Abstract: A cell module is provided. The cell module includes a first substrate; a second substrate disposed opposite to the first substrate; a cell unit disposed between the first substrate and the second substrate; a first thermosetting resin layer disposed between the cell unit and the first substrate; a crosslinked polymer layer disposed between the cell unit and the first thermosetting resin layer; and a second thermosetting resin layer disposed between the cell unit and the second substrate. The crosslinked polymer layer includes a crosslinked polymer, and the crosslinked polymer has a crosslinking degree of from 35.4 to 67.4%.

Abstract: An information handling system stylus self-cleans a magnet garage arrangement with a garage variable magnet having a first magnetic attraction when the stylus is proximate and information handling system garage and a second magnetic attraction when the stylus is distal the information handling system garage. The second magnetic attraction has a reduced attractive force at the stylus housing outer surface to discourage attraction of contaminants that might scratch or otherwise damage the housing.

Abstract: An electrode for a lithium-ion battery is provided, which comprises: a current collector; and an electrode material layer disposed on the current collector, wherein the electrode material layer comprises an anode material and a binder, the binder is pectin, its derivative or a combination thereof, and the anode material is selected from the group consisting of lithium vanadium oxide, lithium titanium oxide, lithium iron oxide, graphite, and a combination thereof. In addition, a lithium-ion battery comprising the aforesaid electrode is also provided.

Abstract: A self-referencing localized plasmon resonance sensing device and a system thereof are disclosed. The reference optical waveguide element is modified with a noble metal nanoparticle layer. The sensing optical waveguide element is modified with a noble metal nanoparticle layer, which is further modified with a recognition unit. The incident light is guided into the reference and the sensing optical waveguide elements to respectively generate localized plasmon resonance sensor signals. The reference and the sensing optical waveguide elements respectively have a calibration slope. The processor utilizes the calibration slopes to regulate the second difference generated by detecting with the sensing optical waveguide element. The processor utilizes a difference between the first difference, which is generated by detecting with the reference optical waveguide element, and the regulated second difference to obtain a sensor response.

Abstract: A method of fabricating a buried word line includes forming a trench in a substrate. Next, a deposition process is performed to form a silicon layer on a sidewall and a bottom at the inner side of the trench. After the deposition process, a gate dielectric layer is formed in the trench. Finally, a conductive layer is formed to fill in the trench.

Abstract: A semiconductor device includes a semiconductor substrate having a gate trench penetrating through an active area and a trench isolation region surrounding the active area. The gate trench exposes a sidewall of the active area and a sidewall of the trench isolation region. The sidewall of the trench isolation region includes a void. A first gate dielectric layer conformally covers the sidewall of the active area and the sidewall of the trench isolation region. The void in the sidewall of the trench isolation region is filled with the first gate dielectric layer. A second gate dielectric layer is grown on the sidewall of the active area. A gate is embedded in the gate trench.

Abstract: A method for fixing metal onto a surface of the substrate. The present method includes steps of: providing a substrate and a mercaptoalkylsilatrane compound; dissolving the mercaptoalkylsilatrane compound in a solvent; performing a condensation reaction of the substrate with and the dissolved mercaptoalkylsilatrane compound to complete the surface modification of the substrate; and performing a covalent bonding process to metal with the mercaptoalkylsilatrane compound already modified onto the surface of the substrate to fix the metal onto the surface of the substrate.

Abstract: A self-referencing localized plasmon resonance sensing device and a system thereof are disclosed. The reference optical waveguide element is modified with a noble metal nanoparticle layer. The sensing optical waveguide element is modified with a noble metal nanoparticle layer, which is further modified with a recognition unit. The incident light is guided into the reference and the sensing optical waveguide elements to respectively generate localized plasmon resonance sensor signals. The reference and the sensing optical waveguide elements respectively have a calibration slope. The processor utilizes the calibration slopes to regulate the second difference generated by detecting with the sensing optical waveguide element. The processor utilizes a difference between the first difference, which is generated by detecting with the reference optical waveguide element, and the regulated second difference to obtain a sensor response.

Abstract: A method for fixing metal onto a surface of the substrate. The present method includes steps of: providing a substrate and a mercaptoalkylsilatrane compound; dissolving the mercaptoalkylsilatrane compound in a solvent; performing a condensation reaction of the substrate with and the dissolved mercaptoalkylsilatrane compound to complete the surface modification of the substrate; and performing a covalent bonding process to metal with the mercaptoalkylsilatrane compound already modified onto the surface of the substrate to fix the metal onto the surface of the substrate.

Abstract: A pressure control system of a wafer polishing apparatus includes a main input air pressure regulator, an air branch conduit, a plurality of first pipes, a plurality of auxiliary air pressure regulators, a plurality of second pipes, and a plurality of air pressure controlling devices. The air branch conduit is connected with the main input air pressure regulator. The first pipes are connected between the air branch conduit and the auxiliary air pressure regulators. The second pipes are connected between the auxiliary air pressure regulators and the air pressure controlling devices. Accordingly, the air pressure controlling devices can control the pressure outputted from a polishing head of the wafer polishing apparatus to a surface of a wafer.

Abstract: A pressure control system of a wafer polishing apparatus includes a main input air pressure regulator, an air branch conduit, a plurality of first pipes, a plurality of auxiliary air pressure regulators, a plurality of second pipes, and a plurality of air pressure controlling devices. The air branch conduit is connected with the main input air pressure regulator. The first pipes are connected between the air branch conduit and the auxiliary air pressure regulators. The second pipes are connected between the auxiliary air pressure regulators and the air pressure controlling devices. Accordingly, the air pressure controlling devices can control the pressure outputted from a polishing head of the wafer polishing apparatus to a surface of a wafer.