first stop structure for allowing a rotating operation of the rotating member. The elastic member elastically restores when the force is removed, and the second stop structure returns to the limitation state for limiting the rotating operation.

Abstract: This invention discloses a reticle pod and gripping unit thereof. The aforementioned gripping unit comprises a gripping arm and at least two gripping modules. The gripping arm is hold and configured on the reticle pod, and each gripping module is deposed on the end of the gripping arm, passing through the reticle pod. A single gripping module comprises a case, a stopper and a spring unit. The case is configured on and in the reticle pod. The stopper is configured in the case and passes through the reticle pod. The spring unit is connected with the stopper.

Abstract: The present invention discloses a reticle container which comprises an upper cover and a lower cover. A plurality of identification modules is disposed on the edge of the reticle container. Therefore, the user can quickly identify the usage of the reticle container or number per se. On the other hand, the reticle container of the present invention further comprises supporters, sustainers and connecting modules. Therefore, the reticle container of the present invention is able to satisfy various structural requirements and conditions for carrying the reticle in a sealed environment.

Abstract: A central support device for supporting plate-shaped objects and a storage apparatus for storing the plate-shaped objects are provided and adapted to regulate the heights of support elements and confine front ends thereof to a specified range. The central support device includes a casing, the support elements and height adjustment elements. Partition portions each having a dent portions are disposed at the casing and arranged in the heightwise direction, with a support element receiving slot defined between every two adjacent partition portions. Bottom sides of the dent portions slope in the heightwise direction. One end of each support element is connected to a bottom portion of a corresponding support element receiving slot. The height adjustment elements are disposed in the dent portions, respectively, and extend in the heightwise direction to form top ends for supporting the support elements. The storage apparatus also includes the central support device.

Abstract: A modularized large-sized carrier includes at least two body modules, at least one hermetic seal component and a back board. The body modules are connected to each other peripherally and arranged in a depth direction. The hermetic seal component surrounds junctions of the body modules. The back board is disposed behind the last one of the body modules. The modularized large-sized carrier overcomes existing carrier size limitations otherwise caused by injection molding machines and continuously expands in the depth direction to thereby enlarge the airtight storage space of the carrier.

Abstract: A supporting shelf module includes a plurality of plastic supporting plates parallelly arranged in a height direction, and at least one pair of metal-made connectors located at two opposite ends of the supporting plates in the height direction. The connectors in one pair are correspondingly located in two horizontal planes perpendicular to the height direction. A wafer container is also disclosed, which includes a container body having at least two sets of the supporting shelf modules mounted therein, at least two top retaining brackets and at least two bottom retaining grooves provided on an inward side of a top and a bottom panel of the container body, respectively. The supporting shelf module has upper ends engaged with the top retaining brackets and lower ends engaged with and limited to the bottom retaining grooves in an engaging direction. Thus, the tolerance problem of the conventional wafer shelf can be solved.

Abstract: A central support device for supporting plate-shaped objects and a storage apparatus for storing the plate-shaped objects are provided and adapted to regulate the heights of support elements and confine front ends thereof to a specified range. The central support device includes a casing, the support elements and height adjustment elements. Partition portions each having a dent portions are disposed at the casing and arranged in the heightwise direction, with a support element receiving slot defined between every two adjacent partition portions. Bottom sides of the dent portions slope in the heightwise direction. One end of each support element is connected to a bottom portion of a corresponding support element receiving slot. The height adjustment elements are disposed in the dent portions, respectively, and extend in the heightwise direction to form top ends for supporting the support elements. The storage apparatus also includes the central support device.

Abstract: A substrate container with enhanced flow field therein includes a box, at least one offset inflation mechanism and at least one gas diffusion mechanism. The offset inflation mechanism is disposed outside internal receiving space of the box. The offset inflation mechanism has a gaseous chamber extending in the same direction as a bottom panel. The gas diffusion mechanism includes a base, a partition wall and at least one diffusion member. The base masks an outlet of the gaseous chamber to form an auxiliary gaseous chamber. The partition wall extends perpendicularly to the bottom panel to form a vertical first gas channel in communication with the auxiliary gaseous chamber. The diffusion member and the partition wall together define a second gas channel. The partition wall has at least one gap whereby the first gas channel and the second gas channel are in communication with each other.

Abstract: The present invention provides a microchannel heat sink with plural microchannels, each having a respective inlet and outlet to permit flow, in particular two-phase flow, of a working fluid. The plural microchannels are arranged such that adjacent microchannels accommodate flow of working fluid in opposite directions and are thermally coupled to each other to enable heat exchange between the corresponding adjacent microchannels. In one aspect, a microchannel inlet is positioned at an angle (e.g., 90 degrees) with respect to its outlet. The plural microchannels define parallel longitudinal axes that are optionally arranged on the same plane and/or side-by-side in a single layer. Further, in one aspect, each microchannel cross-sectional area increases as the channel length progresses from an upstream end (e.g., adjacent to the inlet) to a downstream end (e.g., adjacent to the outlet) of the corresponding microchannel.

Abstract: The present invention discloses a shielding jig which mainly comprises an adjustment unit, a positioning unit and a sealing unit. The adjustment unit is configured and engaged between the positioning unit and the sealing unit. Therefore, a first actuation surface of the adjustment unit matches with a second actuation surface of the sealing unit, resulting in expansion of the sealing unit. This expansion makes the shielding jig be able to shade and seal any workpiece.

Abstract: The invention discloses a substrate carrier latching structure, which mainly comprises a top portion, a cover and a detachable module. The top portion is disposed on the enclosure of a substrate carrier, and the cover is connected to the top portion via a detachable module. As such, the excessive stress on the substrate carrier is avoided to maintain the integrity of substrates stored in the inner portion of the substrate carrier.