Patents by Inventor Chin-Tsan CHEN

Chin-Tsan CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Nerve damage preventing and nerve protecting compounds, preparation method thereof, pharmaceutical composition thereof, and their use
    Patent number: 11987566
    Abstract: The present invention provides a novel compound for effectively preventing nerve damage and protecting nerves, and a preparation method thereof. Besides, the present invention also provides a pharmaceutical composition comprising the novel compound, and a use of the novel compound for preventing nerve damage and protecting nerves.
    Type: Grant
    Filed: January 28, 2022
    Date of Patent: May 21, 2024
    Assignee: GENHEALTH PHARMA CO., LTD.
    Inventors: Lain-Tze Lee, Hui-Ping Tsai, Yi-Wen Lin, Shu-Fen Huang, Shih-Hung Liu, Chin-Wei Liu, Pi-Tsan Huang, Mei-Hui Chen
  • Wafer processing tool capable of detecting wafer warpage and method for detecting wafer warpage
    Patent number: 10804124
    Abstract: A wafer processing tool is capable of detecting wafer warpage. The wafer processing tool includes a wafer holder on which a wafer is held and at least one sensor set. The at least one sensor set is disposed above the wafer or under the wafer, and a projection of each of the at least one sensor set on the wafer radially extending from a center of the wafer to an edge of the wafer. The at least one sensor set is configured to scan an entire surface of the wafer so as to measure warpage of the wafer while the wafer holder and the at least one sensor set are rotatable relative to each other.
    Type: Grant
    Filed: December 12, 2018
    Date of Patent: October 13, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chao-Hsiung Yeh, Hsuan Chang, Jen-Ti Wang, Chin-Tsan Chen, Kuo-Fong Chuang
  • WAFER PROCESSING TOOL CAPABLE OF DETECTING WAFER WARPAGE AND METHOD FOR DETECTING WAFER WARPAGE
    Publication number: 20200105557
    Abstract: A wafer processing tool is capable of detecting wafer warpage. The wafer processing tool includes a wafer holder on which a wafer is held and at least one sensor set. The at least one sensor set is disposed above the wafer or under the wafer, and a projection of each of the at least one sensor set on the wafer radially extending from a center of the wafer to an edge of the wafer. The at least one sensor set is configured to scan an entire surface of the wafer so as to measure warpage of the wafer while the wafer holder and the at least one sensor set are rotatable relative to each other.
    Type: Application
    Filed: December 12, 2018
    Publication date: April 2, 2020
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chao-Hsiung YEH, Hsuan CHANG, Jen-Ti WANG, Chin-Tsan CHEN, Kuo-Fong CHUANG