Patents by Inventor Chin-Song LEE

Chin-Song LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD OF ATTACHING FILM
    Publication number: 20240140785
    Abstract: A method of attaching a film is provided. The method includes providing a carrier tape. The carrier tape supports a film over a surface of the carrier tape. The method further includes moving the film to a position over an electronic device. The method further includes attaching the film to the electronic device.
    Type: Application
    Filed: October 26, 2022
    Publication date: May 2, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Chin-Song LEE
  • SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
    Publication number: 20210130163
    Abstract: A semiconductor device package includes a redistribution layer structure, a semiconductor component, an encapsulant and a sensing component. The semiconductor component is disposed on a top surface of the RDL structure. The encapsulant covers the semiconductor component, the RDL structure, and an electrical connection member. The sensing component is disposed on a top surface of the encapsulant. The electrical connection member is in contact with a pad of the semiconductor component and has a first surface exposed from the top surface of the encapsulant, and the semiconductor component package includes a wire connecting the sensing component and the first surface of the electrical connection member.
    Type: Application
    Filed: October 31, 2019
    Publication date: May 6, 2021
    Inventors: Yueh-Ju LIN, Chih-Cheng HUNG, Chin-Song LEE, Yun-Chih FEI