Patents by Inventor Chin-Sung Lin

Chin-Sung Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11955338
    Abstract: A method includes providing a substrate having a surface such that a first hard mask layer is formed over the surface and a second hard mask layer is formed over the first hard mask layer, forming a first pattern in the second hard mask layer, where the first pattern includes a first mandrel oriented lengthwise in a first direction and a second mandrel oriented lengthwise in a second direction different from the first direction, and where the first mandrel has a top surface, a first sidewall, and a second sidewall opposite to the first sidewall, and depositing a material towards the first mandrel and the second mandrel such that a layer of the material is formed on the top surface and the first sidewall but not the second sidewall of the first mandrel.
    Type: Grant
    Filed: January 30, 2023
    Date of Patent: April 9, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shih-Chun Huang, Ya-Wen Yeh, Chien-Wen Lai, Wei-Liang Lin, Ya Hui Chang, Yung-Sung Yen, Ru-Gun Liu, Chin-Hsiang Lin, Yu-Tien Shen
  • Patent number: 11482475
    Abstract: An electronic package device and a carrier structure thereof are provided. The carrier structure includes a die attach paddle, a ground frame, a pin assembly, and a ground wing portion. The ground frame surrounds the die attach paddle. The pin assembly includes a plurality of pins that are spaced apart from one another. The pins extend radially outward and are arranged to surround the ground frame. The ground wing portion is connected to the ground frame and located in a space under the pin assembly. The ground wing portion includes an extending part and a joint part, the extending part extends away from the die attach paddle, and a top end of the extending part is located at a position above where a bottom surface of the die attach paddle is located.
    Type: Grant
    Filed: May 4, 2021
    Date of Patent: October 25, 2022
    Assignee: ALi Corporation
    Inventor: Chin-Sung Lin
  • Publication number: 20220037239
    Abstract: An electronic package device and a carrier structure thereof are provided. The carrier structure includes a die attach paddle, a ground frame, a pin assembly, and a ground wing portion. The ground frame surrounds the die attach paddle. The pin assembly includes a plurality of pins that are spaced apart from one another. The pins extend radially outward and are arranged to surround the ground frame. The ground wing portion is connected to the ground frame and located in a space under the pin assembly. The ground wing portion includes an extending part and a joint part, the extending part extends away from the die attach paddle, and a top end of the extending part is located at a position above where a bottom surface of the die attach paddle is located.
    Type: Application
    Filed: May 4, 2021
    Publication date: February 3, 2022
    Inventor: CHIN-SUNG LIN
  • Patent number: 9449909
    Abstract: In accordance with an embodiment, a method comprises providing a substrate having a conductive material thereon, forming a ground plane, a first trace rail, and a first perpendicular trace from the conductive material, and forming an insulator material over the ground plane, the first trace rail, and the first perpendicular trace. The ground plane is between the first trace rail and an area of the substrate over which will be a die. The first trace rail extends along a first outer edge of the ground plane, and the first perpendicular trace is coupled to the first trace rail and extends perpendicularly from the first trace rail.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: September 20, 2016
    Assignees: Taiwan Semiconductor Manufacturing Company, Ltd., Global Unichip Corp.
    Inventors: Chin-Sung Lin, Li-Hua Lin, Yu-Yu Lin
  • Publication number: 20140251094
    Abstract: An air suction screw tightening apparatus to suck and fasten a screw comprises a power driver, a screwdriver fastened to the power driver, a holding assembly connected to the power driver and an air suction member. The screwdriver includes a screw tightening portion which has a contact end in contact with the screw for holding thereof. The holding assembly includes a housing case and a damping portion corresponding to the contact end. The damping portion and screw tightening portion form at least one gap between them to suck the screw. Through providing the damping portion, shaking of the screwdriver during spinning can be reduced. Moreover, with cooperation of the gap and air suction member, the screw can be sucked and held.
    Type: Application
    Filed: March 11, 2013
    Publication date: September 11, 2014
    Applicant: TERA AUTOTECH CORPORATION
    Inventors: Peng-Lai CHEN, YI-LUNG LEE, Chin-Sung LIN
  • Publication number: 20130015234
    Abstract: In accordance with an embodiment, a method comprises providing a substrate having a conductive material thereon, forming a ground plane, a first trace rail, and a first perpendicular trace from the conductive material, and forming an insulator material over the ground plane, the first trace rail, and the first perpendicular trace. The ground plane is between the first trace rail and an area of the substrate over which will be a die. The first trace rail extends along a first outer edge of the ground plane, and the first perpendicular trace is coupled to the first trace rail and extends perpendicularly from the first trace rail.
    Type: Application
    Filed: September 14, 2012
    Publication date: January 17, 2013
    Applicants: GLOBAL UNICHIP CORP., TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chin-Sung Lin, Li-Hua Lin, Yu-Yu Lin
  • Patent number: 8289727
    Abstract: In accordance with an embodiment, a substrate layout comprises a ground plane of a first power loop on a layer of a substrate, a first trace rail on the layer extending along a first periphery of the ground plane, and a first perpendicular trace coupled to the first trace rail. The ground plane is between the first trace rail and a die area, and the first perpendicular trace extends perpendicularly from the first trace rail. The first trace rail and the first perpendicular trace are components of a second power loop.
    Type: Grant
    Filed: June 11, 2010
    Date of Patent: October 16, 2012
    Assignees: Taiwan Semiconductor Manufacturing Company, Ltd., Global Unichip Corp.
    Inventors: Chin-Sung Lin, Li-Hua Lin, Yu-Yu Lin
  • Publication number: 20110304998
    Abstract: In accordance with an embodiment, a substrate layout comprises a ground plane of a first power loop on a layer of a substrate, a first trace rail on the layer extending along a first periphery of the ground plane, and a first perpendicular trace coupled to the first trace rail. The ground plane is between the first trace rail and a die area, and the first perpendicular trace extends perpendicularly from the first trace rail. The first trace rail and the first perpendicular trace are components of a second power loop.
    Type: Application
    Filed: June 11, 2010
    Publication date: December 15, 2011
    Applicants: Global Unichip Corp., Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chin-Sung Lin, Li-Hua Lin, Yu-Yu Lin
  • Publication number: 20090026483
    Abstract: A high-power LED package includes a thermally conductive substrate, a plurality of electric contact pins, and at least one high-power LED. The thermally conductive substrate has a circuit board, a metal plate, and a connecting member connected between the circuit board and the metal plate. The substrate is provided with a plurality of through holes running through the circuit board and the metal plate. The electric contact pins are received in the respective through holes and partially extending out of the through holes. The high-power LED is mounted on the metal plate and electrically connected to the circuit board by means of a plurality of metal wires. Therefore, the metal plate having preferable thermal conductivity can effectively dissipate the heat generated by the high-power LED.
    Type: Application
    Filed: September 26, 2007
    Publication date: January 29, 2009
    Applicant: Tera Autotech Corporation
    Inventor: Chin-Sung LIN
  • Patent number: 7410273
    Abstract: An LED lamp assembly includes a reflection cup, a lamp holder and an LED lamp. The reflection cup has a bottom wall with two through holes for insertion of electric wires and at least one locating hole, and a periphery wall defined with the bottom wall a recessed chamber. The lamp holder is mounted on the bottom wall of the reflection cup and located inside the recessed chamber. The lamp holder has a top wall, a peripheral wall extending from the top wall, and at least one mounting leg extending from the periphery wall of the lamp holder and coupled to the at least one locating hole of the reflection cup. The LED lamp is disposed between the top and periphery walls of the lamp holder and provided with two exposed conducting terminals corresponding to the two through holes of the reflection cup for connection with the electric wires.
    Type: Grant
    Filed: January 16, 2007
    Date of Patent: August 12, 2008
    Assignee: Tera Autotech Corporation
    Inventor: Chin-Sung Lin
  • Publication number: 20080037258
    Abstract: An LED lamp assembly includes a reflection cup, a lamp holder and an LED lamp. The reflection cup has a bottom wall with two through holes for insertion of electric wires and at least one locating hole, and a periphery wall defined with the bottom wall a recessed chamber. The lamp holder is mounted on the bottom wall of the reflection cup and located inside the recessed chamber. The lamp holder has a top wall, a peripheral wall extending from the top wall, and at least one mounting leg extending from the periphery wall of the lamp holder and coupled to the at least one locating hole of the reflection cup. The LED lamp is disposed between the top and periphery walls of the lamp holder and provided with two exposed conducting terminals corresponding to the two through holes of the reflection cup for connection with the electric wires.
    Type: Application
    Filed: January 16, 2007
    Publication date: February 14, 2008
    Applicant: Tera Autotech Corporation
    Inventor: Chin-Sung Lin
  • Publication number: 20070292313
    Abstract: A liquid dispensing mechanism for synchronously dispensing a common liquid and a specific liquid used in a biochemical analyzer includes a coupler having a first coupling hole, a liquid outlet, a connecting tunnel connected between the first coupling hole and the liquid outlet, a second coupling hole, and a common liquid passage connected between the second coupling hole and the connecting tunnel, a specific liquid dispensing syringe insertable into the first coupling hole of the coupler for out dispensing the contained specific liquid through the liquid outlet, and a common liquid dispensing syringe having a liquid inlet connected with a common liquid source. The common liquid dispensing syringe is insertable into the second coupling hole of the coupler for dispensing the common liquid into the common liquid passage and out of the coupler through the liquid outlet of the coupler together with the specific liquid.
    Type: Application
    Filed: January 30, 2007
    Publication date: December 20, 2007
    Applicant: Antera Biotech Corp
    Inventors: Yi-Lung Lee, Chin-Sung Lin, Zhen-Hua Chou
  • Publication number: 20070290004
    Abstract: A liquid dispenser includes a dispenser body having a liquid input passage extending inwardly from the top side of the dispenser body, a liquid distribution passage formed inside the dispenser body in communication with the liquid input passage, two liquid output passages each having a first side respectively connected to the liquid distribution passage and a second side provided with a plurality of outlets, and an air output passage in communication with the liquid output passages. A plurality of needle cannulas are respectively fastened to a bottom side of the dispenser body and respectively connected to the outlets of the liquid output passages. When liquid is filled inside the dispenser body, the air initially contained inside the dispenser body will be forced by the liquid to be discharged out of the dispenser body through the air output passage.
    Type: Application
    Filed: January 17, 2007
    Publication date: December 20, 2007
    Applicant: Antera Biotech Corp.
    Inventors: Yi-Lung Lee, Chin-Sung Lin, Zhen-Hua Chou
  • Publication number: 20070291584
    Abstract: A shaking mixer includes a first transmission rod set, a first driving motor for rotating the first transmission rod set; two first synchronous transmission members respectively spacedly coupled to the first transmission rod set for synchronous movement upon rotation of the first transmission rod set, a second transmission rod set, a second driving motor for rotating the second transmission rod set, two second synchronous transmission members respectively spacedly coupled to the second transmission rod set for synchronous movement upon rotation of the second transmission rod set, and a moveable platform having two rods arranged in a crossed manner and respectively connected to the first synchronous transmission members and the second synchronous transmission members for oscillation on a plane freely.
    Type: Application
    Filed: January 31, 2007
    Publication date: December 20, 2007
    Applicant: Antera Biotech Corp.
    Inventors: Yi-Lung Lee, Chin-Sung Lin, Zhen-Hua Chou
  • Publication number: 20070292317
    Abstract: A reagent reaction container includes a container body having a plurality of receiving bores through top and bottom sides thereof, a plurality of filter holders mounted in the receiving bores respectively and each having a through hole through top and bottom sides thereof and an engagement portion engaged with a periphery wall of the respective receiving bore, a plurality of drain elements mounted in the through holes of the filter holders respectively, and a plurality of filters respectively mounted in the through holes of the filter holders and supported on the respective drain element. The drain element has a crevice that is closed when the drain element receives no pressure and is opened when the drain element receives a predetermined external force.
    Type: Application
    Filed: January 31, 2007
    Publication date: December 20, 2007
    Applicant: Antera Biotech Corp.
    Inventors: Yi-Lung Lee, Chin-Sung Lin, Shun-Wu Hong, Zhen-Hua Chou
  • Publication number: 20070194434
    Abstract: A wiring board including a plurality of patterned conductive layers and a plurality of insulating layers is provided. The patterned conductive layers include a first patterned conductive layer and at least one second patterned conductive layer. The first patterned conductive layer has at least one pair of differential signal lines and the second patterned conductive layer has at least one non-wiring area. A projection of the pair of differential signal lines on the second patterned conductive layer at least partially overlaps the non-wiring area. In addition, the insulating layers are disposed between the adjacent patterned conductive layers respectively.
    Type: Application
    Filed: May 30, 2006
    Publication date: August 23, 2007
    Inventors: Chin-Sung Lin, Hsing-Chou Hsu
  • Publication number: 20070184612
    Abstract: A method for assembling a liquid crystal display includes providing a thin-film-transistor substrate and a color-filter substrate having an active area and a non-active area, wherein plural spacers are formed in the in the active area of the color-filter substrate. At least two spacing-pads are individually formed in the surrounding non-active area at different locations adjacent to the edge of the active area, and the top of the spacing-pad is as high as the spacer in the active area. The color-filter substrate and the thin-film-transistor substrate are sealed.
    Type: Application
    Filed: February 5, 2007
    Publication date: August 9, 2007
    Applicant: Quanta Display Inc.
    Inventors: Chia-Hao Chan, Ju-Yu Lee, Chin-Sung Lin, Chwan-Jye Lin
  • Publication number: 20070041166
    Abstract: An LED lamp includes a base having a receiving groove, a circuit board which is inserted through the receiving groove into the inside of the base and has two through holes, and an LED package having an LED, a shell surrounding the LED and mounted on the base, and two conductive leads electrically connected to the LED, inserted into the base and coupled respectively into the through holes of the circuit board.
    Type: Application
    Filed: December 19, 2005
    Publication date: February 22, 2007
    Applicant: TERA AUTOTECH CORPORATION
    Inventor: Chin-Sung Lin
  • Publication number: 20060215411
    Abstract: An LED lamp assembly includes a lamp holder, which has a hollow light-transmittable shade that defines an inside chamber and a bottom opening at the bottom side of the inside chamber and a hollow base connected to the bottom side of the shade, and a light-emitting board, which has a resistor, LEDs and two contact members installed in a circuit board thereof and electrically connected to the circuit pattern of the circuit board and mounted with the circuit board inside the hollow base with the LEDs aimed at the inside chamber of the shade of the lamp holder.
    Type: Application
    Filed: March 22, 2005
    Publication date: September 28, 2006
    Applicant: TERA AUTOTECH CORPORATION
    Inventor: Chin-Sung Lin
  • Patent number: 6298387
    Abstract: Packets in a bitstream are delineated by a) employing a first in, first out buffer (FIFO) with a storage capacity equal to the number of bits in a packet plus the number of bits in the synchronization pattern arranged so that comparison of its head end and tail end with the data pattern of the synchronization data pattern may be made, and b) declaring that a packet is detected when both the head end and the tail end of the FIFO each, substantially simultaneously, contains information equal to the synchronization pattern. Advantageously, the invention may be employed whether or not the bitstream is byte-aligned.
    Type: Grant
    Filed: July 12, 1996
    Date of Patent: October 2, 2001
    Assignee: Philips Electronics North America Corp
    Inventors: Sanand Prasad, Samuel Olu Akiwumi-Assani, Chin-Sung Lin