Patents by Inventor Chin S. Chu

Chin S. Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5926695
    Abstract: Disclosed are methods and apparatuses for manufacturing a semiconductor device package utilizing a lead frame which has one or more encapsulant material flow diverters. The lead frame having material flow diverters includes a multiplicity of leads and at least material flow diverter. The material flow diverter is arranged in such a manner as to control the amount of encapsulant material which is directed both above and below an attached die during the encapsulation process.
    Type: Grant
    Filed: June 10, 1997
    Date of Patent: July 20, 1999
    Assignee: National Semiconductor Corporation
    Inventors: Chin S. Chu, Peter Spalding