Abstract: An electrical connector for mounting on an external circuit board includes: an insulating body having an upper receiving space and a lower receiving space; a terminal module assembled on the insulating body and including plural pin terminals, each pin terminal having a pin for mounting on the external circuit board, wherein the terminal module is capable of being modified to support 1G or 2.5G or 5G or 10G or 25G or 40G signal transmission while keeping arrangement pattern of the pins unchanged in order to be mounted on the same external circuit board.

Abstract: A method includes bonding a composite die on a redistribution structure. The composite die comprises a device die including a semiconductor substrate, a through-semiconductor via penetrating through the semiconductor substrate, a metal via at a surface of the device die, and a sacrificial carrier attached to the device die. The composite die is encapsulated in an encapsulant. A planarization process is performed on the composite die and the encapsulant, and the sacrificial carrier is removed to reveal the metal via. A conductive feature is formed to electrically couple to the metal via.

Abstract: A mounting apparatus for a storage device includes a mounting tray, a bracket and a sliding member received in the bracket. The mounting tray includes a mounting plate. The bracket is secured to the mounting plate and used to secure the storage device. A securing member is located on the storage device, and a clipping member is located on the bracket. The sliding member is received in the bracket and is slidably located between the bracket and the mounting tray. The sliding member is slidable by the storage device relative to the mounting plate, to engage the securing member with the clipping member.