Patents by Inventor Chin-Peng Wang

Chin-Peng Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated apparatus including driver chips, a power supply and LED chips on an isolative substrate
    Patent number: 8829537
    Abstract: Disclosed is an integrated apparatus including an isolative substrate, a plurality of driver chips provided on a side of the isolative substrate, a power supply provided on the side of the isolative substrate and electrically connected to the driver chips, and LED chips provided on another side of the isolative substrate and electrically connected to the driver chips. Thus, the driver chips, the power supply and the LED chips are integrated on the isolative substrate. The production is easy. The integrated apparatus is not vulnerable to surges and lightning strikes. Electromagnetic interferences are reduced. Heat radiation of the integrated apparatus is excellent so that the LED chips are protected from thermal effect.
    Type: Grant
    Filed: September 22, 2011
    Date of Patent: September 9, 2014
    Assignee: Chung-Shan Institute of Science and Technology, Armaments, Bureau, Ministry of National Defense
    Inventors: Yang-Kuao Kuo, Chin-Peng Wang, Lea-Hwung Leu
  • Integrated Apparatus Including Driver Chips, a Power Supply and LED Chips on an Isolative Substrate
    Publication number: 20130032826
    Abstract: Disclosed is an integrated apparatus including an isolative substrate, a plurality of driver chips provided on a side of the isolative substrate, a power supply provided on the side of the isolative substrate and electrically connected to the driver chips, and LED chips provided on another side of the isolative substrate and electrically connected to the driver chips. Thus, the driver chips, the power supply and the LED chips are integrated on the isolative substrate. The production is easy. The integrated apparatus is not vulnerable to surges and lightning strikes. Electromagnetic interferences are reduced. Heat radiation of the integrated apparatus is excellent so that the LED chips are protected from thermal effect.
    Type: Application
    Filed: September 22, 2011
    Publication date: February 7, 2013
    Applicant: Chung-Shan Institute of Science and Technology, Armaments, Bureau, Ministry of National Defense
    Inventors: Yang-Kuao Kuo, Chin-Peng Wang, Lea-Hwung Leu
  • Fluorescent Coating and a Method for Making the Same
    Publication number: 20130032837
    Abstract: Disclosed is a fluorescent coating and a method for making the same. At first, fluorescent powder is mixed with an anti-electrostatic solution. The mixture is cleared of impurities before it is dried and sintered. Thus, the fluorescent powder is coated with the anti-electrostatic material. The fluorescent powder coated with the anti-electrostatic material is plated on a side of a light-emitting diode (“LED”) chip by electrophoresis, thus forming a mixing zone on the side of the LED chip. Hence, the mixing zone is not vulnerable to deterioration or itiolation when it is subjected to heat in use. Accordingly, the life of the LED chip is long, and the illumination of the LED chip is high.
    Type: Application
    Filed: September 21, 2011
    Publication date: February 7, 2013
    Applicant: Chung-Shan Institute of Science and Technology, Armaments, Bureau, Ministry of National Defense
    Inventors: Yang-Kuao Kuo, Hsin-Liang Chen, Chun-Yen Lo, Chin-Peng Wang