Abstract: Some implementations described herein provide a shutter disc for use during a conditioning process within a processing chamber of a deposition tool. The shutter disc described herein includes a material having a wave-shaped section to reduce heat transfer to the shutter disc and to provide relief from thermal stresses. Furthermore, the shutter disc includes a deposition of a thin-film material on a backside of the shutter disc, where a diameter of the shutter disc causes a spacing between an inner edge of the thin-film material and an outer edge of a substrate support component. The spacing prevents an accumulation of material between the thin film material and the substrate support component, reduces tilting of the shutter disc due to a placement error, and reduces heat transfer to the shutter disc.

Abstract: A display may have an array of pixels each of which has a light-emitting diode such as an organic light-emitting diode. A drive transistor and an emission transistor may be coupled in series with the light-emitting diode of each pixel between a positive power supply and a ground power supply. The pixels may include first and second switching transistors. A data storage capacitor may be coupled between a gate and source of the drive transistor in each pixel. Signal lines may be provided in columns of pixels to route signals such as data signals, sensed drive currents from the drive transistors, and predetermined voltages between display driver circuitry and the pixels. The switching transistors, emission transistors, and drive transistors may include semiconducting-oxide transistors and silicon transistors and may be n-channel transistors or p-channel transistors.

Abstract: A gas-permeable package lid of a chip package structure and a manufacturing method thereof are provided. The gas-permeable package lid of the chip package structure includes a lid body, a through hole, and a hydrophobic gas-permeable membrane. The lid body is integrally formed. The through hole penetrates the lid body. The hydrophobic gas-permeable membrane is bonded to the lid body and shields the through hole. A part of the hydrophobic gas-permeable membrane is embedded in the lid body.

Abstract: A gas-permeable package lid of a chip package structure and a manufacturing method thereof are provided. The gas-permeable package lid of the chip package structure includes a lid body, an air hole, and a hydrophobic gas-permeable membrane. The lid body is integrally formed with an encapsulation material and has a body portion and a plurality of anchors. The air hole penetrates the body portion of the lid body. The hydrophobic gas-permeable membrane is bonded to the lid body and has a shielding part shielding the air hole and an embedded part embedded in the lid body. The embedded part has an upper surface and a lower surface. The upper surface and the lower surface respectively have a plurality of recesses. The anchors are respectively located in the recesses.

Abstract: A sensing device is provided. A suction port of a chamber is sealed by using a gas sealing layer with a gas sealing filter. The gas sealing filter has a plurality of one-way passes. The one-way passes have a width in a range of several nanometers to several hundred nanometers. A gas molecular exhausts to the outside of the chamber through the one-way passes. Owing to preventing the material of gas sealing layer from flowing into the chamber by the gas sealing filter, superior sealing performance is achieved as compared to those adopting solder or sealing material, thereby facilitating control of the condition in the chamber.

Abstract: A fiber waveguide optical subassembly uses the multi-mode fiber to increase the alignment tolerance between the active optical element and the waveguide. The filter is thinner to lower the dispersion due to the optical coupling gap. The subassembly further combines the optical bench to achieve passive positioning. Therefore it reduces the cost and enhances the transmission rate.

Abstract: A semiconductor device (1) has a source (2) a gate (3) and a drain (4), a single deep-pocket ion implant (8) in a source-drain depletion region, and a single shallow-pocket ion implant (9) in the source-drain depletion region.

Abstract: A fiber waveguide optical subassembly uses the multi-mode fiber to increase the alignment tolerance between the active optical element and the waveguide. The filter is thinner to lower the dispersion due to the optical coupling gap. The subassembly further combines the optical bench to achieve passive positioning. Therefore it reduces the cost and enhances the transmission rate.

Abstract: A semiconductor device (1) has a source (2) a gate (3) and a drain (4), a single deep-pocket ion implant (8) in a source-drain depletion region, and a single shallow-pocket ion implant (9) in the source-drain depletion region.

Abstract: A semiconductor device (1) has a source (2) a gate (3) and a drain (4), a single deep-pocket ion implant (8) in a source-drain depletion region, and a single shallow-pocket ion implant (9) in the source-drain depletion region.

Abstract: A semiconductor device (1) has a source (2) a gate (3) and a drain (4), a single deep-pocket ion implant (8) in a source-drain depletion region, and a single shallow-pocket ion implant (9) in the source-drain depletion region.