Abstract: A semiconductor device includes a substrate, a high-Q capacitor, an ultra high density capacitor, and an interconnection. At least one trench is formed in the substrate. The high-Q capacitor is disposed on a surface of the substrate, and includes a bottom electrode, an upper electrode located on the bottom electrode, and a first dielectric layer located between the upper and bottom electrodes. The ultra high density capacitor is disposed on the trench of the substrate, and includes a first electrode conformally deposited in the trench, a second electrode located on the first electrode, and a second dielectric layer located between the first and second electrodes. The interconnection connects one of the upper electrode and the bottom electrode to one of the first electrode and the second electrode, and connects the other of the upper electrode and the bottom electrode to the other of the first electrode and the second electrode.

Abstract: A circuit board, structural units and a manufacturing method are provided, wherein one or more high temperature lamination processes are conducted for laminating the structural units and form a multi-layered circuit board.

Abstract: A body gesture control system for operating electrical and electronic devices includes an image sensor device and an image processor device to process body gesture images captured by the image sensor device for recognizing the body gesture. The image processor device includes an image calculation unit and a gesture change detection unit electrically connected therewith. The image calculation unit is used to calculate gesture regions of the captured body gesture images and the gesture change detection unit is operated to detect changes of the captured body gesture images and to thereby determine a body gesture recognition signal.

Abstract: A body gesture control system for operating electrical and electronic devices includes an image sensor device and an image processor device to process body gesture images captured by the image sensor device for recognizing the body gesture. The image processor device includes an image calculation unit and a gesture change detection unit electrically connected therewith. The image calculation unit is used to calculate gesture regions of the captured body gesture images and the gesture change detection unit is operated to detect changes of the captured body gesture images and to thereby determine a body gesture recognition signal.

Abstract: A printed circuit board and manufacturing method thereof is disclosed. First, a conductive layer disposed on an insulation layer is provided. The conductive layer is patterned to form at least a conductive layer opening and the insulation layer is drilled throughout to form a via at a position corresponding to the conductive layer opening. The via is then loaded with a conductive material. A plurality of substrates are formed through the steps above and are bonded to form a multi-layer printed circuit board.

Abstract: An alignment structure of individual printed circuit board and method thereof are disclosed. The alignment structure of individual printed circuit board includes a panel body and an assembling part. An aligned part having a geometric feature is disposed on an inner side of the panel body. The assembling part coupled with an individual printed circuit board is similar to the geometric feature of the aligned part so that the individual printed circuit board is combined with the panel body.

Abstract: An electronic device comprises a housing, a touch pad disposed on a first surface of the housing, the touch pad being capable of outputting a signal when touched, a processor disposed on a second surface, the processor being capable of processing the signal, wherein the second surface and the first surface are non-coplanar. The electronic device further comprises a flexible printed circuit formed integrally with the touch pad and the processor and the flexible printed circuit is capable of electrically connecting the touch pad on the first surface to the processor on the second surface.

Abstract: A printed circuit board and manufacturing method thereof is disclosed. First, a conductive layer disposed on an insulation layer is provided. The conductive layer is patterned to form at least a conductive layer opening and the insulation layer is drilled throughout to form a via at a position corresponding to the conductive layer opening. The via is then loaded with a conductive material. A plurality of substrates are formed through the steps above and are bonded to form a multi-layer printed circuit board.

Abstract: A via structure of a printed circuit board includes an insulation layer having a first surface and a second surface, a through-hole and a plurality of internal conducting coatings. The through-hole is throughout the first surface and the second surface of the insulation layer and the internal conductive coatings connected to a wall of the through-hole are mutually electrically insulated so that different signals can be transmitted between both sides of the substrate through a single via.

Abstract: An alignment structure of individual printed circuit board and method thereof are disclosed. The alignment structure of individual printed circuit board includes a panel body and an assembling part. An aligned part having a geometric feature is disposed on an inner side of the panel body. The assembling part coupled with an individual printed circuit board is similar to the geometric feature of the aligned part so that the individual printed circuit board is combined with the panel body.

Abstract: A printed circuit board assembly is disclosed. The printed circuit board assembly includes a first circuit board, a second circuit and a third circuit board. The first circuit board includes a first surface and a second surface opposite each other. The second circuit board is disposed on the first surface of the first circuit board and electrically connected thereto. The third circuit board is disposed on the second surface of the first circuit board and electrically connected thereto. The second and the third boards are both smaller than the first board. Electronic components with large thickness are mounted on the exposed first and second surfaces of the first circuit board. Electronic components with smaller thickness are mounted on the second or third circuit board.