Patents by Inventor Chin-Wei Sher

Chin-Wei Sher has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PACKAGE STRUCTURE OF A LIGHT-EMITTING DEVICE
    Publication number: 20170040262
    Abstract: A light-emitting device packaging structure is provided. The light-emitting device packaging structure includes a substrate, an array of light-emitting devices, an encapsulating layer, scattering particles, and a fluorescent material layer. The array of light-emitting devices is on the substrate. The encapsulating layer covers the array of light-emitting devices. The scattering particles are dispersed in the encapsulating layer. The fluorescent material layer is on the encapsulating layer.
    Type: Application
    Filed: January 19, 2016
    Publication date: February 9, 2017
    Inventors: Chien-Chung Lin, Hao-Chung Kuo, Chin-Wei Sher, Hau-Vei Han, Kuo-Ju Chen, Zong-Yi Tu, Hsien-Hao Tu