Patents by Inventor Chin Wei Wu
Chin Wei Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12159083Abstract: A multimedia system is provided. The multimedia system includes a plurality of transmission devices and a receiving-end device. Multiple transmission devices respectively has a microphone. The receiving-end device is coupled to the transmission devices. When the microphone of one of the transmission devices is enabled, the receiving-end device outputs at least one control signal to at least another one of the transmission devices to disable the microphone of the at least another one of the transmission devices.Type: GrantFiled: February 17, 2023Date of Patent: December 3, 2024Assignee: BenQ CorporationInventors: Chen-Chi Wu, Chia-Nan Shih, Chin-Fu Chiang, Jung-Kun Tseng, Chuang-Wei Wu, Chian Yu Yeh
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Patent number: 12154608Abstract: A semiconductor device and a method of forming the same are provided. The method includes forming a bottom electrode layer over a substrate. A magnetic tunnel junction (MTJ) layers are formed over the bottom electrode layer. A top electrode layer is formed over the MTJ layers. The top electrode layer is patterned. After patterning the top electrode layer, one or more process cycles are performed on the MTJ layers and the bottom electrode layer. A patterned top electrode layer, patterned MTJ layers and a patterned bottom electrode layer form MTJ structures. Each of the one or more process cycles includes performing an etching process on the MTJ layers and the bottom electrode layer for a first duration and performing a magnetic treatment on the MTJ layers and the bottom electrode layer for a second duration.Type: GrantFiled: August 8, 2023Date of Patent: November 26, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Bo-Jhih Shen, Kuang-I Liu, Joung-Wei Liou, Jinn-Kwei Liang, Yi-Wei Chiu, Chin-Hsing Lin, Li-Te Hsu, Han-Ting Tsai, Cheng-Yi Wu, Shih-Ho Lin
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Publication number: 20240384405Abstract: A system and method for reducing thermal transfer in a dual ampoule system. The dual ampoule system includes a first ampoule, a second ampoule, and a planar heat shield. The planar heat shield is positioned between the first ampoule and the second ampoule, where the planar heat shield is configured to resist thermal transfer between the first ampoule and the second ampoule.Type: ApplicationFiled: July 29, 2024Publication date: November 21, 2024Inventors: Chi-Wen CHIU, Chih-Chang WU, Che-Wei TUNG, Chiang Hsien SHIH, Chin-Szu LEE
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Publication number: 20240342229Abstract: The present disclosure relates to an anti-fatigue Lactobacillus composition. The anti-fatigue Lactobacillus composition, which includes at least one of Lactobacillus brevis GKEX, Lactobacillus plantarum GKK1 and Lactobacillus johnsonii GKJ2 as an active ingredient, administered to a healthy subject for a continuous period of time, can significantly improve fatigue-related biochemical indices and prolong aerobic exercise time to exhaustion, and thus can be used as an active ingredient for preparation of various compositions for anti-fatigue and/or improving athletic ability.Type: ApplicationFiled: June 27, 2024Publication date: October 17, 2024Inventors: Chin-Chu CHEN, Yen-Lien CHEN, Shih-Wei LIN, You-Shan TSAI, Tzu-Chun LIN, Ci-Sian WANG, Yu-Hsin HOU, Yang-Tzu SHIH, Ching-Wen LIN, Ya-Jyun CHEN, Jia-Lin JIANG, Zi-He WU, Yen-Po CHEN
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Publication number: 20240319408Abstract: An anti-scattering and anti-interference coating pattern structure of an optical film, wherein an optical film is formed on a substrate, the characterize is: the periphery of the optical film is a non-straight zigzag lines or multi-curved inner edge lines, such that can be used to reduce stray light affecting the sensing area when it is used in light-sensing components.Type: ApplicationFiled: March 22, 2023Publication date: September 26, 2024Inventors: Chin-Chen KUO, Sheng-Wei WANG, Tsung-Hsiu WU, Yun-Hui TAI
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Publication number: 20240304741Abstract: A cell module is provided. The cell module includes a first substrate; a second substrate disposed opposite to the first substrate; a cell unit disposed between the first substrate and the second substrate; a first thermosetting resin layer disposed between the cell unit and the first substrate; a first protective layer disposed between the cell unit and the first thermosetting resin layer; and a second thermosetting resin layer disposed between the cell unit and the second substrate. The first protective layer includes a first polymer, wherein the cross-linking degree of the first polymer is 0 to 42.3%.Type: ApplicationFiled: November 30, 2023Publication date: September 12, 2024Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chiou-Chu LAI, Chun-Wei SU, Yi-Chun LIU, Hsin-Hsin HSIEH, Hsin-Chung WU, En-Yu PAN, Chin-Ping HUANG
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Patent number: 12051388Abstract: A transmitter device adapted to be coupled to an image providing device and a receiver device includes first and second conversion units, a wireless module, and a processing unit. The first conversion unit and the second conversion unit are configured to be coupled to the image providing device through an HDMI transmission cable and a Type-C transmission cable, respectively, so as to respectively receive a first video and audio stream and a second video and audio stream provided by the image providing device. The wireless module is connected to the receiver device through wireless communication. The processing unit preferentially selects the first conversion unit to receive a first video and audio signal output by converting the first video and audio stream by the first conversion unit and transmits the first video and audio signal to the receiver device through the wireless module.Type: GrantFiled: February 14, 2023Date of Patent: July 30, 2024Assignee: BenQ CorporationInventors: Chen-Chi Wu, Chin-Fu Chiang, Chun-Han Lin, Chia-Nan Shih, Jung-Kun Tseng, Chuang-Wei Wu
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Patent number: 12050235Abstract: A heat dissipatable die unit includes an outer die, a metal heat dissipating layer and an inner die piled in order. The inner die includes a probe installation section, and a peripheral portion surrounding the probe installation section and having an inner connecting surface for being connected to a die and an outer connecting surface opposite thereto. The probe installation section has a recessed portion recessed from the inner connecting surface, and a protruding portion protruding from the outer connecting surface, thereby forming a level difference portion bordering the peripheral portion. The outer die includes an installation recess and a supporting portion surrounding the installation recess. The installation recess is recessed from an inner surface of the supporting portion and accommodates the protruding portion of the inner die. The metal heat dissipating layer is disposed between the peripheral portion and the supporting portion to attain heat dissipating effect.Type: GrantFiled: January 5, 2022Date of Patent: July 30, 2024Assignee: MPI CORPORATIONInventors: Chin-Yi Lin, Keng-Min Su, Che-Wei Lin, Ko-Chun Wu
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Publication number: 20240241155Abstract: A probe card includes a structure stiffener unit including a base with a lower surface where central and peripheral supporting elements protrude out and a main circuit board is fixed, a space transformer and a probe head disposed thereunder, which are disposed to the supporting elements by bolts and defined with central and peripheral regions located correspondingly to the central and peripheral supporting elements respectively, and a metal supporting member fixed on the space transformer in a direct contact manner and located correspondingly to the central region. The supporting member has a lower surface coplanar with the lower end surface of the peripheral supporting element, which is abutted on the space transformer, and an upper surface against which the central supporting element is abutted. The space transformer has great structural strength, flatness and heat dissipation effect for satisfying the large-area requirement and great electrical property testing stability.Type: ApplicationFiled: January 10, 2024Publication date: July 18, 2024Applicant: MPI CORPORATIONInventors: CHIN-YI LIN, CHE-WEI LIN, HSUEH-CHIH WU, TSUNG-YI CHEN, SHANG-JUNG HSIEH, SHENG-YU LIN, CHIEN-KAI HUNG, SHENG-WEI LIN, SHU-JUI CHANG
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Patent number: 12041096Abstract: An image sharing and conference participant identification method includes providing a first multimedia adapter device and a second multimedia adapter device, generating a link control signal after the first multimedia adapter device is triggered, transmitting the link control signal from the first multimedia adapter device to the second multimedia adapter device directly or through a server according to a link list, establishing a link between the first multimedia adapter device and the second multimedia adapter device, and transmitting first image data from the first multimedia adapter device to the second multimedia adapter device through the link for integrating the first image data and second image data by the second multimedia adapter device to generate sharing image data.Type: GrantFiled: January 25, 2022Date of Patent: July 16, 2024Assignee: BenQ CorporationInventors: Chen-Chi Wu, Chia-Nan Shih, Chin-Fu Chiang, Jung-Kun Tseng, Chuang-Wei Wu
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Patent number: 10324034Abstract: A self-referencing localized plasmon resonance sensing device and a system thereof are disclosed. The reference optical waveguide element is modified with a noble metal nanoparticle layer. The sensing optical waveguide element is modified with a noble metal nanoparticle layer, which is further modified with a recognition unit. The incident light is guided into the reference and the sensing optical waveguide elements to respectively generate localized plasmon resonance sensor signals. The reference and the sensing optical waveguide elements respectively have a calibration slope. The processor utilizes the calibration slopes to regulate the second difference generated by detecting with the sensing optical waveguide element. The processor utilizes a difference between the first difference, which is generated by detecting with the reference optical waveguide element, and the regulated second difference to obtain a sensor response.Type: GrantFiled: February 19, 2016Date of Patent: June 18, 2019Assignee: National Chung Cheng UniversityInventors: Lai-Kwan Chau, Chin-Wei Wu, Chang-Yue Chiang, Chien-Hsing Chen
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Publication number: 20190013204Abstract: A method of fabricating a buried word line includes forming a trench in a substrate. Next, a deposition process is performed to form a silicon layer on a sidewall and a bottom at the inner side of the trench. After the deposition process, a gate dielectric layer is formed in the trench. Finally, a conductive layer is formed to fill in the trench.Type: ApplicationFiled: July 26, 2017Publication date: January 10, 2019Inventors: Tien-Chen Chan, Ger-Pin Lin, Tsuo-Wen Lu, Chin-Wei Wu, Yu-Chun Wang, Shu-Yen Chan
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Patent number: 10056288Abstract: A semiconductor device includes a semiconductor substrate having a gate trench penetrating through an active area and a trench isolation region surrounding the active area. The gate trench exposes a sidewall of the active area and a sidewall of the trench isolation region. The sidewall of the trench isolation region includes a void. A first gate dielectric layer conformally covers the sidewall of the active area and the sidewall of the trench isolation region. The void in the sidewall of the trench isolation region is filled with the first gate dielectric layer. A second gate dielectric layer is grown on the sidewall of the active area. A gate is embedded in the gate trench.Type: GrantFiled: August 8, 2017Date of Patent: August 21, 2018Assignees: UNITED MICROELECTRONICS CORP., Fujian Jinhua Integrated Circuit Co., Ltd.Inventors: Tsuo-Wen Lu, Chin-Wei Wu, Tien-Chen Chan, Ger-Pin Lin, Shu-Yen Chan
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Patent number: 9394320Abstract: A method for fixing metal onto a surface of the substrate. The present method includes steps of: providing a substrate and a mercaptoalkylsilatrane compound; dissolving the mercaptoalkylsilatrane compound in a solvent; performing a condensation reaction of the substrate with and the dissolved mercaptoalkylsilatrane compound to complete the surface modification of the substrate; and performing a covalent bonding process to metal with the mercaptoalkylsilatrane compound already modified onto the surface of the substrate to fix the metal onto the surface of the substrate.Type: GrantFiled: March 17, 2014Date of Patent: July 19, 2016Assignee: National Chung Cheng UniversityInventors: Lai-Kwan Chau, Wen-Hao Chen, Yen-Ta Tseng, Chin-Wei Wu, Chao-Wen Chen
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Publication number: 20160169797Abstract: A self-referencing localized plasmon resonance sensing device and a system thereof are disclosed. The reference optical waveguide element is modified with a noble metal nanoparticle layer. The sensing optical waveguide element is modified with a noble metal nanoparticle layer, which is further modified with a recognition unit. The incident light is guided into the reference and the sensing optical waveguide elements to respectively generate localized plasmon resonance sensor signals. The reference and the sensing optical waveguide elements respectively have a calibration slope. The processor utilizes the calibration slopes to regulate the second difference generated by detecting with the sensing optical waveguide element. The processor utilizes a difference between the first difference, which is generated by detecting with the reference optical waveguide element, and the regulated second difference to obtain a sensor response.Type: ApplicationFiled: February 19, 2016Publication date: June 16, 2016Inventors: Lai-Kwan CHAU, Chin-Wei WU, Chang-Yue CHIANG, Chien-Hsing CHEN
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Publication number: 20140295075Abstract: A method for fixing metal onto a surface of the substrate. The present method includes steps of: providing a substrate and a mercaptoalkylsilatrane compound; dissolving the mercaptoalkylsilatrane compound in a solvent; performing a condensation reaction of the substrate with and the dissolved mercaptoalkylsilatrane compound to complete the surface modification of the substrate; and performing a covalent bonding process to metal with the mercaptoalkylsilatrane compound already modified onto the surface of the substrate to fix the metal onto the surface of the substrate.Type: ApplicationFiled: March 17, 2014Publication date: October 2, 2014Applicant: National Chung Cheng UniversityInventors: Lai-Kwan Chau, Wen-Hao Chen, Yen-Ta Tseng, Chin-Wei Wu, Chao-Wen Chen
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Patent number: 8192251Abstract: A pressure control system of a wafer polishing apparatus includes a main input air pressure regulator, an air branch conduit, a plurality of first pipes, a plurality of auxiliary air pressure regulators, a plurality of second pipes, and a plurality of air pressure controlling devices. The air branch conduit is connected with the main input air pressure regulator. The first pipes are connected between the air branch conduit and the auxiliary air pressure regulators. The second pipes are connected between the auxiliary air pressure regulators and the air pressure controlling devices. Accordingly, the air pressure controlling devices can control the pressure outputted from a polishing head of the wafer polishing apparatus to a surface of a wafer.Type: GrantFiled: July 8, 2009Date of Patent: June 5, 2012Assignee: Inotera Memories, Inc.Inventors: Yueh Cheng Hsueh, Chin Wei Wu, Sheng-Feng Hung
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Publication number: 20100203807Abstract: A pressure control system of a wafer polishing apparatus includes a main input air pressure regulator, an air branch conduit, a plurality of first pipes, a plurality of auxiliary air pressure regulators, a plurality of second pipes, and a plurality of air pressure controlling devices. The air branch conduit is connected with the main input air pressure regulator. The first pipes are connected between the air branch conduit and the auxiliary air pressure regulators. The second pipes are connected between the auxiliary air pressure regulators and the air pressure controlling devices. Accordingly, the air pressure controlling devices can control the pressure outputted from a polishing head of the wafer polishing apparatus to a surface of a wafer.Type: ApplicationFiled: July 8, 2009Publication date: August 12, 2010Inventors: Yueh Cheng Hsueh, Chin Wei Wu, Sheng-Feng Hung