Patents by Inventor Chin-Tai Lin

Chin-Tai Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11961738
    Abstract: In a method of forming a pattern, a first pattern is formed over an underlying layer, the first pattern including main patterns and a lateral protrusion having a thickness of less than 25% of a thickness of the main patterns, a hard mask layer is formed over the first pattern, a planarization operation is performed to expose the first pattern without exposing the lateral protrusion, a hard mask pattern is formed by removing the first pattern while the lateral protrusion being covered by the hard mask layer, and the underlying layer is patterned using the hard mask pattern as an etching mask.
    Type: Grant
    Filed: February 12, 2021
    Date of Patent: April 16, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chin-Ta Chen, Hua-Tai Lin, Han-Wei Wu, Jiann-Yuan Huang
  • Publication number: 20240105518
    Abstract: A first group of semiconductor fins are over a first region of a substrate, the substrate includes a first stepped profile between two of the first group of semiconductor fins, and the first stepped profile comprises a first lower step, two first upper steps, and two first step rises extending from opposite sides of the first lower step to the first upper steps. A second group of semiconductor fins are over a second region of the substrate, the substrate includes a second stepped profile between two of the second group of semiconductor fins, and the second stepped profile comprises a second lower step, two second upper steps, and two second step rises extending from opposite sides of the second lower step to the second upper steps, in which the second upper steps are wider than the first upper steps in the cross-sectional view.
    Type: Application
    Filed: January 11, 2023
    Publication date: March 28, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chin-Ta CHEN, Han-Wei WU, Yuan-Hsiang LUNG, Hua-Tai LIN
  • Patent number: 11927312
    Abstract: The disclosure provides an electronic device, including a circuit board, multiple semiconductor components, a first light reflecting structure, and a second light reflecting structure. The circuit board includes a substrate, and the substrate may have a first surface and at least one side surface. The multiple semiconductor components are disposed on the first surface. The first light reflecting structure is disposed on the first surface. The second light reflecting structure is disposed on the first surface and the at least one side surface.
    Type: Grant
    Filed: April 18, 2022
    Date of Patent: March 12, 2024
    Assignee: Innolux Corporation
    Inventors: Chin-Chia Huang, Chieh-Ying Chen, Jia-Huei Lin, Chin-Tai Hsu, Tzu-Chien Huang, Fu-Sheng Tsai
  • Publication number: 20060147276
    Abstract: A geocell for retaining infill in geotechnical structure, e.g. a protection construction on an unstable slope in mountainous areas, construction foundation, and green-making with plants, consists of several plastic plates; every two adjacent plastic plates are connected together at several spaced apart elongated joints by means of ultrasonic welding, each of which elongate joints includes several aligned points; thus, the geocell can be expanded into a honeycomb shape, and cells are formed therein for containing backfill therein; the plastic plates are formed with rough finishes so as to increase the backfill retaining capability of the present geocell.
    Type: Application
    Filed: February 14, 2006
    Publication date: July 6, 2006
    Inventors: Chin-Tai Lin, Ferdie Chen
  • Publication number: 20060147275
    Abstract: A geocell for retaining infill in geotechnical structure, e.g. a protection construction on an unstable slope in mountainous areas, construction foundation, and green-making with plants, consists of several plastic plates; every two adjacent plastic plates are connected together at several spaced apart elongated joints by means of ultrasonic welding, each of which elongate joints includes several aligned points; thus, the geocell can be expanded into a honeycomb shape, and cells are formed therein for containing backfill therein; the plastic plates are formed with rough finishes so as to increase the backfill retaining capability of the present geocell.
    Type: Application
    Filed: December 30, 2004
    Publication date: July 6, 2006
    Inventors: Chin-Tai Lin, Ferdie Chen
  • Publication number: 20020153088
    Abstract: A method for manufacturing rough-surfaced plastic sheet is based on technique, using cooperative extrusion by means of two or more extrusion machines. A main extrusion machine is for forming a main body of a plastic sheet. One or two auxiliary extrusion machine are for forming one or two rough-surface layers with plastic material, pigment and processing agent, which are melted and mixed together inside to let the foaming agent in the barrel generate bubbles and explode at the same time to form the plastic into one or two rough-surfaced layers. Then, after the main body and the rough-surfaced together pass through a mold head, the rough-surfaced layer adheres to one or two outer surfaces of the main body, cooled at once to form a plastic board with one or two rough surfaces, thus heightening producing efficiency, lowering investment coat and elevating competitive force.
    Type: Application
    Filed: April 24, 2001
    Publication date: October 24, 2002
    Inventors: Rong-Tong Chen, Chin-Tai Lin