Patents by Inventor Chin-Ping Lin

Chin-Ping Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240036598
    Abstract: A key structure includes a baseplate, a keycap and a connecting assembly. The keycap includes a plurality of first pivot portions and a plurality of sliding slots. The connecting assembly includes a first outer frame, two first inner frames, a second outer frame and a second inner frame. The first inner frames are disposed in two accommodating portions of the first outer frame. Two sides of the first outer frame are respectively connected to part of the sliding slots and the baseplate. Two sides of the first inner frame are respectively connected to the first pivot portion and the base plate. Two sides of the second outer frame are respectively connected to part of the sliding slots and the fixing side. Two sides of the second inner frame are respectively pivoted to one of the first inner frames and the base plate.
    Type: Application
    Filed: December 6, 2022
    Publication date: February 1, 2024
    Inventors: SHIN-CHIN WENG, CHIN-PING LIN, SHIH-YU HSU, LIANG-CHUN YEH, BO-WEI SU
  • Patent number: 11640883
    Abstract: A key module includes a bracket, a circuit film assembly, a keycap, and a connecting structure. The bracket includes a bottom plate and a bracket pivotal portion protruding from the bottom plate. The circuit film assembly is disposed on the bracket and includes a plurality of film layers and a supporting portion formed by at least one of the film layers. The supporting portion is located beside the bracket pivotal portion. The keycap is disposed above the bracket and the circuit film assembly and includes a keycap pivotal portion. The connecting structure is disposed between the bracket and the keycap and includes a first pivot pivotally disposed at the bracket pivotal portion and a second pivot pivotally disposed at the keycap pivotal portion. The supporting portion beside the bracket pivotal portion supports the first pivot, such that the first pivot continuously contacts the bracket pivotal portion.
    Type: Grant
    Filed: February 10, 2022
    Date of Patent: May 2, 2023
    Assignee: Chicony Electronics Co., Ltd.
    Inventors: Shin-Chin Weng, Chin-Ping Lin, Shih-Yu Hsu, Chih-Feng Chen
  • Publication number: 20220293359
    Abstract: A key module includes a bracket, a circuit film assembly, a keycap, and a connecting structure. The bracket includes a bottom plate and a bracket pivotal portion protruding from the bottom plate. The circuit film assembly is disposed on the bracket and includes a plurality of film layers and a supporting portion formed by at least one of the film layers. The supporting portion is located beside the bracket pivotal portion. The keycap is disposed above the bracket and the circuit film assembly and includes a keycap pivotal portion. The connecting structure is disposed between the bracket and the keycap and includes a first pivot pivotally disposed at the bracket pivotal portion and a second pivot pivotally disposed at the keycap pivotal portion. The supporting portion beside the bracket pivotal portion supports the first pivot, such that the first pivot continuously contacts the bracket pivotal portion.
    Type: Application
    Filed: February 10, 2022
    Publication date: September 15, 2022
    Applicant: Chicony Electronics Co., Ltd.
    Inventors: Shin-Chin Weng, Chin-Ping Lin, Shih-Yu Hsu, Chih-Feng Chen