Patents by Inventor Chin Wei Ronnie Tan

Chin Wei Ronnie Tan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing an electronic device with a package locking system
    Patent number: 8304295
    Abstract: Device and method for an electronic device package is disclosed. The electronic device package includes a first pad, a second pad and an encapsulation surrounding the first and second pad, wherein the encapsulation includes a first opening underneath the first pad and a second opening underneath the second pad. A first bump is arranged in the first opening and a second bump is arranged in the second opening, wherein the encapsulation mechanically locks the first bump to the first pad and the second bump to the second pad.
    Type: Grant
    Filed: June 22, 2010
    Date of Patent: November 6, 2012
    Assignee: Infineon Technologies AG
    Inventors: Soon Lock Goh, Swee Kah Lee, Chin Wei Ronnie Tan
  • Semiconductor Device and Method of Making a Semiconductor Device
    Publication number: 20120273935
    Abstract: A semiconductor device and a method of manufacturing a semiconductor device are disclosed. An embodiment comprises forming a bump on a die, the bump having a solder top, melting the solder top by pressing the solder top directly on a contact pad of a support substrate, and forming a contact between the die and the support substrate.
    Type: Application
    Filed: April 29, 2011
    Publication date: November 1, 2012
    Inventors: Stefan Martens, Tze Yang Hin, Kian Pin Queck, Kathleen Ong, Chin Wei Ronnie Tan, Beng Keh See, Ulrich Krumbein, Horst Theuss
  • Electronic Device Package Locking System and Method
    Publication number: 20110309493
    Abstract: Device and method for an electronic device package is disclosed. The electronic device package includes a first pad, a second pad and an encapsulation surrounding the first and second pad, wherein the encapsulation includes a first opening underneath the first pad and a second opening underneath the second pad. A first bump is arranged in the first opening and a second bump is arranged in the second opening, wherein the encapsulation mechanically locks the first bump to the first pad and the second bump to the second pad.
    Type: Application
    Filed: June 22, 2010
    Publication date: December 22, 2011
    Inventors: Soon Lock Goh, Swee Kah Lee, Chin Wei Ronnie Tan